公开(公告)号：US20200211994A1

公开(公告)日：2020-07-02

申请号：US16718256

申请日：2019-12-18

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： CHAO-MIN LAI ,  PING-CHIA WANG ,  HAN-CHIEH HSIEH ,  TANG-HUNG CHANG

IPC: H01L23/00 ,  H01L23/498

Abstract: A control device and a circuit board are provided. The control device can cooperate with the circuit board, and includes a ball grid array. The ball grid array includes a plurality of power balls and a plurality of ground balls, which are jointly arranged in a ball region. The power balls and the ground balls are respectively divided into a plurality of power ball groups and a plurality of ground ball groups. One of the ground ball groups includes two ground balls and is adjacent to a power ball group. A ball pitch between the two ground balls is greater than that between one of the power balls and one of the ground balls adjacent to each other. The circuit board includes a contact pad array corresponding to the ball grid array of the control device so that the control device can be disposed on the circuit board.

公开(公告)号：US20190385941A1

公开(公告)日：2019-12-19

申请号：US16371378

申请日：2019-04-01

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： CHAO-MIN LAI ,  HUNG-WEI WANG ,  PING-CHIA WANG

IPC: H01L23/498 ,  H01L23/00 ,  H05K1/11

Abstract: A control device and a circuit board are provided. The control device can operate with the circuit board, and includes a ball pad array. The ball pad array includes a plurality of power ball pads and a plurality of ground ball pads, which are arranged in the same pad arrangement region. At least a portion of the power ball pads and at least a portion of the ground ball pads are arranged in an alternate manner. The circuit board includes a solder pad array corresponding to the ball pad array of the control device so as to be disposed with the control device.

公开(公告)号：US20220278033A1

公开(公告)日：2022-09-01

申请号：US17679862

申请日：2022-02-24

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： HAN-CHIEH HSIEH ,  CHAO-MIN LAI ,  CHENG-CHEN HUANG ,  NAN-CHIN CHUANG

IPC: H01L23/498

Abstract: A package substrate and a chip package structure using the same are provided. The package substrate includes a laminated board including first to third wiring layers, a pad array, a plurality of ground conductive structures, and a plurality of power conductive structures. At least one of the ground (or power) conductive structures includes two first ground (or power) conductive posts and a second ground (or power) conductive post. The two first ground (or power) conductive posts and the second ground (or power) conductive post are arranged along a first direction, and the second ground (or power) conductive post is located between two orthographic projections of the two first ground (or power) conductive posts. Each of the ground conductive structures in a first column and each of the power conductive structures in a second column are offset from each other in a second direction.

公开(公告)号：US20180343739A1

公开(公告)日：2018-11-29

申请号：US15957246

申请日：2018-04-19

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： CHAO-MIN LAI ,  SHOU-TE YEN

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/115 ,  H05K1/0243 ,  H05K1/0248 ,  H05K1/113 ,  H05K1/114 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2201/10712 ,  H05K2201/10734

Abstract: An electronic apparatus and a circuit board thereof are provided. The electronic apparatus operates in cooperation with a packaged electronic component. The electronic apparatus includes a circuit board and a control device disposed on the circuit board. The circuit board includes a plurality of conductive vias passing therethrough, and the conductive vias includes a plurality of first conductive vias arranged respectively corresponding to the first contact pads of the packaged electronic component. The control device includes a signal contact array including a plurality of first signal contacts. When the packaged electronic component and the control device are respectively disposed on two opposite sides of the circuit board, the packaged electronic component and the control device at least partially overlap in a thickness direction of the circuit board, and the first signal contacts are respectively electrically connected to the first contact pads via the corresponding conductive vias.

公开(公告)号：US20170367175A1

公开(公告)日：2017-12-21

申请号：US15461939

申请日：2017-03-17

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： CHAO-MIN LAI

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0216 ,  G06F1/1656 ,  G06F1/182 ,  H01L23/552 ,  H01L2924/3025 ,  H05K1/02 ,  H05K1/0203 ,  H05K7/20445 ,  H05K9/0024 ,  H05K9/0032 ,  H05K9/0088 ,  H05K2201/066 ,  H05K2201/10371

Abstract: An electronic apparatus and heat dissipation and EMI shielding structure thereof are provided. The electronic apparatus includes a substrate, at least one chip disposed on the substrate, and the heat dissipation and EMI shielding structure. The heat dissipation and EMI shielding structure covers the chip and includes a shielding frame and a heat dissipation element. The shielding frame has an opening to expose the chip, and the heat dissipation element is disposed on the shielding frame and covers the opening. The conjunction of the shielding frame and the heat dissipation element can protect the chip from being interfered with electromagnetic waves, and the heat generated by the chip can be dissipated by the heat dissipation element.