公开(公告)号：US11289652B2

公开(公告)日：2022-03-29

申请号：US16255596

申请日：2019-01-23

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok

IPC: H01L51/00 ,  H01L51/56 ,  H01L51/50 ,  H01L27/32 ,  H01L51/52

Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.

公开(公告)号：US11265992B2

公开(公告)日：2022-03-01

申请号：US17136918

申请日：2020-12-29

Applicant: X Display Company Technology Limited

Inventor： Matthew Meitl ,  Ronald S. Cok ,  Christopher Bower

IPC: H05B45/52 ,  H01L27/15 ,  G09G3/34 ,  H01L21/66 ,  H01L33/62 ,  H01L27/02 ,  H01L23/52 ,  H05B45/50 ,  H05B45/56

Abstract: An LED component comprises a plurality of fused light-emitting diodes (LEDs) (e.g., micro-transfer printable or micro-transfer printed LEDs). Each fused LED comprises an LED with first and second LED electrical connections for providing power to the LED and a fuse with first and second fuse electrical connections. The first LED electrical connection is electrically connected to the first electrode. The first fuse electrical connection is electrically connected to the second LED electrical connection and the second fuse electrical connection is electrically connected to the second electrode. A fused LED source wafer comprises an LED wafer having a patterned sacrificial layer forming an array of sacrificial portions separated by anchors and a plurality of fused LED components, each fused LED component disposed entirely on or over a corresponding sacrificial portion. A light-emission system comprises a system substrate and a plurality of fused LED components disposed on or over the system substrate.

公开(公告)号：US20210225815A1

公开(公告)日：2021-07-22

申请号：US17203314

申请日：2021-03-16

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L25/075 ,  G09G3/32 ,  H01L33/38 ,  H01L23/482 ,  H01L23/538 ,  H05B45/50 ,  G02F1/167 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  G02B26/04 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L27/15 ,  F21V9/08 ,  H01L33/58

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US20210120650A1

公开(公告)日：2021-04-22

申请号：US17136918

申请日：2020-12-29

Applicant: X Display Company Technology Limited

Inventor： Matthew Meitl ,  Ronald S. Cok ,  Christopher Bower

IPC: H05B45/50 ,  H01L27/15 ,  H01L21/66 ,  H01L33/62 ,  H01L27/02 ,  H01L23/52

Abstract: An LED component comprises a plurality of fused light-emitting diodes (LEDs) (e.g., micro-transfer printable or micro-transfer printed LEDs). Each fused LED comprises an LED with first and second LED electrical connections for providing power to the LED and a fuse with first and second fuse electrical connections. The first LED electrical connection is electrically connected to the first electrode. The first fuse electrical connection is electrically connected to the second LED electrical connection and the second fuse electrical connection is electrically connected to the second electrode. A fused LED source wafer comprises an LED wafer having a patterned sacrificial layer forming an array of sacrificial portions separated by anchors and a plurality of fused LED components, each fused LED component disposed entirely on or over a corresponding sacrificial portion. A light-emission system comprises a system substrate and a plurality of fused LED components disposed on or over the system substrate.

公开(公告)号：US10782002B2

公开(公告)日：2020-09-22

申请号：US15796259

申请日：2017-10-27

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok ,  Brent Fisher

IPC: F21V7/04 ,  F21V19/00 ,  H01L25/075 ,  F21Y113/10 ,  F21Y115/10 ,  G02B19/00 ,  H01L33/58 ,  H01L33/60

Abstract: A light-emitting diode (LED) optical component comprises a component substrate and an disposed on the component substrate. The LED emits light when provided with electrical power. An optical element is disposed at least partly in contact with the component substrate such that at least a portion of the emitted light is incident on the optical element. A second optical element can optionally be disposed between the LED and the component substrate or on a side of the component substrate opposite the LED. An LED optical system includes a system substrate on which one or more LED optical components are disposed. The system substrate can be or include one or more optical elements.

公开(公告)号：US11990438B2

公开(公告)日：2024-05-21

申请号：US17984748

申请日：2022-11-10

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H01L21/48 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L24/11 ,  H01L24/08 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H05K1/112 ,  H05K3/3436 ,  H01L21/4803 ,  H01L21/4846 ,  H01L2224/1144 ,  H01L2224/11466 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/1357 ,  H01L2224/1403 ,  H01L2224/1412 ,  H01L2224/1418 ,  H01L2224/16227 ,  H01L2224/1624 ,  H01L2224/17107 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1304 ,  H05K3/305 ,  H05K2201/09409 ,  H05K2201/09472 ,  H05K2201/0979 ,  H05K2201/10143 ,  H01L2924/12041 ,  H01L2924/00012 ,  H01L2924/12044 ,  H01L2924/00012 ,  H01L2924/12043 ,  H01L2924/00012 ,  H01L2924/1304 ,  H01L2924/00012

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US11854788B2

公开(公告)日：2023-12-26

申请号：US17203314

申请日：2021-03-16

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L25/075 ,  G09G3/32 ,  H01L33/38 ,  H01L23/482 ,  H01L23/538 ,  G02F1/167 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  G02B26/04 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L27/15 ,  F21V9/08 ,  H01L33/58 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13 ,  H01L33/20 ,  H01L33/40

CPC classification number: H01L25/0753 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/167 ,  H01L27/156 ,  H01L33/36 ,  H01L33/38 ,  H01L33/385 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L33/20 ,  H01L33/405 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US11472171B2

公开(公告)日：2022-10-18

申请号：US14804077

申请日：2015-07-20

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg

IPC: H01L21/683 ,  B41K3/12 ,  B41F16/00 ,  H01L23/00 ,  H01L21/3065 ,  H01L21/52 ,  H01L21/56 ,  H01L23/29 ,  H01L21/67 ,  B25J15/00 ,  H01L23/31 ,  H01L25/00 ,  H01L31/18 ,  B41K3/04

Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

公开(公告)号：US20220216413A1

公开(公告)日：2022-07-07

申请号：US17671752

申请日：2022-02-15

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok

IPC: H01L51/00 ,  H01L51/56 ,  H01L51/50 ,  H01L27/32 ,  H01L51/52

Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.

公开(公告)号：US20210384290A1

公开(公告)日：2021-12-09

申请号：US17405323

申请日：2021-08-18

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  Carl Prevatte ,  Ronald S. Cok

IPC: H01L27/32 ,  H01L27/15 ,  H01L27/146 ,  H01L25/075

Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.