公开(公告)号：US12249532B2

公开(公告)日：2025-03-11

申请号：US18140427

申请日：2023-04-27

Applicant: X Display Company Technology Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Salvatore Bonafede ,  Brook Raymond ,  Carl Ray Prevatte, Jr.

IPC: H01L21/683 ,  B41F16/00 ,  H01L21/67 ,  H01L33/00 ,  H01L27/15

Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

公开(公告)号：US20240213238A1

公开(公告)日：2024-06-27

申请号：US18432677

申请日：2024-02-05

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl

IPC: H01L25/00 ,  H01L21/48 ,  H01L21/66 ,  H01L21/683 ,  H01L23/00 ,  H01L23/538 ,  H01L25/075 ,  H01L25/16 ,  H01L25/18 ,  H01Q1/22 ,  H01Q3/26 ,  H01Q21/00

CPC classification number: H01L25/50 ,  H01L21/6835 ,  H01L22/14 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L25/167 ,  H01L25/18 ,  H01L21/485 ,  H01L22/20 ,  H01L23/5382 ,  H01L2221/68368 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/24137 ,  H01Q1/2283 ,  H01Q3/267 ,  H01Q21/0087

Abstract: The disclosed technology relates generally to designs and methods of assembling devices utilizing compound micro-assembly. Functional elements are micro-assembled to form an array of individual micro-systems on an intermediate substrate, then the microsystems are transferred (one or more at a time) to a destination or device substrate. For example, for a display device, each micro-system may be an individual pixel containing red, blue, and green micro LEDs and a silicon drive circuit. An array of pixels may be formed by micro-transfer printing functional elements onto the intermediate substrate and electrically connecting them via fine lithography, then the individual pixels may be micro-transfer printed onto the destination substrate.

公开(公告)号：US20230343630A1

公开(公告)日：2023-10-26

申请号：US18140427

申请日：2023-04-27

Applicant: X Display Company Technology Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Salvatore Bonafede ,  Brook Raymond ,  Carl Ray Prevatte, Jr.

IPC: H01L21/683 ,  H01L33/00 ,  H01L21/67 ,  B41F16/00

CPC classification number: H01L21/6835 ,  B41F16/00 ,  H01L21/67144 ,  H01L33/0093 ,  H01L33/0095 ,  H01L27/15 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381

Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

公开(公告)号：US11670533B2

公开(公告)日：2023-06-06

申请号：US16921556

申请日：2020-07-06

Applicant: X Display Company Technology Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Salvatore Bonafede ,  Brook Raymond ,  Carl Ray Prevatte, Jr.

IPC: H01L29/18 ,  H01L21/683 ,  B41F16/00 ,  H01L21/67 ,  H01L33/00 ,  H01L27/15

CPC classification number: H01L21/6835 ,  B41F16/00 ,  H01L21/67144 ,  H01L33/0093 ,  H01L33/0095 ,  H01L27/15 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381

Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

公开(公告)号：US20230146788A1

公开(公告)日：2023-05-11

申请号：US17984748

申请日：2022-11-10

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H05K3/34 ,  H05K1/11

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H05K3/3436 ,  H01L24/08 ,  H05K1/112 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/1357 ,  H01L2224/1418 ,  H01L2224/17107 ,  H01L2224/1144 ,  H05K3/305

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US11552034B2

公开(公告)日：2023-01-10

申请号：US16702398

申请日：2019-12-03

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H05K3/34 ,  H05K1/11 ,  H05K3/30

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US11233170B2

公开(公告)日：2022-01-25

申请号：US16777192

申请日：2020-01-30

Applicant: X Display Company Technology Limited

Inventor： Brook Raymond ,  Christopher Andrew Bower ,  Matthew Meitl ,  Ronald S. Cok

IPC: H01L29/32 ,  H01L33/00 ,  H01L33/32 ,  G03F7/20 ,  G03F7/00

Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.

公开(公告)号：US10749093B2

公开(公告)日：2020-08-18

申请号：US16660776

申请日：2019-10-22

Applicant: X Display Company Technology Limited

Inventor： Matthew Meitl ,  Tanya Yvette Moore ,  Ronald S. Cok ,  Salvatore Bonafede ,  Brook Raymond ,  Christopher Andrew Bower ,  Carl Ray Prevatte, Jr.

IPC: H01L23/00 ,  H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L41/047 ,  H01L41/083 ,  H01L25/065 ,  H01L23/538

Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.

公开(公告)号：US20200243467A1

公开(公告)日：2020-07-30

申请号：US16778964

申请日：2020-01-31

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H05K1/11 ,  H05K3/34 ,  H05K3/30

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US11990438B2

公开(公告)日：2024-05-21

申请号：US17984748

申请日：2022-11-10

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H01L21/48 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L24/11 ,  H01L24/08 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H05K1/112 ,  H05K3/3436 ,  H01L21/4803 ,  H01L21/4846 ,  H01L2224/1144 ,  H01L2224/11466 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/1357 ,  H01L2224/1403 ,  H01L2224/1412 ,  H01L2224/1418 ,  H01L2224/16227 ,  H01L2224/1624 ,  H01L2224/17107 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1304 ,  H05K3/305 ,  H05K2201/09409 ,  H05K2201/09472 ,  H05K2201/0979 ,  H05K2201/10143 ,  H01L2924/12041 ,  H01L2924/00012 ,  H01L2924/12044 ,  H01L2924/00012 ,  H01L2924/12043 ,  H01L2924/00012 ,  H01L2924/1304 ,  H01L2924/00012

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.