公开(公告)号：US08232614B1

公开(公告)日：2012-07-31

申请号：US13042733

申请日：2011-03-08

Applicant: Chia-Hua Chu ,  Kuei-Sung Chang ,  Chung-Hsien Lin ,  Chia-Ming Hung ,  Jung-Huei Peng ,  Yi Heng Tsai ,  Jiou-Kang Lee

Inventor： Chia-Hua Chu ,  Kuei-Sung Chang ,  Chung-Hsien Lin ,  Chia-Ming Hung ,  Jung-Huei Peng ,  Yi Heng Tsai ,  Jiou-Kang Lee

IPC: H01L21/52

CPC classification number: B81B7/007 ,  B81B2207/096

Abstract: A package system includes a first substrate structure including at least one first conductive structure that is disposed over a first substrate. A second substrate structure includes a second substrate. The second substrate structure is bonded with the first substrate structure. The at least one first conductive structure is electrically coupled with the second substrate through at least one germanium-containing layer.

Abstract translation: 封装系统包括第一衬底结构，其包括设置在第一衬底上的至少一个第一导电结构。 第二衬底结构包括第二衬底。 第二衬底结构与第一衬底结构结合。 所述至少一个第一导电结构通过至少一个含锗层与所述第二衬底电耦合。

公开(公告)号：US20120014056A1

公开(公告)日：2012-01-19

申请号：US12805185

申请日：2010-07-16

Applicant: Jinsaun Chen ,  Kuo Kang Lee ,  Tzu Chun Liang

Inventor： Jinsaun Chen ,  Kuo Kang Lee ,  Tzu Chun Liang

IPC: G06F1/16

CPC classification number: G06F1/1632 ,  F16M11/08 ,  F16M13/00

Abstract: A docking station for connection between one or more portable electronic devices and an external device for networks. The docking station includes a docking surface having one or more connectors adapted to be connected to the portable electronic devices, the docking surface rotating with respect to a base section.

Abstract translation: 用于连接一个或多个便携式电子设备的对接站和用于网络的外部设备。 对接站包括具有适于连接到便携式电子设备的一个或多个连接器的对接表面，该对接表面相对于基座部分旋转。

公开(公告)号：US08053336B2

公开(公告)日：2011-11-08

申请号：US12610873

申请日：2009-11-02

Applicant: Ting-Hau Wu ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Shang-Ying Tsai ,  Jung-Huei Peng

Inventor： Ting-Hau Wu ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Shang-Ying Tsai ,  Jung-Huei Peng

IPC: H01L21/00

CPC classification number: B81C1/00666 ,  H01L23/562 ,  H01L24/16 ,  H01L24/31 ,  H01L24/48 ,  H01L24/95 ,  H01L29/0657 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83365 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/01031 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of forming an integrated circuit structure including providing a wafer comprising a front surface and a back surface, wherein the wafer comprises a chip; forming an opening extending from the back surface into the chip; filling an organic material in the opening, wherein substantially no portion of the organic material is outside of the opening and on the back surface of the wafer; and baking the organic material to cause a contraction of the organic material.

Abstract translation: 一种形成集成电路结构的方法，包括提供包括前表面和后表面的晶片，其中所述晶片包括芯片; 形成从后表面延伸到芯片中的开口; 在开口中填充有机材料，其中基本上没有部分有机材料在晶片的开口和背面之外; 并烘烤有机材料以引起有机材料的收缩。

公开(公告)号：US20110263106A1

公开(公告)日：2011-10-27

申请号：US13176548

申请日：2011-07-05

Applicant: Jiou-Kang Lee ,  Chun-Ren "Sean" Cheng ,  Shang-Ying Tsai ,  Ting-Hau Wu ,  Hsiang-Fu "Benior" Chen

Inventor： Jiou-Kang Lee ,  Chun-Ren "Sean" Cheng ,  Shang-Ying Tsai ,  Ting-Hau Wu ,  Hsiang-Fu "Benior" Chen

IPC: H01L21/82

CPC classification number: B81C1/00111 ,  B81B2201/042 ,  B81B2203/0392 ,  B81B2203/04 ,  B81B2207/056 ,  B81C2201/019 ,  H01L2924/0002 ,  H01L2924/00

Abstract: One embodiment is a method of forming a circuit structure. The method comprises forming a first amorphous layer over a substrate; forming a first glue layer over and adjoining the first amorphous layer; forming a second amorphous layer over and adjoining the first glue layer; and forming a plurality of posts separated from each other by removing a first portion of the first amorphous layer and a first portion of the second amorphous layer. At least some of the plurality of posts each comprises a second portion of the first amorphous layer, a first portion of the first glue layer, and a second portion of the second amorphous layer.

Abstract translation: 一个实施例是形成电路结构的方法。 该方法包括在衬底上形成第一非晶层; 在所述第一非晶层上方形成第一胶合层; 在所述第一胶层上形成第二非晶层; 以及通过去除所述第一非晶层的第一部分和所述第二非晶层的第一部分来形成彼此分离的多个柱。 所述多个柱中的至少一些各自包括所述第一非晶层的第二部分，所述第一胶合层的第一部分和所述第二非晶层的第二部分。

公开(公告)号：US20110215107A1

公开(公告)日：2011-09-08

申请号：US12719196

申请日：2010-03-08

Applicant: Tzu-Kang LEE

Inventor： Tzu-Kang LEE

IPC: A47G19/22

CPC classification number: A47G19/22

Abstract: A liquid container having a tubular wall or handle formed integral with the peripheral wall of the container body thereof and a suction hole defined in the tubular wall or handle in communication with the holding space surrounded by the container body so that the user can drink the liquid from the container body with the mouth through the suction hole.

Abstract translation: 一种液体容器，其具有与其容器主体的周壁形成一体的管状壁或手柄，以及限定在管状壁或手柄中的吸入孔，其与由容器主体包围的保持空间连通，使得使用者可以饮用液体 从集装箱体通过吸孔口。

公开(公告)号：US20110151927A1

公开(公告)日：2011-06-23

申请号：US12982465

申请日：2010-12-30

Applicant: Han Chang LIN ,  Chen Lung LIU ,  Kuei Kang LEE

Inventor： Han Chang LIN ,  Chen Lung LIU ,  Kuei Kang LEE

IPC: H04M1/00 ,  G06T1/00

CPC classification number: G06F13/385

Abstract: The present invention provides a serial transmission interface of a portable electronic device. The portable electronic device includes a control module, a display module and an image sensing module. The serial transmission interface includes a first line group coupled to between the control module and the image sensing module, and includes a second line group coupled to between the control module, the display module and the image sensing module; wherein when the control module sets the image sensing module to a master mode through the first line group, the image sensing module directly transmits captured image data to the display module through the second line group. The present invention further provides a portable electronic device and a data transmission method of the serial transmission interface of a portable electronic device.

Abstract translation: 本发明提供便携式电子设备的串行传输接口。 便携式电子设备包括控制模块，显示模块和图像感测模块。 串行传输接口包括耦合到控制模块和图像感测模块之间的第一线组，并且包括耦合到控制模块，显示模块和图像感测模块之间的第二线组; 其中当所述控制模块通过所述第一线组将所述图像感测模块设置为主模式时，所述图像感测模块通过所述第二线路组将所捕获的图像数据直接发送到所述显示模块。 本发明还提供一种便携式电子设备的串行传输接口的便携式电子设备和数据传输方法。

公开(公告)号：US07923379B2

公开(公告)日：2011-04-12

申请号：US12347250

申请日：2008-12-31

Applicant: Jiou-Kang Lee ,  Ting-Hau Wu ,  Shang-Ying Tsai ,  Jung-Huei Peng ,  Chun-Ren Cheng

Inventor： Jiou-Kang Lee ,  Ting-Hau Wu ,  Shang-Ying Tsai ,  Jung-Huei Peng ,  Chun-Ren Cheng

IPC: H01L21/31

CPC classification number: B81C1/00071 ,  B81B2201/052 ,  B81B2201/058 ,  H01L21/76898

Abstract: A method of forming an integrated circuit structure includes forming an opening in a substrate, with the opening extending from a top surface of the substrate into the substrate. The opening is filled with a filling material until a top surface of the filling material is substantially level with the top surface of the substrate. A device is formed over the top surface of the substrate, wherein the device includes a storage opening adjoining the filling material. A backside of the substrate is grinded until the filling material is exposed. The filling material is removed from the channel until the storage opening of the device is exposed.

Abstract translation: 形成集成电路结构的方法包括在衬底中形成开口，其中开口从衬底的顶表面延伸到衬底中。 开口填充有填充材料，直到填充材料的顶表面基本上与基板的顶表面平齐。 在衬底的顶表面上形成器件，其中该器件包括与填充材料相邻的存储开口。 研磨衬底的背面，直到填充材料暴露。 将填充材料从通道中取出直到设备的存储开口露出。

公开(公告)号：US20110049684A1

公开(公告)日：2011-03-03

申请号：US12875956

申请日：2010-09-03

Applicant: Kang Lee ,  Thomas Forrester ,  Eric Gans ,  Kevin Carl Walter ,  Tomasz Jannson

Inventor： Kang Lee ,  Thomas Forrester ,  Eric Gans ,  Kevin Carl Walter ,  Tomasz Jannson

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L23/295 ,  H01L23/5329 ,  H01L23/552 ,  H01L23/573 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit die comprises a device layer comprising a plurality of semiconductor devices; an interconnect layer comprising a plurality of interconnect paths connecting the semiconductor devices and embedded in a dielectric material; and a plurality of hard nanoparticles embedded in the dielectric material of the interconnect layer, the hard nanoparticles having a hardness greater than a hardness of the dielectric material and of a hardness of the interconnect paths.

Abstract translation: 集成电路管芯包括包括多个半导体器件的器件层; 互连层，包括连接半导体器件并嵌入电介质材料中的多个互连路径; 以及嵌入在互连层的电介质材料中的多个硬质纳米粒子，该硬质纳米粒子的硬度大于介电材料的硬度和互连路径的硬度。

公开(公告)号：US07781325B2

公开(公告)日：2010-08-24

申请号：US12271737

申请日：2008-11-14

Applicant: Kang Lee ,  Sang Jeen Hong

Inventor： Kang Lee ,  Sang Jeen Hong

IPC: H01L21/44

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/11825 ,  H01L2224/11831 ,  H01L2224/119 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/00014

Abstract: Copper pillar tin bump on semiconductor chip comprises a copper layer composed on chip and a tin layer entirely wrapping whole outer surface of said copper layer. A method for forming of the copper pillar tin bump on semiconductor chip comprises: composing the first copper layer on said chip; applying photoresist to said first copper layer, exposing and developing a part of said photoresist, composing the copper pillar layer at the developed part of photoresist, composing the upper tin layer, removing said photoresist, removing said the first copper layer except disposing place of copper pillar layer, composing side tin layer. The minute pattern makes it possible to form a high density packaging by reducing a pitch of copper pillar tin bump. Signal delay can be reduced by low electric resistance, and underfill can be easily soaked.

Abstract translation: 半导体芯片上的铜柱锡凸块包括由芯片构成的铜层和完全包裹所述铜层整个外表面的锡层。 在半导体芯片上形成铜柱锡凸块的方法包括：在所述芯片上形成第一铜层; 对所述第一铜层施加光致抗蚀剂，曝光和显影所述光致抗蚀剂的一部分，构成在光刻胶的显影部分处的铜柱层，构成上锡层，去除所述光致抗蚀剂，除去所述第一铜层，除了铜的放置位置 柱层，组成侧锡层。 微型图案使得可以通过减小铜柱锡凸块的间距来形成高密度封装。 信号延迟可以通过低电阻降低，底部填充可以容易地浸泡。

公开(公告)号：US07753685B2

公开(公告)日：2010-07-13

申请号：US12323346

申请日：2008-11-25

Applicant: Kang Lee ,  Thomas Forrester ,  Tomasz Jannson ,  Andrew Kostrzewski ,  Eugene Levin ,  Gajendra Savant

Inventor： Kang Lee ,  Thomas Forrester ,  Tomasz Jannson ,  Andrew Kostrzewski ,  Eugene Levin ,  Gajendra Savant

IPC: H01R33/00

CPC classification number: H01R13/625 ,  A41D1/002 ,  H01R4/04 ,  H01R4/06 ,  H01R12/592 ,  H01R13/24 ,  H01R13/5219 ,  H01R13/6277 ,  H01R39/64

Abstract: An entirely wearable electrical connector for power/data connectivity. The principal element of a modular network is the wearable electrical connector, which is integrated into a personal area network with USB compatibility. Several wearable connector embodiments are disclosed. An enhancement to the wearable connector includes OSI Layer 2 (and potentially Layer 3) functionality. Data Link layer functionality is supported by including electronic serial numbers at wearable snap-connector points.

Abstract translation: 用于电源/数据连接的完全可佩戴的电连接器。 模块化网络的主要元件是可佩戴的电连接器，它集成到具有USB兼容性的个人区域网络中。 公开了几种可穿戴式连接器实施例。 对可穿戴连接器的增强包括OSI第2层（和潜在的第3层）功能。 通过在可穿戴卡扣连接点上包含电子序列号来支持数据链路层功能。