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    Electronic array and chip package
    91.
    发明授权
    Electronic array and chip package 有权
    电子阵列和芯片封装

    公开(公告)号：US09111772B1

    公开(公告)日：2015-08-18

    申请号：US14166880

    申请日：2014-01-29

    Applicant: Infineon Technologies AG

    Inventor： Volker Strutz ,  Horst Theuss ,  Chee Voon Tan ,  Hui Teng Wang

    IPC: H01L29/06

    CPC classification number: H01L29/0649 ,  H01L24/32 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2224/45099

    Abstract: An electronic array may include a first electronic component which has a first operation voltage, a second electronic component which has a second operation voltage, wherein the second operation voltage is different from the first operation voltage and wherein the first electronic component and the second electronic component are arranged over each other, an isolation layer between the first electronic component and the second electronic component, wherein the isolation layer electrically isolates the first electronic component from the second electronic component, at least one connection layer formed at least partially between the isolation layer and the first electronic component or between the isolation layer and the second electronic component, wherein the connection layer includes a first portion and a second portion, wherein the first portion and the second portion each extend from the corresponding electronic component to the isolation layer, wherein the first portion includes an electrically isolating material which fixes the isolation layer to the corresponding electronic component and wherein the second portion includes an electrically conductive material which electrically couples the corresponding electronic component to the isolation layer.

    Abstract translation: 电子阵列可以包括具有第一操作电压的第一电子部件，具有第二操作电压的第二电子部件，其中第二操作电压不同于第一操作电压，并且其中第一电子部件和第二电子部件 在第一电子部件和第二电子部件之间布置有隔离层，其中隔离层将第一电子部件与第二电子部件电隔离，至少一个连接层至少部分地形成在隔离层和 所述第一电子部件或所述隔离层和所述第二电子部件之间，其中所述连接层包括第一部分和第二部分，其中所述第一部分和所述第二部分各自从相应的电子部件延伸到所述隔离层，其中， 第一部分包括a n隔离材料，其将隔离层固定到相应的电子部件，并且其中第二部分包括将相应的电子部件电耦合到隔离层的导电材料。

    SEMICONDUCTOR DEVICE FOR EMITTING FREQUENCY-ADJUSTED INFRARED LIGHT
    92.
    发明申请
    SEMICONDUCTOR DEVICE FOR EMITTING FREQUENCY-ADJUSTED INFRARED LIGHT 有权
    用于发射频率调制红外光的半导体器件

    公开(公告)号：US20150102372A1

    公开(公告)日：2015-04-16

    申请号：US14052962

    申请日：2013-10-14

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： Alfons Dehe ,  Stefan Kolb ,  Horst Theuss ,  Dirk Meinhold

    IPC: H01L33/44 ,  H01L33/48

    CPC classification number: H01L33/44 ,  H01L33/58

    Abstract: A semiconductor device for emitting frequency-adjusted infrared light includes a lateral emitter structure and a lateral filter structure. The lateral emitter structure is configured to emit infrared light with an emitter frequency distribution. Further, the lateral filter structure is configured to filter the infrared light emitted by the lateral emitter structure so that frequency-adjusted infrared light is provided with an adjusted frequency distribution. The frequency range of the adjusted frequency distribution is narrower than a frequency range of the emitter frequency distribution. Further, a lateral air gap is located between the lateral emitter structure and the lateral filter structure.

    Abstract translation: 用于发射频率调节的红外光的半导体器件包括侧向发射极结构和侧向滤波器结构。 横向发射极结构被配置为发射具有发射极频率分布的红外光。 此外，横向滤波器结构被配置为对由横向发射器结构发射的红外光进行滤波，使得频率调节的红外光具有调整的频率分布。 调整频率分布的频率范围比发射体频率分布的频率范围窄。 此外，横向气隙位于横向发射器结构和侧向过滤器结构之间。

    Pressure Sensor Package with Integrated Sealing
    93.
    发明申请
    Pressure Sensor Package with Integrated Sealing 有权
    压力传感器封装，集成密封

    公开(公告)号：US20150090042A1

    公开(公告)日：2015-04-02

    申请号：US14039706

    申请日：2013-09-27

    Applicant: Infineon Technologies AG

    Inventor： Mathias Vaupel ,  Horst Theuss ,  Helmut Wietschorke

    IPC: G01L9/00 ,  B81C1/00 ,  B81B7/00

    CPC classification number: G01L9/0045 ,  B81B7/0048 ,  B81B2201/0264 ,  B81C1/00325 ,  G01L9/0042 ,  G01L9/0054 ,  G01L19/0007 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

    Abstract: A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side of the die. The die is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The package further includes an electrical conductor connecting the terminal to the lead, a molding compound encasing the electrical conductor, the die and part of the lead, a cavity in the molding compound exposing the diaphragm, and a sealing ring disposed on a side of the molding compound with the cavity. The sealing ring surrounds the cavity and has a lower elastic modulus than the molding compound. Alternatively, the sealing ring can be a ridge of the molding compound that protrudes from the side of the molding compound with the cavity and surrounds the cavity. A package manufacturing method is also provided.

    Abstract translation: 压力传感器封装包括引线和与引线间隔开的半导体管芯，并且包括设置在管芯第一侧的端子和隔膜。 模具被配置成响应于横跨隔膜的压差而改变电参数。 该封装还包括将端子连接到引线的电导体，封装电导体，模具和引线的一部分的模制化合物，暴露隔膜的模制化合物中的空腔，以及设置在该导体的侧面上的密封环 与空腔成型。 密封环围绕腔体并具有比模塑料更低的弹性模量。 或者，密封环可以是模制化合物的脊，其从模制化合物与空腔的侧面突出并且包围空腔。 还提供了一种封装制造方法。

    APPARATUS HAVING A BACK-BIAS MAGNET AND A SEMICONDUCTOR CHIP ELEMENT
    100.
    发明申请
    APPARATUS HAVING A BACK-BIAS MAGNET AND A SEMICONDUCTOR CHIP ELEMENT 有权
    具有背偏磁体和半导体芯片元件的装置

    公开(公告)号：US20130082340A1

    公开(公告)日：2013-04-04

    申请号：US13629659

    申请日：2012-09-28

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： Klaus Elian ,  Georg Ernst ,  Horst Theuss

    IPC: H01L27/22 ,  H01L43/12

    CPC classification number: G01R33/072 ,  G01D5/147 ,  G01R33/06 ,  G01R33/091

    Abstract: An apparatus may include a back-bias magnet; and a semiconductor chip element; wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element.

    Abstract translation: 设备可以包括背偏磁体; 和半导体芯片元件; 其中所述半导体芯片元件具有用于测量磁场强度的传感器; 并且其中在所述背偏压磁体的接触侧和所述半导体芯片元件的接触侧上形成接触表面，并且其中所述半导体芯片元件的接触侧具有一个或多个结构，使得所述背面的接触表面 -bias磁体以对应于半导体芯片元件的结构的方式成形。

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