Direct sealing of glass microstructures
    92.
    发明授权
    Direct sealing of glass microstructures 有权
    直接密封玻璃微结构

    公开(公告)号:US09527724B2

    公开(公告)日:2016-12-27

    申请号:US13989897

    申请日:2011-11-28

    Abstract: Embodiments of methods for sealing a glass microstructure assembly comprise providing one or more side retainer members on a base plate adjacent the glass microstructure assembly, the side retainer members having a height less than an uncompressed height defined by the glass microstructure assembly. The methods also comprise compressing the glass microstructure assembly via a load bearing top plate in intimate contact with the top glass layer while heating the glass microstructure assembly and the top plate to a glass sealing temperature, the glass sealing temperature being a temperature sufficient to make glass viscous, wherein the glass microstructure assembly is compressed until the load bearing top plate contacts the side retainer members, and wherein the lower surface of the top plate maintains adhesion to the upper surface of the top glass layer at the glass sealing temperature while the load bearing plate is supported by the side retainer members.

    Abstract translation: 用于密封玻璃微结构组件的方法的实施例包括在邻近玻璃微结构组件的基板上提供一个或多个侧面保持器构件,侧面保持构件的高度小于由玻璃微结构组件限定的未压缩高度。 所述方法还包括通过与顶部玻璃层紧密接触的承载顶板压缩玻璃微结构组件,同时将玻璃微结构组件和顶板加热至玻璃密封温度,玻璃密封温度为足以制备玻璃的温度 粘性,其中玻璃微结构组件被压缩直到承载顶板接触侧保持器构件,并且其中顶板的下表面在玻璃密封温度下保持与顶部玻璃层的上表面的粘附,而承载 板由侧保持构件支撑。

    MICROFLUIDIC DEVICE AND A METHOD FOR PREPARING THE MICROFLUIDIC DEVICE FROM A PHOTOSENSITIVE ELEMENT
    94.
    发明申请
    MICROFLUIDIC DEVICE AND A METHOD FOR PREPARING THE MICROFLUIDIC DEVICE FROM A PHOTOSENSITIVE ELEMENT 审中-公开
    微流体装置和从感光元件制备微流体装置的方法

    公开(公告)号:US20160089672A1

    公开(公告)日:2016-03-31

    申请号:US14867402

    申请日:2015-09-28

    Abstract: A microfluidic device is formed from a cover member and a microfluidic precursor that is prepared from a photosensitive element. The photosensitive element is a solid layer of a photopolymerizable composition that includes at least a binder, a monomer, and a photoinitiator. A method for forming the microfluidic device from the photosensitive element includes imagewise exposing the photopolymerizable layer to actinic radiation through a mask and treating to form a relief surface having microstructures or features, such as one or more channels and one or more chambers, that are suitable for use in the microfluidic device. The method provides microstructures that can be formed to have different dimensions that provide particular advantages for a microfluidic device that is operated by degas-driven flow to transport a fluid through the microstructures.

    Abstract translation: 微流体装置由覆盖构件和由感光元件制备的微流体前体形成。 感光元件是至少包括粘合剂,单体和光引发剂的可光聚合组合物的固体层。 用于从感光元件形成微流体装置的方法包括将可光聚合层成像曝光通过掩模的光化辐射,并进行处理以形成具有微结构或特征的浮雕表面,例如一个或多个通道和一个或多个室, 用于微流体装置。 该方法提供了可以形成为具有不同尺寸的微结构,其为通过脱气驱动的流动来操作以将流体输送通过微结构的微流体装置提供特别的优点。

    Device and method for manufacturing the same
    95.
    发明授权
    Device and method for manufacturing the same 有权
    装置及其制造方法

    公开(公告)号:US09162224B2

    公开(公告)日:2015-10-20

    申请号:US13693349

    申请日:2012-12-04

    Inventor: Tomohiro Saito

    Abstract: It is an object of this invention to prevent a resistor material and an electrode material from diffusing and suppress variation in electric resistance. In a device including a plurality of metal layers of different compositions on a substrate and a second structure made of a material, such as glass paste, requiring a firing process at the time of formation, an intermediate layer is formed between a first metal layer and a second metal layer forming the first structure. The intermediate layer is of an intermetallic compound including one or more metallic elements in the first metal layer and one or more metallic elements in the second metal layer. The melting point of the intermetallic compound is higher than a firing temperature when the second structure is formed, and the intermetallic compound is produced at a temperature higher than the firing temperature for forming the second structure.

    Abstract translation: 本发明的目的是防止电阻材料和电极材料扩散并抑制电阻的变化。 在包括在基板上具有不同组成的多个金属层的装置和由形成材料的诸如玻璃浆料的第二结构之间需要在形成时进行烧制的装置中,在第一金属层和 形成第一结构的第二金属层。 中间层是包含第一金属层中的一种或多种金属元素和第二金属层中的一种或多种金属元素的金属间化合物。 当形成第二结构时,金属间化合物的熔点高于烧制温度,并且在高于用于形成第二结构的烧成温度的温度下制备金属间化合物。

    DIRECT SEALING OF GLASS MICROSTRUCTURES
    98.
    发明申请
    DIRECT SEALING OF GLASS MICROSTRUCTURES 有权
    直接密封玻璃微结构

    公开(公告)号:US20130243663A1

    公开(公告)日:2013-09-19

    申请号:US13989897

    申请日:2011-11-28

    Abstract: Embodiments of methods for sealing a glass microstructure assembly comprise providing one or more side retainer members on a base plate adjacent the glass microstructure assembly, the side retainer members having a height less than an uncompressed height defined by the glass microstructure assembly. The methods also comprise compressing the glass microstructure assembly via a load bearing top plate in intimate contact with the top glass layer while heating the glass microstructure assembly and the top plate to a glass sealing temperature, the glass sealing temperature being a temperature sufficient to make glass viscous, wherein the glass microstructure assembly is compressed until the load bearing top plate contacts the side retainer members, and wherein the lower surface of the top plate maintains adhesion to the upper surface of the top glass layer at the glass sealing temperature while the load bearing plate is supported by the side retainer members.

    Abstract translation: 用于密封玻璃微结构组件的方法的实施例包括在邻近玻璃微结构组件的基板上提供一个或多个侧面保持器构件,侧面保持构件的高度小于由玻璃微结构组件限定的未压缩高度。 所述方法还包括通过与顶部玻璃层紧密接触的承载顶板压缩玻璃微结构组件,同时将玻璃微结构组件和顶板加热至玻璃密封温度,玻璃密封温度为足以制备玻璃的温度 粘性,其中玻璃微结构组件被压缩直到承载顶板接触侧保持器构件,并且其中顶板的下表面在玻璃密封温度下保持与顶部玻璃层的上表面的粘附,而承载 板由侧保持构件支撑。

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