公开(公告)号：US20180213324A1

公开(公告)日：2018-07-26

申请号：US15879047

申请日：2018-01-24

Applicant: Infineon Technologies AG

Inventor： Niccolo De Milleri ,  Dietmar Straeussnigg ,  Andreas Wiesbauer

IPC: H04R3/04

CPC classification number: H04R3/04 ,  H04R2201/003 ,  H04R2410/03

Abstract: A Micro-Electro-Mechanical System (MEMS) circuit and a method for reconstructing an interference variable are provided. The MEMS circuit includes a MEMS device configured to generate a MEMS signal; a control circuit configured to detect a switched-on state or switched-off state of at least one device and configured to generate a control signal at least partly depending on the switched-on state or the switched-off state; a reconstruction filter configured to determine an interference signal that is partly generated by the at least one device, using the generated control signal; and a subtractor configured to subtract the determined interference signal from the MEMS signal.

公开(公告)号：US20180206042A1

公开(公告)日：2018-07-19

申请号：US15410298

申请日：2017-01-19

Applicant: INTEL CORPORATION

Inventor： Mikko Kursula ,  Kalle I. Makinen ,  Roope S. Kiiski

IPC: H04R19/04 ,  H04R1/32 ,  H04R29/00

CPC classification number: H04R19/04 ,  H04R1/326 ,  H04R3/007 ,  H04R3/06 ,  H04R19/005 ,  H04R29/004 ,  H04R2201/003 ,  H04R2410/07

Abstract: A micro electro-Mechanical System (MEMS) microphone is described herein. The MEMS microphone includes a first back plate positioned on top of a first moving plate, wherein the first moving plate flexes in response to changes in air pressure caused by audio signals. The MEMS microphone also includes a valve comprising a valve moving plate, wherein a first end of the valve moving plate is fixedly attached to a MEMS die and the valve moving plate flexes in response to high sound pressure levels such that a second end of the valve moving plate enables airflow to prevent audio signal distortion.

公开(公告)号：US20180201504A1

公开(公告)日：2018-07-19

申请号：US15923599

申请日：2018-03-16

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: B81C1/00 ,  H04R31/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: B81C1/00825 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00873 ,  B81C2201/017 ,  B81C2201/053 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack over a first main surface of a substrate, forming a polymer layer over a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

公开(公告)号：US20180199125A1

公开(公告)日：2018-07-12

申请号：US15741792

申请日：2016-07-06

Applicant: WIZEDSP LTD.

Inventor： OZ GABAI

IPC: H04R1/04 ,  H04R19/04 ,  H04R1/08

CPC classification number: H04R1/04 ,  H04R1/08 ,  H04R19/02 ,  H04R19/04 ,  H04R2201/003

Abstract: An acoustic transducer including a transducer including a first rigid conductive grid, a second rigid conductive grid, and an elastic conductive diaphragm located between the first rigid conductive grid and the second rigid conductive grid, a power supply having an input voltage VCC and providing a first LOW VCC supply voltage, and a second inverted voltage, a driving circuit operating the transducer as an electrostatic speaker, a buffer circuit operating the transducer as an electrostatic microphone, a switch selecting between electrostatic speaker and a microphone, a main supply input, a signal input, and an output.

公开(公告)号：US10003890B2

公开(公告)日：2018-06-19

申请号：US15119878

申请日：2015-06-25

Applicant: CSMC TECHNOLOGIES FAB1 CO., LTD.

Inventor： Yonggang Hu

IPC: H04R19/04 ,  H04R7/14 ,  H04R7/12 ,  B81B3/00 ,  H04R7/16

CPC classification number: H04R19/04 ,  B81B3/0037 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0315 ,  G01L9/0045 ,  G01L9/0073 ,  H04R7/12 ,  H04R7/14 ,  H04R7/16 ,  H04R19/005 ,  H04R2201/003

Abstract: A MEMS microphone includes a substrate (100), a supporting part (200), an upper polar plate (300) and a lower polar plate (400). The substrate (100) is provided with an opening (120) penetrating the middle thereof; the lower polar plate (400) straddles the opening (120); the supporting part (200) is fixed on the lower polar plate (400); the upper polar plate (300) is affixed to the supporting part (200); an accommodating cavity (500) is formed among the supporting part (200), the upper polar plate (300) and the lower polar plate (400); a recess (600) opposite to the accommodating cavity (500) is arranged in an intermediate region of at least one of the upper polar plate (300) and the lower polar plate (400), and insulation is achieved between the upper polar plate (300) and a lower polar plate (400).

公开(公告)号：US09998843B2

公开(公告)日：2018-06-12

申请号：US15018625

申请日：2016-02-08

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jung-Huei Peng ,  Chia-Hua Chu ,  Chun-wen Cheng ,  Chin-Yi Cho ,  Li-Min Hung ,  Yao-Te Huang

IPC: H04R31/00 ,  B81C1/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: H04R31/003 ,  B81C1/00158 ,  B81C2201/0125 ,  B81C2201/013 ,  B81C2201/053 ,  B81C2203/036 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/003 ,  H04R2307/027

Abstract: The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.

公开(公告)号：US09998812B2

公开(公告)日：2018-06-12

申请号：US15043831

申请日：2016-02-15

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss ,  Thomas Mueller

IPC: H04R1/08 ,  B81B7/00 ,  H04R1/04 ,  H04R1/40 ,  H04R19/00

CPC classification number: H04R1/083 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/95 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15 ,  H01L2924/181 ,  H01L2924/19106 ,  H04R1/04 ,  H04R1/406 ,  H04R19/005 ,  H04R2201/003 ,  H04R2410/05 ,  H04R2499/11

Abstract: A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.

公开(公告)号：US09992563B2

公开(公告)日：2018-06-05

申请号：US15417207

申请日：2017-01-26

Applicant: Jinyu Zhang ,  Hu Chen

Inventor： Jinyu Zhang ,  Hu Chen

IPC: H04R19/04 ,  H04R1/02 ,  H04R19/00 ,  H04R1/08

CPC classification number: H04R1/023 ,  B81B2201/0257 ,  H04R1/086 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11

Abstract: An MEMS microphone is provided in the present disclosure. The MEMS microphone includes a protective structure comprising a housing and a PCB substrate covering the housing to form a receiving space, the housing is provided with a sound hole, an MEMS chip with a back cavity, received in the receiving space and fixed on the PCB substrate, the back cavity is communicated with the sound hole, and the MEMS chip comprises a first surface away from the PCB substrate and a second surface opposite to the first surface; and a waterproof part, bonded to the first surface of the MEMS chip.

公开(公告)号：US20180152798A1

公开(公告)日：2018-05-31

申请号：US15804765

申请日：2017-11-06

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Axel THOMSEN

IPC: H04R29/00 ,  H04R19/04 ,  H04R19/00

CPC classification number: H04R29/004 ,  H04R3/06 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: A MEMS may include a backplate comprising first and second electrodes electrically isolated from one another and mechanically coupled to the backplate in a fixed relationship relative to the backplate, and a diaphragm configured to mechanically displace relative to the backplate as a function of sound pressure incident upon the diaphragm. The diaphragm may comprise third and fourth electrodes electrically isolated from one another and mechanically coupled to the diaphragm in a fixed relationship relative to the diaphragm such that the third and fourth electrodes mechanically displace relative to the backplate as the function of the sound pressure. The first and third electrodes may form a first capacitor, the second and fourth electrodes may form a second capacitor, and the first capacitor may be configured to sense a displacement of the diaphragm responsive to which the second capacitor may be configured to apply an electrostatic force to the diaphragm to return the diaphragm to an original position.

公开(公告)号：US20180152794A1

公开(公告)日：2018-05-31

申请号：US15872019

申请日：2018-01-16

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Axel THOMSEN

IPC: H04R19/04 ,  H04R29/00 ,  H03G3/30 ,  H04R7/04

CPC classification number: H04R19/04 ,  H03G3/3005 ,  H04R3/06 ,  H04R7/04 ,  H04R19/005 ,  H04R29/004 ,  H04R2201/003

Abstract: A MEMS microphone may include a backplate comprising first and second electrodes electrically isolated from one another and mechanically coupled to the backplate in a fixed relationship relative to the backplate and a diaphragm configured to displace relative to the backplate as a function of sound pressure incident upon the diaphragm, the diaphragm comprising third and fourth electrodes electrically isolated from one another and mechanically coupled to the diaphragm in a fixed relationship relative to the diaphragm such that the third and fourth electrodes displace relative to the backplate as a function of sound pressure incident upon the diaphragm. The first and third electrodes may form a first capacitor and the second and fourth electrodes may form a second capacitor, the capacitance of each which may be a function of the displacement of the diaphragm, and each of which may be biased by an alternating-current voltage waveform.