公开(公告)号：US5814180A

公开(公告)日：1998-09-29

申请号：US689448

申请日：1996-08-09

Applicant: David Robert King

Inventor： David Robert King

IPC: C09J9/02 ,  H01L21/60 ,  H01L23/482 ,  H05K3/32 ,  C09J5/08

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L23/4828 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H05K1/0215 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/10378 ,  H05K2203/0278 ,  H05K3/321 ,  Y10T428/249982 ,  Y10T428/249983 ,  Y10T428/249984 ,  Y10T428/249985 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2848

Abstract: A method for low temperature attachment of components is provided which uses an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways at the outer surfaces are filled with a non-conductive pressure sensitive adhesive resin.

Abstract translation: 提供了一种使用导电粘合剂的部件的低温附着方法。 导电粘合剂可以由具有穿过基底的多个通道的基底限定。 通道由构成基底的材料的多个壁限定。 墙壁上覆盖着一层导电金属。 外表面的通道填充有非导电压敏粘合剂树脂。

公开(公告)号：US5766750A

公开(公告)日：1998-06-16

申请号：US597345

申请日：1996-02-06

Applicant: Joseph E. Korleski

Inventor： Joseph E. Korleski

IPC: B32B5/28 ,  C08L27/18 ,  C09J7/02 ,  C09J7/04 ,  H05K1/03 ,  B32B5/16 ,  B32B5/18 ,  B32B27/04 ,  B32B27/20

CPC classification number: H05K1/0353 ,  B32B5/28 ,  C09J7/0289 ,  C09J7/0296 ,  C09J7/04 ,  H05K1/0366 ,  C08L27/18 ,  C09J2400/163 ,  C09J2400/263 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249958 ,  Y10T428/249982 ,  Y10T428/249985 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/249991 ,  Y10T428/249992 ,  Y10T428/249993 ,  Y10T428/256 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31544 ,  Y10T428/31931

Abstract: A method of preparing an adhesive composite is provided where a expanded fluoropolymer having nodes and interconnected fibrils with a void volume formed from the node and interconnected fibril structure is at least partially filled with a paste formed from a thermoset or thermoplastic adhesive and a particulate inorganic filler, sufficient adhesive and filler are present to provide a composite containing between about 5 to about 40 volume percent expanded fluoropolymer; 5-85 volume percent inorganic filler; and 10-95 volume percent of adhesive and filler, the adhesive and filler being contained within the voids of the expanded fluoropolymer. In the composite, the ratio of the mean flow pore size of the expanded fluoropolymer to the largest particle size of the filler is at least about 2 and/or the ratio of the minimum pore size of the expanded fluoropolymer to the largest particle size of the filler is at least about 1.4 within the composite.

Abstract translation: 提供了一种制备粘合剂复合材料的方法，其中具有节点和具有由节点和互连的原纤维结构形成的空隙体积的相互连接的原纤维的膨胀含氟聚合物至少部分地填充有由热固性或热塑性粘合剂形成的糊料和颗粒状无机填料 存在足够的粘合剂和填料以提供包含约5至约40体积％的膨胀的含氟聚合物的复合材料; 5-85体积％无机填料; 和10-95体积％的粘合剂和填料，粘合剂和填料包含在膨胀的含氟聚合物的空隙内。 在复合材料中，膨胀的含氟聚合物的平均流量孔径与填料的最大粒度的比率至少为约2和/或膨胀的含氟聚合物的最小孔径与最大颗粒尺寸之比 填料在复合材料中至少约为1.4。

公开(公告)号：US5735332A

公开(公告)日：1998-04-07

申请号：US789075

申请日：1997-02-03

Applicant: Marcus A. Ritland ,  Dennis W. Readey

Inventor： Marcus A. Ritland ,  Dennis W. Readey

IPC: B01D29/11 ,  B01D53/04 ,  B01D63/06 ,  C04B37/00 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C1/10 ,  C22C29/12 ,  F02F3/00 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  B22D19/00

CPC classification number: C04B41/89 ,  B01D29/111 ,  B01D63/066 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/52 ,  C04B41/88 ,  C22C1/1015 ,  C22C1/1036 ,  C22C29/12 ,  F02F3/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/5384 ,  C04B2111/00793 ,  C22C2001/1063 ,  F05C2201/0415 ,  F05C2203/0895 ,  F05C2253/16 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2203/128

Abstract: The present invention is directed to a process for fabricating ceramic-metal composites having continuous ceramic and metal phases. The process includes the steps of contacting a porous ceramic matrix material with a molten metal whereby capillary action pulls the metal into the ceramic matrix to substantially fill the void space. The present invention also provides a ceramic-metal composite having continuous metal and ceramic phases.

Abstract translation: 本发明涉及一种制造具有连续陶瓷和金属相的陶瓷 - 金属复合材料的方法。 该方法包括使多孔陶瓷基体材料与熔融金属接触的步骤，由此毛细作用将金属拉入陶瓷基体中以基本上填充空隙空间。 本发明还提供一种具有连续的金属和陶瓷相的陶瓷 - 金属复合材料。

公开(公告)号：US5686172A

公开(公告)日：1997-11-11

申请号：US563296

申请日：1995-11-28

Applicant: Kazuyuki Ohya ,  Norio Sayama

Inventor： Kazuyuki Ohya ,  Norio Sayama

IPC: H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K3/02 ,  B32B3/00 ,  B32B3/06 ,  B32B3/26 ,  H05K1/00

CPC classification number: H05K3/022 ,  H01L21/4846 ,  H01L23/15 ,  H05K1/0306 ,  H05K1/0353 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/13055 ,  H01L2924/1423 ,  H01L2924/1433 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K3/4629 ,  Y10S428/901 ,  Y10S428/94 ,  Y10T428/249956 ,  Y10T428/249967 ,  Y10T428/249994 ,  Y10T428/266 ,  Y10T428/31

Abstract: A metal-foil-clad composite ceramic board produced by impregnating by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetting resin (R) under vacuum, to form a resin-impregnated sintered substrate (IIR), stacking a metal foil on the resin-impregnated sintered substrate (IIR) and press-forming the resultant laminate, wherein the stacked metal foil has a 10-point average surface roughness Rz of 10 .mu.m or less, and the resin-impregnated sintered substrate (IIR) and the metal foil have substantially no adhesive layer therebetween or have an adhesive layer having a thickness of 10 .mu.m or less therebetween.

Abstract translation: 通过将真空间为12〜50％，开放孔率为10％以上的无机连续多孔烧结体（I）的烧结体（II）浸渍浸渍而成的金属箔复合陶瓷板， 真空下的热固性树脂（R），以形成树脂浸渍的烧结基板（IIR），在浸渍树脂的烧结基板（IIR）上堆叠金属箔并压制成型的层叠体，其中，叠层的金属箔具有 10点平均表面粗糙度Rz为10μm以下，树脂浸渍烧结基板（IIR）和金属箔之间基本上没有粘合剂层，或者具有厚度为10μm以下的粘合剂层。

公开(公告)号：US5652055A

公开(公告)日：1997-07-29

申请号：US418708

申请日：1995-04-07

Applicant: David R. King ,  Gary C. Adler ,  Joseph E. Korleski ,  Michelle M. H. Waters

Inventor： David R. King ,  Gary C. Adler ,  Joseph E. Korleski ,  Michelle M. H. Waters

IPC: C08J9/42 ,  C08L27/18 ,  C09J7/02 ,  H05K1/02 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

CPC classification number: C08J9/42 ,  C09J7/0289 ,  H05K1/0353 ,  H05K3/4626 ,  C08J2327/18 ,  C08J2461/00 ,  C08L27/18 ,  H05K1/024 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0715 ,  H05K2203/1147 ,  H05K3/386 ,  Y10S428/901 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/31544

Abstract: The present invention is an improved adhesive sheet (also known as a "bond ply," "bond film," or "prepreg") material suitable for bonding together electric circuit boards and other electrical components. The adhesive sheet of the present invention comprises a combination of a porous expanded polytetrafluoroethylene (PTFE), a ceramic filler, and a thermoset resin imbibed within the porous PTFE structure. By employing a fill of less than about 60% by weight of resin, the adhesive sheet has exceptionally good performance characteristics while being vastly easier to process.

Abstract translation: 本发明是一种适用于将电路板和其他电气部件结合在一起的改进的粘合片（也称为“键合层”，“接合膜”或“预浸料”）。 本发明的粘合片包括多孔膨体聚四氟乙烯（PTFE），陶瓷填料和吸收在多孔PTFE结构内的热固性树脂的组合。 通过使用小于约60重量％树脂的填充物，粘合片具有非常好的性能特征，同时极易加工。

公开(公告)号：US5626914A

公开(公告)日：1997-05-06

申请号：US220569

申请日：1994-03-31

Applicant: Marcus A. Ritland ,  Dennis W. Readey

Inventor： Marcus A. Ritland ,  Dennis W. Readey

IPC: B01D29/11 ,  B01D53/04 ,  B01D63/06 ,  C04B37/00 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C1/10 ,  C22C29/12 ,  F01L3/02 ,  F01L3/22 ,  F02B3/06 ,  F02F3/00 ,  F02F7/00 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40 ,  B05D3/02

CPC classification number: B01D29/111 ,  B01D53/0407 ,  B01D63/061 ,  B01D63/066 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/5144 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C1/1015 ,  C22C1/1036 ,  C22C29/12 ,  F01L3/02 ,  F01L3/22 ,  F02F3/00 ,  F02F7/0087 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/5384 ,  H05K3/4061 ,  B01D2201/0446 ,  C04B2111/00793 ,  C22C2001/1063 ,  F01L2101/02 ,  F02B3/06 ,  F05C2201/0415 ,  F05C2203/0895 ,  F05C2253/16 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2203/128

Abstract: A method for fabricating ceramic-metal composites having continuous ceramic and metallic phases. In one embodiment, the metal phase includes copper metal. The method can include the steps of contacting a porous ceramic matrix material with molten metal whereby capillary action pulls the metal into the ceramic matrix to substantially fill the open void space. The present invention also provides a ceramic-metal composite having continuous metal and ceramic phases.

Abstract translation: 一种制造具有连续陶瓷和金属相的陶瓷 - 金属复合材料的方法。 在一个实施例中，金属相包括铜金属。 该方法可以包括使多孔陶瓷基体材料与熔融金属接触的步骤，由此毛细作用将金属拉入陶瓷基体中以基本上填充开放的空隙空间。 本发明还提供一种具有连续的金属和陶瓷相的陶瓷 - 金属复合材料。

公开(公告)号：US5616421A

公开(公告)日：1997-04-01

申请号：US444171

申请日：1995-05-18

Applicant: Ralph R. Sawtell ,  Mosur K. Premkumar ,  David I. Yun

Inventor： Ralph R. Sawtell ,  Mosur K. Premkumar ,  David I. Yun

IPC: B22D19/00 ,  B22D17/14 ,  B22D19/14 ,  C04B41/51 ,  C04B41/88 ,  C22C1/10 ,  H01L21/48 ,  H01L23/053 ,  H01L23/06 ,  H01L23/14 ,  H01L23/373 ,  H05K1/03 ,  H05K1/05 ,  H05K3/10 ,  H05K3/44 ,  B32B15/04 ,  B32B3/14

CPC classification number: C04B41/009 ,  B22D17/14 ,  B22D19/14 ,  C04B41/51 ,  C04B41/5155 ,  C04B41/88 ,  C22C1/1036 ,  C22C47/06 ,  H01L21/4803 ,  H01L21/4821 ,  H01L21/4871 ,  H01L23/053 ,  H01L23/06 ,  H01L23/142 ,  H01L23/3733 ,  H05K3/101 ,  C04B2111/00931 ,  C22C2001/1021 ,  C22C2204/00 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/053 ,  H05K2201/0116 ,  H05K2203/128 ,  H05K3/44 ,  Y10T428/12486

Abstract: A method of fabricating a metal matrix composite containing electrically isolated areas and the MMC formed from the method. The method comprises: (a) providing a liquid pool of unreinforced aluminum alloy; (b) infiltrating the unreinforced aluminum alloy into a stack comprising upper and lower porous preforms and an electrical insulator material placed between the preforms; (c) solidifying the liquid-phase metal to form a metal matrix composite product that completely surrounds the stack; and (d) forming at least one groove in the solidified metal, the groove extending downward to the insulating substrate so as to electrically isolate at least one region on the surface of the metal matrix composite.

Abstract translation: 一种制造含有电隔离区域的金属基质复合材料的方法和由该方法形成的MMC。 该方法包括：（a）提供非增强铝合金液池; （b）将未增强的铝合金浸入包括上部和下部多孔预成型件的堆叠以及放置在预成型件之间的电绝缘材料; （c）固化液相金属以形成完全围绕堆叠的金属基复合材料产品; 和（d）在固化的金属中形成至少一个槽，所述槽向下延伸到绝缘基板，以便电隔离金属基质复合材料表面上的至少一个区域。

公开(公告)号：US5531945A

公开(公告)日：1996-07-02

申请号：US246497

申请日：1994-05-20

Applicant: Kazuyuki Ohya ,  Norio Sayama

Inventor： Kazuyuki Ohya ,  Norio Sayama

IPC: C04B35/622 ,  H01L23/15 ,  H05K1/03 ,  H05K3/00 ,  C04B41/81 ,  B28B11/02

CPC classification number: C04B35/622 ,  H01L23/15 ,  H05K3/0011 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2203/0235 ,  H05K2203/1147

Abstract: A process is provided for the production of a base board for printed wiring. The process involves the steps of wrapping a block inorganic continuous porous material with a cloth, impregnating the wrapped block inorganic continuous porous material with a thermosetting resin under reduced pressure, curing the thermosetting resin to form a composite material, and slicing the composite material into base boards having a thickness of 0.2 to 2 mm and a thickness allowance of .+-.5 .mu.m or less, or the steps of impregnating a block inorganic continuous porous material with a thermosetting resin in an impregnation vessel under reduced pressure, taking the block inorganic continuous porous material impregnated from the impregnation vessel, substantially removing the thermosetting resin adhering to surfaces of the block inorganic continuous porous material before the thermosetting resin forms a gel, curing the remaining thermosetting resin under heat to form a composite material, and slicing the composite material into base boards having a thickness of 0.2 to 2 mm and a thickness allowance of .+-.5 .mu.m or less.

Abstract translation: 提供了一种用于生产用于印刷布线的基板的工艺。 该方法包括以下步骤：用布包裹块状无机连续多孔材料，用热固性树脂在减压下浸渍包裹的无机连续多孔材料，固化热固性树脂以形成复合材料，并将复合材料切成基底 厚度为0.2〜2mm，厚度允许量为+/-5μm以下的板材，或者在浸渍容器内用减压下浸渍嵌段无机连续多孔材料的工序， 从浸渍容器浸渍的连续多孔材料，在热固性树脂形成凝胶之前基本上除去附着在块状无机连续多孔材料的表面上的热固性树脂，在剩余的热固性树脂加热下固化以形成复合材料，并将复合材料 进入具有0.2至2mm厚度的基板 山楂津贴+/- 5亩以下。

公开(公告)号：US5525374A

公开(公告)日：1996-06-11

申请号：US220559

申请日：1994-03-31

Applicant: Marcus A. Ritland ,  Dennis W. Readey ,  Jack D. Sibold ,  Dean A. Rulis

Inventor： Marcus A. Ritland ,  Dennis W. Readey ,  Jack D. Sibold ,  Dean A. Rulis

IPC: B01D29/11 ,  B01D53/04 ,  B01D63/06 ,  C04B37/00 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C1/10 ,  C22C29/12 ,  F01L3/02 ,  F01L3/22 ,  F02B3/06 ,  F02F3/00 ,  F02F7/00 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40 ,  B05D3/02

CPC classification number: C04B41/89 ,  B01D29/111 ,  B01D53/0407 ,  B01D63/061 ,  B01D63/066 ,  B32B18/00 ,  C04B37/021 ,  C04B37/026 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/5144 ,  C04B41/52 ,  C04B41/88 ,  C22C1/1015 ,  C22C1/1036 ,  C22C29/12 ,  F01L3/02 ,  F01L3/22 ,  F02F3/00 ,  F02F7/0087 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/5384 ,  H05K3/4061 ,  B01D2201/0446 ,  C04B2111/00793 ,  C04B2235/6567 ,  C04B2235/6581 ,  C04B2235/6585 ,  C04B2235/6588 ,  C04B2237/121 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/365 ,  C04B2237/401 ,  C04B2237/61 ,  C04B2237/68 ,  C04B2237/765 ,  C22C2001/1063 ,  F01L2101/02 ,  F02B3/06 ,  F05C2201/0415 ,  F05C2203/0895 ,  F05C2253/16 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2203/128

Abstract: A process for fabricating ceramic-metal composites having ceramic and metal phases wherein the ceramic to metal ratio changes within the ceramic. The process includes the steps of contacting a porous ceramic matrix material with a molten metal whereby capillary action pulls the metal into the ceramic matrix to substantially fill the void space. The ceramic matrix has a porosity gradient wherein the infiltrated composite has a varying ratio of ceramic to metal.

Abstract translation: 一种制造具有陶瓷和金属相的陶瓷 - 金属复合材料的方法，其中陶瓷与金属之比在陶瓷内变化。 该方法包括使多孔陶瓷基体材料与熔融金属接触的步骤，由此毛细作用将金属拉入陶瓷基体中以基本上填充空隙空间。 陶瓷基质具有孔隙度梯度，其中渗透的复合材料具有变化的陶瓷与金属的比例。

公开(公告)号：US5498467A

公开(公告)日：1996-03-12

申请号：US281779

申请日：1994-07-26

Applicant: Carmine G. Meola

Inventor： Carmine G. Meola

IPC: C23C18/31 ,  C23C18/16 ,  H01B1/22 ,  H01B5/16 ,  H01R11/01 ,  H01R13/24 ,  H01R43/00 ,  H05K3/18 ,  H05K3/42 ,  B32B27/14 ,  B32B15/00

CPC classification number: H01R43/007 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1644 ,  C23C18/204 ,  C23C18/208 ,  C23C18/30 ,  C23C18/40 ,  C23C18/405 ,  H01B1/22 ,  H05K3/422 ,  H01R12/52 ,  H01R13/2414 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/10378 ,  H05K3/185 ,  Y10S428/901 ,  Y10T428/24826 ,  Y10T428/249964 ,  Y10T428/249978 ,  Y10T428/249982 ,  Y10T428/31544 ,  Y10T442/152 ,  Y10T442/198

Abstract: There is provided a process for producing conductive areas through selected portions of the Z axis of a porous planar material. In the process, the planar material is sensitized to the reception of electroless metal with an electroless metal deposition solution. The planar material is provided throughout the selected Z axis areas with a metal salt composition which on exposure to radiant energy, such as light, electron beams, x-ray, and the like, so as to convert the metal cations to metal nuclei. The metal nuclei is then displaced with a more stable metal, such as palladium and then the material is electrolessly plated. The metalized planar material is then imbibed with a resin at such a percentage so that adhesion is provided between two substrates without loss of conductivity in the Z axis.

Abstract translation: 提供了通过多孔平面材料的Z轴的选定部分产生导电区域的方法。 在此过程中，平面材料被化学镀金属溶液吸收化学镀金属致敏。 平面材料在整个所选择的Z轴区域中提供金属盐组合物，其在暴露于辐射能（例如光，电子束，x射线等）上，从而将金属阳离子转化为金属核。 然后用更稳定的金属（例如钯）置换金属核，然后将该材料无电镀。 然后将金属化的平面材料以这样的百分比吸收树脂，使得在两个基板之间提供粘合，而不损失Z轴上的导电性。