公开(公告)号：US5814180A

公开(公告)日：1998-09-29

申请号：US689448

申请日：1996-08-09

Applicant: David Robert King

Inventor： David Robert King

IPC: C09J9/02 ,  H01L21/60 ,  H01L23/482 ,  H05K3/32 ,  C09J5/08

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L23/4828 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0781 ,  H05K1/0215 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/10378 ,  H05K2203/0278 ,  H05K3/321 ,  Y10T428/249982 ,  Y10T428/249983 ,  Y10T428/249984 ,  Y10T428/249985 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2848

Abstract: A method for low temperature attachment of components is provided which uses an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways at the outer surfaces are filled with a non-conductive pressure sensitive adhesive resin.

Abstract translation: 提供了一种使用导电粘合剂的部件的低温附着方法。 导电粘合剂可以由具有穿过基底的多个通道的基底限定。 通道由构成基底的材料的多个壁限定。 墙壁上覆盖着一层导电金属。 外表面的通道填充有非导电压敏粘合剂树脂。

公开(公告)号：US5763824A

公开(公告)日：1998-06-09

申请号：US735838

申请日：1996-10-23

Applicant: David Robert King ,  Bradley E. Reis ,  Joseph C. Rowan

Inventor： David Robert King ,  Bradley E. Reis ,  Joseph C. Rowan

IPC: H01L23/552 ,  H05K3/32 ,  H05K9/00

CPC classification number: H05K9/0026 ,  H01L23/552 ,  H05K3/323 ,  H01L2924/0002 ,  H01L2924/16152 ,  H05K2201/10371

Abstract: A cover or lid assembly is provided for EMI/RFI shielding. The cover or lid is used in combination with an electrical assembly having an electrical ground, at least one electronic component electrically connected to the assembly, a conductive frame, disposed about the electronic component. The conductive frame is electrically connected to the ground. An electrically conductive adhesive is disposed continuously between the frame and the lid to mount the lid to the conductive frame to shield the electronic component from electromagnetic and radio frequency interference.

Abstract translation: 为EMI / RFI屏蔽提供盖子或盖子组件。 盖或盖与具有电接地的电气组件，电连接到组件的至少一个电子部件，围绕电子部件设置的导电框架组合使用。 导电框架电连接到地面。 导电粘合剂连续地设置在框架和盖之间，以将盖安装到导电框架上，以屏蔽电子部件免受电磁和射频干扰。

公开(公告)号：US5761053A

公开(公告)日：1998-06-02

申请号：US643292

申请日：1996-05-08

Applicant: David Robert King ,  Joseph C. Rowan ,  Daniel D. Johnson ,  Bradley E. Reis

Inventor： David Robert King ,  Joseph C. Rowan ,  Daniel D. Johnson ,  Bradley E. Reis

IPC: H01L23/552 ,  H05K3/32 ,  H05K9/00

CPC classification number: H05K9/0026 ,  H01L23/552 ,  H05K3/323 ,  H01L2924/0002 ,  H01L2924/16152 ,  H05K2201/10371

Abstract: A Faraday cage is provided for EMI/RFI shielding which includes a substrate having an electrical ground; at least one electronic component electrically connected to the substrate; a conductive housing; and an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways are filled with a non-conductive adhesive resin. The conductive housing is adhesively electrically mounted to the electrical ground of the substrate, over the electronic component, to shield electromagnetic and radio frequency interference.

Abstract translation: 为法拉第笼提供EMI / RFI屏蔽，其包括具有电接地的基板; 电连接到所述基板的至少一个电子部件; 导电外壳; 和导电粘合剂。 导电粘合剂可以由具有穿过基底的多个通道的基底限定。 通道由构成基底的材料的多个壁限定。 墙壁上覆盖着一层导电金属。 通道填充有非导电粘合剂树脂。 导电壳体通过电子元件粘合地电气地安装到基板的电接地，以屏蔽电磁和射频干扰。