公开(公告)号：US5118028A

公开(公告)日：1992-06-02

申请号：US573721

申请日：1990-08-28

Applicant: Kazuhiro Ogawa ,  Yuichi Komizo

Inventor： Kazuhiro Ogawa ,  Yuichi Komizo

IPC: B23K1/002 ,  B23K20/16 ,  B23K20/227 ,  B23K35/00 ,  B23K35/30 ,  H05K1/03

CPC classification number: B23K1/002 ,  B23K20/16 ,  B23K20/227 ,  B23K35/004 ,  B23K35/304 ,  B23K35/308 ,  H05K1/0373 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0212

Abstract: A diffusion bonding method for corrosion resistant materials comprises: disposing an insert material having a melting point of at most 1150 degrees C. and a thickness of 10-80 micrometers between the bonding interfaces of two members to be joined, the insert comprising, by weight %,Cr: 5-40%,one or more of Si: at most 8% and B: at most 4%, anda remainder of at least one of Fe and Ni and incidental impurities; and heating the bonding interfaces of the two members by high-frequency induction heating for at least 120 seconds at a temperature of 1150-1250 degrees C. in an atmosphere containing at most 200 ppm oxygen while applying a pressure of 0.5-2 kgf/mm.sup.2 to the bonding interfaces so as to melt the insert material.

公开(公告)号：US4841099A

公开(公告)日：1989-06-20

申请号：US188984

申请日：1988-05-02

Applicant: Arthur J. Epstein ,  Joan R. Ewing ,  Joseph A. Swift

Inventor： Arthur J. Epstein ,  Joan R. Ewing ,  Joseph A. Swift

IPC: B41J29/00 ,  C08L101/00 ,  G03G15/00 ,  G03G21/00 ,  H01B5/14 ,  H01B13/00 ,  H01L21/3205 ,  H01L23/52 ,  H05K1/03 ,  H05K3/10

CPC classification number: H05K1/0353 ,  C25D5/02 ,  H05K3/105 ,  H05K2201/0212 ,  H05K2201/0329 ,  H05K2203/107 ,  H05K2203/1136

Abstract: An electrical component is made from an electrically insulating polymer matrix filled with electrically insulating fibrous filler which is capable of heat conversion to electrically conducting fibrous filler and has at least one continuous electrically conductive path formed in the matrix by the in situ heat conversion of the electrically insulating fibrous filler. In a preferred embodiment, the fibrous filler is thermally stabilized polyacrylonitrile fibers and the conductive path is formed by in situ heat converted thermally stabilized polyacrylonitrile fibers which have been converted by directing a laser beam through a mask having a predetermined pattern to melt the polymer and to heat convert the thermally stabilized polyacrylonitrile fibers.

公开(公告)号：US4770922A

公开(公告)日：1988-09-13

申请号：US37418

申请日：1987-04-13

Applicant: Minoru Hatakeyama ,  Kosuke Moriya ,  Ichiro Komada

Inventor： Minoru Hatakeyama ,  Kosuke Moriya ,  Ichiro Komada

IPC: B32B5/16 ,  C08L101/00 ,  H05K1/03 ,  B32B7/10 ,  B32B23/08

CPC classification number: H05K1/0353 ,  B32B5/16 ,  C08L101/00 ,  H05K2201/0212 ,  Y10S428/901 ,  Y10T428/24934 ,  Y10T428/254 ,  Y10T428/31544 ,  Y10T428/31616 ,  Y10T428/31623 ,  Y10T428/31721 ,  Y10T428/31786 ,  Y10T428/31902 ,  Y10T442/3878

Abstract: A base material for use in making printed circuit boards is provided wherein minute fragments of expanded, porous polytetrafluoroethylene are uniformly mixed into another resin, and the mixture is compressed to form a composite board. In use, the board has an electrically conductive circuit affixed to at least one surface. The other resin may be epoxy, polyester or other similar resin. Laminates of such base board material affixed to a glass cloth or paper sheet may be prepared. The preferred fragment size range is 0.1 to 5 mm average diameter, and the preferred volume ratio of fragments to resin is 0.5 to 2.0.

Abstract translation: 提供用于制造印刷电路板的基材，其中膨胀的多孔聚四氟乙烯的微小碎片均匀地混合到另一种树脂中，并将该混合物压缩以形成复合板。 在使用中，电路板具有固定在至少一个表面上的导电电路。 另一种树脂可以是环氧树脂，聚酯或其它类似的树脂。 可以制备固定在玻璃布或纸张上的这种基板材料的层叠体。 优选的片段尺寸范围为平均直径为0.1〜5mm，碎片与树脂的体积比优选为0.5〜2.0。

公开(公告)号：US4752499A

公开(公告)日：1988-06-21

申请号：US860886

申请日：1986-05-08

Applicant: Ryo Enomoto

Inventor： Ryo Enomoto

IPC: C23C18/20 ,  H01R4/02 ,  H01R4/04 ,  H05K3/18 ,  H05K3/38 ,  B05D5/12 ,  B05D3/04

CPC classification number: H01R4/04 ,  C23C18/2013 ,  C23C18/2033 ,  C23C18/2086 ,  C23C18/26 ,  C23C18/30 ,  H05K3/387 ,  H01R4/02 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K3/181

Abstract: An adhesive for electroless plating is composed of at least one kind of fine powders selected from either a cured heat resistant resin or an inorganic material and easily soluble in a predetermined solution and a heat resistant resin solution sparingly soluble in the predetermined solution by curing treatment. The adhesive for electroless plating in which the above fine powders are dispersed in the above uncured heat resistant resin solution, is coated on a circuit board, dried and cured to form an adhesive layer. When the above predetermined solution contacts with the surface of the adhesive layer, its surface is roughed to be formed a plating film having an excellent adhesiveness by electroless plating.

Abstract translation: 用于化学镀的粘合剂由选自固化的耐热树脂或无机材料中的至少一种细粉末组成，并且易于溶解在预定溶液中，以及通过固化处理微溶于预定溶液中的耐热树脂溶液。 将上述细粉末分散在上述未固化的耐热性树脂溶液中的无电解电镀用粘合剂涂布在电路基板上，干燥固化，形成粘接层。 当上述预定溶液与粘合剂层的表面接触时，其表面被粗糙化，以形成具有通过无电镀的优异粘合性的镀膜。

公开(公告)号：US20240244762A1

公开(公告)日：2024-07-18

申请号：US18410477

申请日：2024-01-11

Applicant: IBIDEN CO., LTD.

Inventor： Nobuhisa KURODA ,  Naoya MURAKAMI

IPC: H05K3/44 ,  H05K1/11 ,  H05K3/10 ,  H05K3/28

CPC classification number: H05K3/44 ,  H05K1/115 ,  H05K3/103 ,  H05K3/284 ,  H05K2201/0212 ,  H05K2201/09472

Abstract: A wiring substrate includes a core substrate having a cavity penetrating through the substrate, an electronic component accommodated in the cavity such that the component is positioned closer to a first surface of the substrate than a second surface of the substrate, a sealing resin filling the cavity of the substrate such that the sealing resin is covering a surface of the component on a second surface side of the substrate and that the cavity of the substrate has a portion not filled with the sealing resin on the second surface side of the substrate, and resin insulating layers including a first resin insulating layer laminated on the first surface of the substrate and a second resin insulating layer laminated on the second surface of the substrate such that a portion of the second resin insulating layer is filling the portion of the cavity not filled with the sealing resin.

公开(公告)号：US20240224419A1

公开(公告)日：2024-07-04

申请号：US18236889

申请日：2023-08-22

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： KUEI-FENG PENG

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/12 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K1/028 ,  H05K1/147 ,  H05K3/1283 ,  H05K3/323 ,  H05K3/3489 ,  H05K2201/0212 ,  H05K2201/10083 ,  H05K2201/10121

Abstract: A camera module packaging structure with simplified process, and an electronic device carrying it, includes a FPC, an ACF, an embedded printed circuit board, a no-flow underfill, and a chip-scale package camera module. The present application uses a no-flow underfill, which can omit steps of applying the flux and removing the flux, thus the process is simplified. By setting the ACF in the present application, a stable structure having vertical conduction characteristic and horizontal insulation characteristic is formed between the chip-scale packaged camera module and the flexible circuit board.

公开(公告)号：US20240147627A1

公开(公告)日：2024-05-02

申请号：US18532011

申请日：2023-12-07

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomohiro FUKAO ,  Tomoaki SAWADA ,  Kyosuke MICHIGAMI

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/18

CPC classification number: H05K3/0058 ,  H05K1/0283 ,  H05K3/188 ,  H05K2201/0212 ,  H05K2203/0323

Abstract: One aspect of the present invention relates to a method for manufacturing a substrate with a conductive pattern, the method including: a base forming step of forming a plating base in a desired pattern on at least a portion of one surface of a stretchable substrate, wherein the stretchable substrate has a tensile modulus at 20° C. of 0.1 MPa or more and 500 MPa or less, an elongation at break of 100% or more and 1000% or less, and a storage modulus at 250° C. of 0.1 MPa or more; a bending step of bending the stretchable substrate; and a conductive pattern forming step of plating the plating base after performing the bending step to form a conductive pattern on the stretchable substrate.

公开(公告)号：US20240090134A1

公开(公告)日：2024-03-14

申请号：US18515892

申请日：2023-11-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Hirofumi OIE

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K2201/0212 ,  H05K2201/0707 ,  H05K2201/09472 ,  H05K2201/095 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10287

Abstract: An electronic circuit module includes: a substrate; a first electronic component mounted on one main surface of the substrate; a substrate electrode provided on the one main surface; a second electronic component supported on a support surface opposite to a surface facing the one main surface of the first electronic component; a conductor provided on the support surface of the first electronic component; a wire connected to the conductor and the substrate electrode; and a component electrode provided on a surface of the second electronic component and electrically connected to the conductor.

公开(公告)号：US11716810B2

公开(公告)日：2023-08-01

申请号：US17660700

申请日：2022-04-26

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Masaya Takizawa ,  Rie Mizutani ,  Hiroshi Taneda ,  Yoshiki Akiyama ,  Noriyoshi Shimizu

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/113 ,  H05K1/0271 ,  H05K2201/0212 ,  H05K2201/068

Abstract: A wiring board includes a first interconnect structure including a first interconnect layer, and a first insulating layer including a non-photosensitive thermosetting resin as a main component thereof, a second interconnect structure including second interconnect layers, and second insulating layers including a photosensitive resin as a main component thereof, and laminated on the first interconnect structure, and an encapsulating resin layer including a non-photosensitive thermosetting resin as a main component thereof, and laminated on an uppermost second insulating layer. An uppermost second interconnect layer includes a pad protruding from the uppermost second insulating layer. The encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad. Thermal expansion coefficients of the first insulating layer and the encapsulating resin layer are lower than that of the second insulating layers.

公开(公告)号：US20230193045A1

公开(公告)日：2023-06-22

申请号：US18167235

申请日：2023-02-10

Applicant: actnano, Inc.

Inventor： Syed Taymur AHMAD ,  Justin KLEINGARTNER ,  Sruti BALASUBRAMANIAN

IPC: C09D5/00 ,  C09D7/20 ,  C09D1/00 ,  H05K3/28 ,  C09D183/04 ,  C08K3/04 ,  C08G77/00 ,  C08K3/22 ,  C08K3/36 ,  H01B3/46 ,  C08L83/04 ,  C09D7/00 ,  C08L27/12 ,  C08L23/00

CPC classification number: C09D5/00 ,  C09D7/20 ,  C09D1/00 ,  H05K3/28 ,  C09D183/04 ,  C08K3/04 ,  C08G77/80 ,  C08K3/22 ,  C08K3/36 ,  H01B3/46 ,  C08L83/04 ,  C09D7/00 ,  C08L27/12 ,  C08L23/00 ,  H05K3/282 ,  H05K2201/0162 ,  H05K2201/0212 ,  H05K2201/0209 ,  H05K2203/0759

Abstract: A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.