公开(公告)号：US20140209366A1

公开(公告)日：2014-07-31

申请号：US14167280

申请日：2014-01-29

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazuyuki Kubota ,  Tomoharu Fujii

IPC: H05K1/18

CPC classification number: H01L23/50 ,  H01L23/58 ,  H01L25/105 ,  H01L2224/16237 ,  H01L2924/15321 ,  H05K1/0271 ,  H05K1/16 ,  H05K1/185 ,  H05K3/108 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/0162 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0218 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2203/1461 ,  H05K2203/1469

Abstract: There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the secondary battery; a third insulating layer covering the second insulating layer; a first wiring layer on one surface of the third insulating layer; and a via electrically connecting the first wiring layer to an electrode of the secondary battery. A rigidity of the second insulating layer is lower than those of the first and third insulating layers.

Abstract translation: 提供了一个接线板。 布线板包括：第一绝缘层; 在所述第一绝缘层的一个表面上的二次电池; 形成在二次电池上的第二绝缘层; 覆盖所述第二绝缘层的第三绝缘层; 在所述第三绝缘层的一个表面上的第一布线层; 以及将第一布线层电连接到二次电池的电极的通孔。 第二绝缘层的刚性低于第一绝缘层和第三绝缘层的刚性。

公开(公告)号：US08609999B2

公开(公告)日：2013-12-17

申请号：US13017590

申请日：2011-01-31

Applicant: Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

Inventor： Shigenobu Sekine ,  Yurina Sekine ,  Yoshiharu Kuwana

IPC: H05K1/11 ,  H01L21/768

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H05K3/4038 ,  H05K3/4061 ,  H05K3/4614 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/083 ,  H05K2203/0285 ,  H05K2203/104 ,  H05K2203/128 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough.

Abstract translation: 电路板包括基板，电路图案和通孔电极。 电路图案沿其厚度方向设置在基板的一侧。 通孔电极填充在形成在基板中的通孔中，其一端连接到电路图案。 电路图案和贯通电极各自具有含有贵金属成分（例如Au成分）的区域，并且通过其彼此连接。

公开(公告)号：US20130092423A1

公开(公告)日：2013-04-18

申请号：US13608620

申请日：2012-09-10

Applicant: Yoshitaka HAMADA ,  Naoki YAMAKAWA

Inventor： Yoshitaka HAMADA ,  Naoki YAMAKAWA

IPC: B05D5/12 ,  H05K1/09

CPC classification number: H05K1/095 ,  C09D11/037 ,  C09D11/52 ,  H01L2924/0002 ,  H05K3/1216 ,  H05K3/1283 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0245 ,  H01L2924/00

Abstract: A conductive circuit is formed by printing a pattern using a conductive ink composition and heat curing the pattern. A thixotropic agent, typically carbon black is added to the solvent-free ink composition comprising an addition type silicone resin precursor, a curing catalyst, and conductive particles. The ink composition has such thixotropy that the printed pattern may retain its shape after curing.

Abstract translation: 通过使用导电油墨组合物印刷图案并热固化图案来形成导电电路。 将触变剂（通常为炭黑）加入到包含加成型有机硅树脂前体，固化催化剂和导电颗粒的无溶剂油墨组合物中。 油墨组合物具有这样的触变性，即印刷图案可以在固化后保持其形状。

公开(公告)号：US08324507B2

公开(公告)日：2012-12-04

申请号：US12546117

申请日：2009-08-24

Applicant: Kiyohiko Takemoto ,  Miharu Kanaya

Inventor： Kiyohiko Takemoto ,  Miharu Kanaya

IPC: H05K1/09 ,  B05D5/12 ,  H01B1/22

CPC classification number: H01B1/22 ,  C09D11/38 ,  C09D11/52 ,  C09D17/006 ,  C22C9/00 ,  C22C21/00 ,  H05K1/097 ,  H05K2201/0218

Abstract: A composite metallic particle made by coating a surface of a base material sheet with a composite metallic thin film layer that contains at least one of a resin layer and a wax layer and at least one of a metal layer and a metal compound layer and step 2 for removing the composite metallic thin film layer from the sheet. The resultant composite metallic particles and conductive ink can be used in a conductive substrate producing apparatus, formed into a pattern on the conductive substrate by screen printing, an ink jet method, or some other liquid-based process.

Abstract translation: 通过用包含树脂层和蜡层中的至少一种和金属层和金属化合物层中的至少一种的复合金属薄膜层涂覆基材片的表面而制成的复合金属颗粒，并且步骤2 用于从片材上去除复合金属薄膜层。 所得到的复合金属颗粒和导电油墨可以用于通过丝网印刷，喷墨法或一些其它基于液体的方法在导电基底上形成图案的导电基板制造装置中。

公开(公告)号：US20120152455A1

公开(公告)日：2012-06-21

申请号：US13403316

申请日：2012-02-23

Applicant: Min-Sok JANG ,  Kyung-Hwan KO ,  Seung-Il LEE ,  Jin-Wook MOON ,  Jeong-Geun HAN

Inventor： Min-Sok JANG ,  Kyung-Hwan KO ,  Seung-Il LEE ,  Jin-Wook MOON ,  Jeong-Geun HAN

IPC: B32B37/12 ,  B05D5/12

CPC classification number: H05K3/323 ,  B22F1/025 ,  H05K2201/0218 ,  H05K2201/0233 ,  Y10T428/2991

Abstract: In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle.

Abstract translation: 在含有导电性粒子的各向异性导电性粘合剂中，导电性粒子包括树脂粒子，该树脂粒子形成有腔，该导电性层包围树脂粒子的表面。 通过将树脂颗粒与反应物混合并从树脂颗粒中部分除去反应物而形成空腔。 因此，导电性粒子可以容易地吸收外部压力，从而为导电性粒子提供改善的延展性。

公开(公告)号：US20120058917A1

公开(公告)日：2012-03-08

申请号：US12593770

申请日：2008-04-04

Applicant: Johannes Adrianus Gaken ,  Azim Mohamedali

Inventor： Johannes Adrianus Gaken ,  Azim Mohamedali

IPC: C40B30/06 ,  C12N5/10 ,  C40B50/00 ,  C12Q1/68 ,  C12N15/63 ,  C40B40/02

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

Abstract: The invention relates to a nucleic acid comprising the following contiguous elements arranged in the 5 prime to 3 prime direction; a promoter; a selectable marker; a cloning site for receipt of a nucleic acid segment, said segment comprising a candidate miRNA target sequence; and a poly adenylation signal, said elements arranged such that a transcript directed by said promoter comprises said selectable marker, said candidate miRNA target sequence, and said poly adenylation signal in that order. Suitably the miRNA test sequence is or is derived from a 3′UTR. The invention also relates to methods for making and screening libraries.

Abstract translation: 本发明涉及一种核酸，其包含排列成5素质素至3个原子方向的以下邻接元件; 启动子 可选标记; 用于接收核酸片段的克隆位点，所述片段包含候选miRNA靶序列; 和聚腺苷酸化信号，所述元件排列成使得由所述启动子引导的转录物依次包含所述选择性标记，所述候选miRNA靶序列和所述多聚腺苷酸化信号。 适当地，miRNA测试序列是或源自3'UTR。 本发明还涉及制备和筛选文库的方法。

公开(公告)号：US20120056136A1

公开(公告)日：2012-03-08

申请号：US13262326

申请日：2010-03-17

Applicant: Taku Sasaki ,  Hiroshi Natsui

Inventor： Taku Sasaki ,  Hiroshi Natsui

IPC: H01B1/22 ,  H01B1/02 ,  B05D5/12

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/0218 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: The present invention provides a conductive fine particle capable of suppressing a blackening phenomenon during storage and thus providing high connection reliability; an anisotropic conductive material containing the conductive fine particle; and a connection structure.The conductive particle which has a base fine particle, and a conductive layer and a low-melting point metal layer that are formed in the stated order on the surface of the base fine particle, wherein the low-melting point metal layer has an arithmetic mean surface roughness of 50 nm or lower.

Abstract translation: 本发明提供能够抑制保存期间的黑化现象的导电性微粒，从而提供高连接可靠性; 含有导电性细颗粒的各向异性导电材料; 和连接结构。 具有基础细颗粒的导电颗粒以及在基体细颗粒的表面上按顺序形成的导电层和低熔点金属层，其中低熔点金属层具有算术平均值 表面粗糙度为50nm以下。

公开(公告)号：US08083121B2

公开(公告)日：2011-12-27

申请号：US10585729

申请日：2005-10-27

Applicant: Tadashi Maeda ,  Tadahiko Sakai

Inventor： Tadashi Maeda ,  Tadahiko Sakai

IPC: B23K31/00

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3613 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10992 ,  Y02P70/613

Abstract: In the soldering method, metal-powder-contained flux is disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprising a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

Abstract translation: 在焊接方法中，当通过焊接安装电子部件时，在凸起和电路电极之间设置含金属粉末的焊剂，金属粉末包括由诸如锡和锌的金属形成的芯金属和芯的表面金属覆盖表面 由贵金属如金和银形成的金属。 因此，金属粉末不会残留在回流处理后容易引起迁移的残留物，并且可以确保焊接效果和绝缘效果。

公开(公告)号：US08034195B2

公开(公告)日：2011-10-11

申请号：US12796905

申请日：2010-06-09

Applicant: Richard K. Schmid ,  Jacobus C. Doesburg

Inventor： Richard K. Schmid ,  Jacobus C. Doesburg

IPC: B23K35/24 ,  B22F1/02

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: A solder composition for forming a solder joint. The composition includes a powder material including a solid metal matrix material and a filler material. The solid metal matrix material includes one or more of tin-silver-copper (Sn—Ag—Cu), tin-copper (Sn—Cu), tin-copper-nickel (Sn—Cu—Ni), tin-silver (Sn—Ag), tin-silver-bismuth (Sn—Ag—Bi), tin-bismuth-indium (Sn—Bi—In), tin-gold (Au—Sn), tin-zinc (Sn—Zn), tin-zinc-bismuth (Sn—Zn—Bi), tin-bismuth-silver (Sn—Bi—Ag), tin (Sn), tin-indium (Sn—In), indium (In), indium-silver (In—Ag), and tin-lead (Sn—Pb). The filler material includes one or more of copper (Cu), gold (Au), nickel (Ni), nickel-gold (Ni—Au), carbon, silver (Ag), aluminum (Al), molybdenum (Mo), nickel (Ni) or nickel-gold (Ni—Au) coated carbon, the platinum group metals (PGM's), and their alloys.

Abstract translation: 用于形成焊点的焊料组合物。 组合物包括包含固体金属基质材料和填充材料的粉末材料。 固体金属基体材料包括锡 - 银 - 铜（Sn-Ag-Cu），锡 - 铜（Sn-Cu），锡 - 铜 - 镍（Sn-Cu-Ni），锡 - 银（Sn （Sn-Bi-In），锡 - 金（Au-Sn），锡 - 锌（Sn-Zn），锡 - 铋 - 锡（Sn-Ag-Bi） （Sn-Zn-Bi），锡 - 铋 - 银（Sn-Bi-Ag），锡（Sn），锡 - 铟（Sn-In），铟（In），铟 - 银 ）和锡铅（Sn-Pb）。 填充材料包括铜（Cu），金（Au），镍（Ni），镍 - 金（Ni-Au），碳，银（Ag），铝（Al），钼（Mo） （Ni）或镍 - 金（Ni-Au）涂覆的碳，铂族金属（PGM's）及其合金。

公开(公告)号：US20110127068A1

公开(公告)日：2011-06-02

申请号：US13055912

申请日：2009-07-27

Applicant: Takuya Wada ,  Naoyuki Nagatani

Inventor： Takuya Wada ,  Naoyuki Nagatani

IPC: H01B5/00 ,  C08F222/14 ,  H01B1/00

CPC classification number: H05K3/323 ,  C01P2004/84 ,  C08F220/18 ,  C08F222/1006 ,  C09C3/10 ,  H05K2201/0218 ,  H05K2201/0221

Abstract: An object of the present invention is to provide a polymer particulate material with a low compression modulus and a high recovery rate from compression deformation.The present invention provides a polymer particulate material obtainable by co-polymerizing comonomer components including a polyfunctional (meth)acrylate having a structure represented by the below formulas (1), (2) or (3), and a monofunctional (meth)acrylate monomer having a structure represented by the below formula (4), the polymer particulate material shows a recovery rate from compressive deformation of 70% or higher: In the formula (1), n represents an integer within the range of 4 to 10. In the formula (2), R11 represents a hydrogen atom or a C1-4 alkyl group, R12, R13 and R14 each represent a C1-4 alkylene group, and R15, R16 and R17 each represent a hydrogen atom or a methyl group. In the formula (3), R3, R4, R5 and R6 each represent a C1-4 alkylene group, and R7, R8, R9 and R10 each represent a hydrogen atom or a methyl group. In the formula (4), R1 represents a hydrogen atom or a methyl group, and R2 represents a C5-18 alkyl group.

Abstract translation: 本发明的目的是提供一种聚合物颗粒材料，其具有低压缩模量和高压缩变形的回收率。 本发明提供一种聚合物颗粒材料，其可通过共聚单体组分包括具有由下式（1），（2）或（3）表示的结构的多官能（甲基）丙烯酸酯和单官能（甲基）丙烯酸酯单体 具有由下式（4）表示的结构，聚合物颗粒材料显示出从压缩变形的回收率为70％以上：在式（1）中，n表示4〜10的整数。在 式（2）中，R11表示氢原子或C1-4烷基，R12，R13和R14各自表示C1-4亚烷基，R15，R16和R17各自表示氢原子或甲基。 在式（3）中，R 3，R 4，R 5和R 6各自表示C 1-4亚烷基，R 7，R 8，R 9和R 10各自表示氢原子或甲基。 在式（4）中，R 1表示氢原子或甲基，R 2表示C 5-18烷基。