中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

272 records (took 0.014 seconds)

    Method of producing electrically conductive anisotropic heat sealing connector members
    91.
    发明授权
    Method of producing electrically conductive anisotropic heat sealing connector members 失效
    生产电导式热电偶热密封连接器部件的方法

    公开(公告)号：US5122215A

    公开(公告)日：1992-06-16

    申请号：US568339

    申请日：1990-08-16

    Applicant: Mitsumasa Shibata ,  Katsuhiro Murata ,  Tadaaki Isono

    Inventor： Mitsumasa Shibata ,  Katsuhiro Murata ,  Tadaaki Isono

    IPC: H01R11/01 ,  H01B1/22 ,  H01B1/24 ,  H01B13/00 ,  H01R4/04 ,  H01R13/24 ,  H01R43/00 ,  H05K1/09 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

    CPC classification number: H01R13/2414 ,  H01B1/22 ,  H01B1/24 ,  H01R4/04 ,  H05K3/361 ,  H05K1/095 ,  H05K2201/0209 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2201/10977 ,  H05K2203/1189 ,  H05K3/305 ,  H05K3/321 ,  Y10T156/1052 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/4913

    Abstract: A method of producing electrically conductive anisotropic heat sealing connector members comprising, a process A of preparing an electrically conductive anisotropic suspension liquid type paint, applying the conductive paint on a surface of a flexible electrically insulative substrate film to form an electrically conductive circuit of longitudinal thin stripes pattern, and drying the applied conductive paint on the substrate film; a process B of preparing an electrically insulative heat-bonding suspension liquid type paint, applying the insulative paint wholly on the surface of the substrate film including both the longitudinal thin stripes pattern formed by the process A and the remaining portion of the substrate film, and drying the applied insulative paint on the substrate film to form a press heat bonding layer; and a process C of severing the applied and dried substrate film prepared by the processes A and B to desired length and width sizes to produce electrically conductive anisotropic heat sealing connector members.

    Abstract translation: 一种制造导电各向异性热封连接器构件的方法，包括：制备导电各向异性悬浮液型涂料的方法A，将导电涂料施加在柔性电绝缘基材膜的表面上以形成纵向薄的导电电路 条纹图案，并干燥所施加的导电涂料在基片上; 制备电绝缘热粘悬浮液型涂料的方法B，将绝缘涂料完全涂覆在基材膜的表面上，该表面包括由方法A形成的纵向薄条图案和基板膜的剩余部分;以及 干燥基材膜上施加的绝缘漆，形成压合热粘合层; 以及将由方法A和B制备的施加和干燥的基底膜切割成所需长度和宽度尺寸以制备导电各向异性热密封连接器构件的方法C。

    Electroconductive adhesive
    92.
    发明授权
    Electroconductive adhesive 失效
    导电胶

    公开(公告)号：US4880570A

    公开(公告)日：1989-11-14

    申请号：US267752

    申请日：1988-11-02

    Applicant: James A. Sanborn ,  Bobby J. Boan

    Inventor： James A. Sanborn ,  Bobby J. Boan

    IPC: H01R4/04 ,  H05K3/32

    CPC classification number: H05K3/321 ,  H01R4/04 ,  H05K2201/0245 ,  H05K2201/0272

    Abstract: An electrically conductive epoxy-based adhesive. The epoxy is selected from the amine curing modified epoxy family consisting of a resin that is a combination of polygylcidylaminophenyl resin and polygylcidylether of phenylformaldehyde novalac resin family and a catalyst that is a combination of one member from the aliphatic amide family plus one member from the aliphatic polyamine family. In one embodiment includes 17 parts by weight of the resin and 10 parts by weight of the catalyst. 73 parts by weight of a mixture of properly shaped silver flake particles are added. The resulting adhesive is curable at room temperature to provide a high-temperature, high-strength, electrically conductive adhesive.

    Abstract translation: 导电环氧类粘合剂。 环氧树脂选自胺树脂改性环氧树脂系列，其由作为苯基甲醛异氰酸酯树脂家族的聚环氧基氨基苯基树脂和聚环己基醚的组合的树脂组成，催化剂是来自脂肪族酰胺系的一个成员加上来自脂肪族 多胺家族 在一个实施方案中包括17重量份的树脂和10重量份的催化剂。 加入73重量份适当形状的银薄片颗粒的混合物。 所得粘合剂在室温下是可固化的，以提供高温，高强度的导电粘合剂。

    Electrical interconnection means
    94.
    发明授权
    Electrical interconnection means 失效
    电气互连方式

    公开(公告)号：US4640981A

    公开(公告)日：1987-02-03

    申请号：US765625

    申请日：1985-08-14

    Applicant: Ronald A. Dery ,  Warren C. Jones

    Inventor： Ronald A. Dery ,  Warren C. Jones

    IPC: H01R4/04 ,  H05K1/00 ,  H05K1/09 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H01R4/00 ,  H01B7/08

    CPC classification number: H01R12/61 ,  H01R4/04 ,  H05K3/321 ,  H05K3/361 ,  H05K1/0393 ,  H05K1/095 ,  H05K2201/0272 ,  H05K2201/10727 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  H05K2203/1453 ,  H05K3/305

    Abstract: An interconnecting means is comprised of one or more conductive ink conductors screen printed onto a first substrate, the conductive ink being comprised of an insulating polymer medium having first and second groups of conductive particles therein, and an insulating layer of flowable adhesive in covering relationship to the conductors. The first group of particles are finely divided particles which are suspended in the medium and form a continuous conductive path along the length of the conductor. The second group of particles are agglomerates of large particles which are randomly scattered throughout the conductive path and project above the surface of the medium. Interconnection is effected by positioning the first substrate conductors in an overlapping conducting relationship to the conductors on the second substrate such that the flowable adhesive is deposited between the two substrates and applying pressure to the positioned conductors and surrounding areas. The adhesive flows from the positioned areas, exposes the protruding agglomerates, thus bringing the agglomerates into contact and electrical interconnection with the second substrate conductors accompanied by the adhesion of the remaining first substrate surface to the surface of the second substrate.

    Abstract translation: 互连装置包括丝网印刷到第一基底上的一个或多个导电油墨导体，该导电油墨包括其中具有第一和第二组导电颗粒的绝缘聚合物介质，以及可流动粘合剂的绝缘层，覆盖关系 导体。 第一组颗粒是细分散的颗粒，其悬浮在介质中并沿着导体的长度形成连续的导电路径。 第二组颗粒是大颗粒的附聚物，其随机散布在整个导电路径中并突出在介质表面之上。 通过将第一衬底导体定位成与第二衬底上的导体重叠的导电关系来实现互连，使得可流动粘合剂沉积在两个衬底之间并且对定位的导体和周围区域施加压力。 粘合剂从定位的区域流动，暴露出突出的聚集体，从而使附聚物与第二基底导体接触并与之互连，伴随着剩余的第一基底表面与第二基底的表面的粘附。

    Multilayer wiring board
    97.
    发明授权
    Multilayer wiring board 有权
    多层接线板

    公开(公告)号：US09420706B2

    公开(公告)日：2016-08-16

    申请号：US14164900

    申请日：2014-01-27

    Applicant: Tatsuta Electric Wire & Cable Co., Ltd.

    Inventor： Norihiro Yamaguchi ,  Hiroaki Umeda ,  Ken Yukawa

    IPC: H05K1/09 ,  H05K3/46 ,  H01B1/22 ,  H05K3/40 ,  H05K1/02 ,  H05K3/00

    CPC classification number: H05K3/46 ,  H01B1/22 ,  H05K1/0298 ,  H05K1/095 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/462 ,  H05K2201/0191 ,  H05K2201/0272 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0278 ,  H05K2203/0425 ,  H05K2203/1105 ,  H05K2203/111 ,  H05K2203/1194 ,  H05K2203/1461 ,  H05K2203/1572 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60° C. to 200° C., and preheating the pre-preg before the drilling step to reduce the ratio A/B to below 10.

    Abstract translation: 在制造多层板的方法中，包括：通过激光束加工形成通孔的钻孔步骤，用含有树脂成分和金属粉末的导电膏填充通孔的步骤，以及步骤 在填充的导电糊料上和下方布置图案化板的铜层或铜层部分并对其进行压制，通过使用合金糊作为导电浆料，获得导电性和长期稳定性优异的多层印刷线路板，其中至少 使用在进行预热之前，使用比例A / B为10以上的预浸料，将金属粉末的一部分熔融并且彼此相邻的金属粉末合金化，其中A是在拐点处的储能模量， 储能模量从增加到减少变化，B是在从60℃升高的温度分布中储能模量从降低到升高的拐点处的储能模量 到200℃，并且在钻井步骤之前预热预浸料以将A / B比率降低到10以下。

    OPERATING IMPRINTED THIN-FILM ELECTRONIC SENSOR STRUCTURE
    100.
    发明申请
    OPERATING IMPRINTED THIN-FILM ELECTRONIC SENSOR STRUCTURE 审中-公开
    操作薄膜薄膜电子传感器结构

    公开(公告)号：US20160047767A1

    公开(公告)日：2016-02-18

    申请号：US14460598

    申请日：2014-08-15

    Applicant: John Andrew Lebens ,  Ronald Steven Cok ,  Yongcal Wang

    Inventor： John Andrew Lebens ,  Ronald Steven Cok ,  Yongcal Wang

    IPC: G01N27/12

    CPC classification number: G01N27/126 ,  G01N27/07 ,  G02F1/13439 ,  G06F3/044 ,  G06F2203/04103 ,  H05K3/0014 ,  H05K3/1258 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/0257 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2201/0338 ,  H05K2201/0376 ,  H05K2201/2054 ,  H05K2203/0108 ,  H05K2203/1131 ,  H05K2203/1476

    Abstract: A method of operating an imprinted electronic sensor to sense an environmental factor includes providing spatially separated micro-channels in a cured layer on a substrate. A multi-layer micro-wire is formed in each micro-channel. Each multi-layer micro-wire includes at least a conductive layer and a reactive layer exposed to the environmental factor. The conductive layer is a cured electrical conductor located only within the micro-channel and at least a portion of the reactive layer responds to the environmental factor. A controller is provided for electrically controlling first and second groups of multi-layer micro-wires, each first and second group including one or more multi-layer micro-wires. The reactive layer is exposed to the environment. The controller measures the electrical response of the first and second groups of multi-layer micro-wires. The electrical response includes at least one of the amperometric response, the resistance, the capacitance, the impedance, the complex impedance, or the inductance.

    Abstract translation: 操作印刷电子传感器以感测环境因素的方法包括在基板上的固化层中提供空间分离的微通道。 在每个微通道中形成多层微线。 每个多层微线包括至少暴露于环境因素的导电层和反应层。 导电层是仅位于微通道内的固化电导体，并且反应层的至少一部分响应于环境因素。 提供一种用于电控制第一组和第二组多层微线的控制器，每个第一组和第二组包括一个或多个多层微线。 反应层暴露于环境中。 控制器测量第一组和第二组多层微线的电响应。 电响应包括电流响应，电阻，电容，阻抗，复阻抗或电感中的至少一个。

Patent Agency Ranking