中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

1000 records (took 0.025 seconds)

    NANO GRAPHENE PLATELET-BASED CONDUCTIVE INKS AND PRINTING PROCESS
    92.
    发明申请
    NANO GRAPHENE PLATELET-BASED CONDUCTIVE INKS AND PRINTING PROCESS 有权
    纳米石墨基导电墨水和印刷工艺

    公开(公告)号：US20120007913A1

    公开(公告)日：2012-01-12

    申请号：US13184787

    申请日：2011-07-18

    Applicant: Bor Z. Jang ,  Aruna Zhamu

    Inventor： Bor Z. Jang ,  Aruna Zhamu

    IPC: B41J2/015

    CPC classification number: H05K1/097 ,  C09D11/037 ,  C09D11/102 ,  C09D11/30 ,  C09D11/38 ,  C09D11/52 ,  H05K1/0212 ,  H05K1/0259 ,  H05K9/0092 ,  H05K2201/0245 ,  H05K2201/0323 ,  H05K2201/10098

    Abstract: A nano graphene platelet-based conductive ink comprising: (a) nano graphene platelets (preferably un-oxidized or pristine graphene), and (b) a liquid medium in which the nano graphene platelets are dispersed, wherein the nano graphene platelets occupy a proportion of at least 0.001% by volume based on the total ink volume and a process using the same. The ink can also contain a binder or matrix material and/or a surfactant. The ink may further comprise other fillers, such as carbon nanotubes, carbon nano-fibers, metal nano particles, carbon black, conductive organic species, etc. The graphene platelets preferably have an average thickness no greater than 10 nm and more preferably no greater than 1 nm. These inks can be printed to form a range of electrically or thermally conductive components or printed electronic components.

    Abstract translation: 一种纳米石墨烯血小板基导电油墨，其包含：（a）纳米石墨烯片晶（优选未被氧化或原始石墨烯），和（b）其中分散纳米石墨烯片晶的液体介质，其中纳米石墨烯血小板占据比例 至少为0.001体积％，以及使用该容量的方法。 油墨还可以含有粘合剂或基质材料和/或表面活性剂。 油墨还可以包含其它填料，例如碳纳米管，碳纳米纤维，金属纳米颗粒，炭黑，导电有机物质等。石墨烯薄片优选具有不大于10nm的平均厚度，更优选不大于 1nm。 这些油墨可以印刷以形成一系列导电或导热的部件或印刷的电子部件。

    Light-transmitting electric conductor, method of manufacturing the same, destaticizing sheet, and electronic device
    94.
    发明授权
    Light-transmitting electric conductor, method of manufacturing the same, destaticizing sheet, and electronic device 有权
    透光电导体及其制造方法，静电片及电子装置

    公开(公告)号：US08076583B2

    公开(公告)日：2011-12-13

    申请号：US12476786

    申请日：2009-06-02

    Applicant: Keisuke Shimizu

    Inventor： Keisuke Shimizu

    IPC: H01B5/14

    CPC classification number: H05K1/02 ,  B82Y10/00 ,  H05K1/097 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2201/0323

    Abstract: Disclosed herein is a light-transmitting electric conductor including, on a surface of a light-transmitting support, a conductive material in which a multiplicity of carbon nanolinear structures are accumulated in two dimensions while making partial contact with each other, wherein the conductive material is a light-transmitting conductive material composed only of the carbon nanolinear structures, and direct bonds are formed between the surface of the light-transmitting support and the carbon nanolinear structures making contact with the surface, and between the carbon nanolinear structures making contact with each other.

    Abstract translation: 本文公开了一种透光电导体，其在透光性支撑体的表面上具有导电材料，其中多个碳纳米线结构在两个维度上彼此积累，同时彼此部分接触，其中导电材料为 在透光性载体的表面与与表面接触的碳纳米线结构之间形成与碳纳米线结构构成的透光性导电材料和直接接合，并且在彼此接触的碳纳米线结构之间形成 。

    CONDUCTIVE PASTE AND CONDUCTIVE CIRCUIT BOARD PRODUCED THEREWITH
    95.
    发明申请
    CONDUCTIVE PASTE AND CONDUCTIVE CIRCUIT BOARD PRODUCED THEREWITH 有权
    导电胶和导电电路板生产

    公开(公告)号：US20110260115A1

    公开(公告)日：2011-10-27

    申请号：US13155367

    申请日：2011-06-07

    Applicant: Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

    Inventor： Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

    IPC: H01B1/24 ,  H01B1/22 ,  B82Y99/00

    CPC classification number: H01B1/22 ,  B82Y10/00 ,  C09D11/52 ,  H05K1/095 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323

    Abstract: A conductive paste containing silver nanoparticles and a conductive circuit board provided therewith are provided. The conductive paste containing silver nanoparticles includes 15 to 50 weight % of silver nanoparticles based on a total weight of the conductive paste, the silver nanoparticles having an average particle size of 1 to 100 nm; 0.1 to 2.5 weight % of carbon nanotubes based on the total weight of the conductive paste, the carbon nanotubes having an average diameter of 2 to 40 nm; 1 to 15 weight % of a binder based on the total weight of the conductive paste; and a solvent.

    Abstract translation: 提供含有银纳米颗粒的导电糊料和设置有导电电路板的导电电路板。 含有银纳米颗粒的导电糊料包含基于导电浆料的总重量的15至50重量％的银纳米颗粒，银纳米颗粒具有1至100nm的平均粒径; 0.1至2.5重量％的碳纳米管，基于导电浆料的总重量，碳纳米管的平均直径为2至40nm; 1〜15重量％的粘合剂，基于导电浆料的总重量; 和溶剂。

    Electronic Substrate Having Low Current Leakage and High Thermal Conductivity and Associated Methods
    96.
    发明申请
    Electronic Substrate Having Low Current Leakage and High Thermal Conductivity and Associated Methods 审中-公开
    具有低电流泄漏和高导热性和相关方法的电子基板

    公开(公告)号：US20110127562A1

    公开(公告)日：2011-06-02

    申请号：US12787074

    申请日：2010-05-25

    Applicant: Chien-Min Sung ,  Ming Chi Kan ,  Shao Chung Hu

    Inventor： Chien-Min Sung ,  Ming Chi Kan ,  Shao Chung Hu

    IPC: H01L33/00 ,  H05K1/02 ,  H05K3/00

    CPC classification number: H05K1/053 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2203/0315 ,  Y10T29/49124 ,  H01L2924/00

    Abstract: Electrical substrates having low current leakage and high thermal conductivity, including associated methods, are provided. In one aspect for example, a multilayer substrate having improved thermal conductivity and dielectric properties can include a metal layer having a working surface with a local Ra of greater than about 0.1 micron, a dielectric layer coated on the working surface of the metal layer, and a thermally conductive insulating layer disposed on the dielectric layer, wherein the multilayer substrate has a minimum resistivity between the metal layer and the thermally conductive insulating layer across all of the working surface of at least 1×106 ohms.

    Abstract translation: 提供了具有低电流泄漏和高导热性的电气基板，包括相关方法。 在一个方面，例如，具有改善的导热性和介电性能的多层基底可以包括具有局部Ra大于约0.1微米的工作表面的金属层，涂覆在金属层的工作表面上的电介质层，以及 布置在所述电介质层上的导热绝缘层，其中所述多层衬底在所述工作表面上的所述金属层和所述导热绝缘层之间具有至少为1×106欧姆的最小电阻率。

    Contacting component, method of producing the same, and test tool having the contacting component
    97.
    发明授权
    Contacting component, method of producing the same, and test tool having the contacting component 有权
    接触部件，其制造方法以及具有接触部件的试验工具

    公开(公告)号：US07952372B2

    公开(公告)日：2011-05-31

    申请号：US12968350

    申请日：2010-12-15

    Applicant: Osamu Sugihara

    Inventor： Osamu Sugihara

    IPC: G01R31/20 ,  G01R31/00

    CPC classification number: G01R3/00 ,  G01R1/0735 ,  H05K1/09 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0323 ,  H05K2201/0367 ,  H05K2203/0733 ,  Y10T29/49204

    Abstract: A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive.

    Abstract translation: 接触部件具有由电镀形成的适于与目标部分接触的探针接触。 接触部件包括绝缘基板，形成在绝缘基板的一个表面上的导电电路，并且探针接触件由导电材料制成并形成在绝缘基板的另一个表面上。 导电电路和探针接触电连接在穿过绝缘基板的通孔中。 探针接触包括凸起的凸起接触，凸起接触通过电镀形成，并且具有与目标部分接触的具有半球形突起的形状的表面。 凸点接触由含有金属和碳的材料制成，碳含量在0.2at％至1.2at％之间的范围内。

    COVER LAYER FOR PRINTED CIRCUIT BOARD
    99.
    发明申请
    COVER LAYER FOR PRINTED CIRCUIT BOARD 有权
    印刷电路板盖层

    公开(公告)号：US20110086192A1

    公开(公告)日：2011-04-14

    申请号：US12841535

    申请日：2010-07-22

    Applicant: Chih-Ming Lin ,  Shou-Jui Hsiang ,  Chien-Hui Lee

    Inventor： Chih-Ming Lin ,  Shou-Jui Hsiang ,  Chien-Hui Lee

    IPC: C09J7/02 ,  B32B5/00

    CPC classification number: H05K3/281 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T428/1476 ,  Y10T428/24975 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852

    Abstract: The present invention provides a cover film for a printed circuit board. The cover film includes an adhesive layer; a core layer made of a polymer; and a composite material layer formed on the core layer, comprising epoxy resin, a black material selected from the group consisting of a black pigment, carbon powder, nano carbon tube and a combination thereof, and an additive selected from the group consisting of titanium dioxide, boron nitride, barium sulfate and a combination thereof, wherein the core layer is disposed between the adhesive layer and the composite material layer, and the adhesive layer and the composite material layer have the same thickness or have a thickness difference being no more than 15 micro meters. The cover film of the preset invention is capable of shielding circuit patterns and has great folding endurance, and is thus applicable to flexible printed circuit boards.

    Abstract translation: 本发明提供一种印刷电路板用覆盖膜。 覆盖膜包括粘合剂层; 由聚合物制成的芯层; 以及形成在芯层上的复合材料层，包括环氧树脂，选自黑色颜料，碳粉末，纳米碳管及其组合的黑色材料，以及选自二氧化钛 ，氮化硼，硫酸钡及其组合，其中芯层设置在粘合剂层和复合材料层之间，粘合剂层和复合材料层具有相同的厚度或厚度差不超过15 微米。 本发明的覆盖膜能够屏蔽电路图案并且具有很大的折叠耐久性，因此可应用于柔性印刷电路板。

Patent Agency Ranking