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公开(公告)号：US20090284443A1
公开(公告)日：2009-11-19
申请号：US12357946
申请日：2009-01-22
Applicant: Jungsup Yum , Dongki Ko
Inventor： Jungsup Yum , Dongki Ko
CPC classification number: H05K3/181 , H05K1/0393 , H05K3/422 , H05K3/426 , H05K2201/0338 , H05K2201/0344 , H05K2201/09827 , Y10T428/12375 , Y10T428/12396 , Y10T428/12472 , Y10T428/12493 , Y10T428/12569 , Y10T428/12771 , Y10T428/12847 , Y10T428/12889 , Y10T428/12903 , Y10T428/1291 , Y10T428/12944
Abstract: A flexible film and a display device including the same are disclosed. The flexible film includes an insulating film including at least one hole. The insulating film further includes a first surface corresponding to an inner circumferential surface of the hole, a second surface corresponding to an upper surface of the insulating film, and a third surface corresponding to a lower surface of the insulating film. The flexible film includes a first metal layer and a second metal layer that is positioned on the first surface and at least one of the second and third surfaces. A thickness of the first metal layer is smaller than a thickness of the second metal layer.
Abstract translation: 公开了一种柔性膜和包括该柔性膜的显示装置。 柔性膜包括包括至少一个孔的绝缘膜。 绝缘膜还包括对应于孔的内周面的第一表面，对应于绝缘膜的上表面的第二表面和对应于绝缘膜的下表面的第三表面。 柔性膜包括第一金属层和位于第一表面上的第二金属层和第二表面和第三表面中的至少一个。 第一金属层的厚度小于第二金属层的厚度。
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92.发明授权Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure 有权电极结构，部件安装结构和配有部件安装结构的液晶显示单元公开(公告)号：US07592701B2
公开(公告)日：2009-09-22
申请号：US11305126
申请日：2005-12-19
Applicant: Daijiro Takano , Hikaru Fujita
Inventor： Daijiro Takano , Hikaru Fujita
CPC classification number: H05K1/111 , G02F1/13452 , H01L2924/0002 , H05K3/244 , H05K2201/0326 , H05K2201/0338 , Y02P70/611 , H01L2924/00
Abstract: An electrode structure includes at least a contact button portion that has a portion of multilayer structure of two or more conductor layers stacked and enlarged in area. A part mounting structure includes a substrate, a contact button portion which is formed on the substrate and on which a part is mounted by connection via a bump, wherein at least the contact button portion has a portion of multilayer structure of two or more conductor layers stacked, a part of which is enlarged in area. A liquid crystal display unit is equipped with the part mounting structure.
Abstract translation: 电极结构至少包括接触按钮部分，其具有堆叠并扩大面积的两个或更多个导体层的多层结构的一部分。 部件安装结构包括基板，接触按钮部分，其形成在基板上，并且通过凸块通过连接安装部件，其中至少接触按钮部分具有两个或多个导体层的多层结构的一部分 堆积，其一部分面积扩大。 液晶显示单元配备有部件安装结构。
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公开(公告)号：US20090188708A1
公开(公告)日：2009-07-30
申请号：US12409683
申请日：2009-03-24
Applicant: Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
Inventor： Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
CPC classification number: C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
Abstract: A method of manufacturing a multilayer printed circuit board including preparing a substrate board having a conductor circuit formed over the substrate board, forming an interlayer resin insulating layer on the conductor circuit formed over the substrate board by press laminating on the conductor circuit a film comprising a cycloolefin resin under vacuum or reduced pressure, and forming a via hole connecting to the conductor circuit through the resin insulating layer, the forming of the via hole including plating the via hole to fill up.
Abstract translation: 一种多层印刷电路板的制造方法，其特征在于，包括：准备在所述基板上形成有导体电路的基板，在所述导体电路上形成在所述导体电路上形成的层间树脂绝缘层， 在真空或减压下形成环烯烃树脂，并且通过树脂绝缘层形成连接到导体电路的通孔，形成通孔，其中电镀通孔以填满。
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公开(公告)号：US20090183904A1
公开(公告)日：2009-07-23
申请号：US12409670
申请日：2009-03-24
Applicant: Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
Inventor： Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
IPC: H05K1/00
CPC classification number: C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
Abstract: A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.
Abstract translation: 一种多层印刷电路板，包括形成在基板上的基板和叠层结构。 组合结构包括导体电路和树脂绝缘层。 积层结构具有通过一个或多个树脂绝缘层将导体电路互连的通孔。 通孔填充有电镀，树脂绝缘层由环烯烃树脂形成。
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公开(公告)号：US07523548B2
公开(公告)日：2009-04-28
申请号：US10580948
申请日：2004-12-02
Applicant: Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi
Inventor： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi
CPC classification number: H05K3/06 , H05K3/381 , H05K3/388 , H05K2201/0338 , H05K2201/098 , Y10T29/49124 , Y10T29/49155 , Y10T29/5164
Abstract: A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.
Abstract translation: 一种制造印刷电路板的方法包括以下步骤：在绝缘膜的至少一个表面上沉积贱金属以形成贱金属层，并进一步沉积铜或铜合金以形成导电金属层，然后除去表面 通过蚀刻形成布线图案，然后用能够溶解和/或钝化形成基底金属层的金属的处理液对基底金属层进行处理。 所提供的印刷电路板包括绝缘膜和形成在绝缘膜的至少一个表面上的布线图案，布线图案包括沉积在绝缘膜表面上的基底金属层和导电金属层，所述基底金属层用于 形成布线图案比形成布线图案的导电金属层的宽度方向突出。
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Patent Agency Ranking
公开(公告)号：US20090020324A1
公开(公告)日：2009-01-22
申请号：US12219208
申请日：2008-07-17
Applicant: Katsutoshi Kamei , Visit Thaveeprungsriporn , Kazuya Nakamura
Inventor： Katsutoshi Kamei , Visit Thaveeprungsriporn , Kazuya Nakamura
IPC: H05K1/09
CPC classification number: H05K1/056 , G11B5/486 , H05K1/0237 , H05K1/028 , H05K3/244 , H05K3/28 , H05K2201/0338 , H05K2201/057 , H05K2203/1105 , H05K2203/302
Abstract: A wired circuit board comprises a metal supporting board, a metal foil formed on the metal supporting board, a first protecting layer formed on the surface of the metal foil, the first protecting layer is made of tin or a tin alloy, a first insulating layer formed on the metal supporting board to cover the first protecting layer, a conductive pattern formed on the insulating layer, and a second protecting layer formed on the surface of the conductive pattern, the second protecting layer is made of tin or a tin alloy.
Abstract translation: 布线电路板包括金属支撑板，形成在金属支撑板上的金属箔，形成在金属箔表面上的第一保护层，第一保护层由锡或锡合金制成，第一绝缘层 形成在所述金属支撑板上以覆盖所述第一保护层，形成在所述绝缘层上的导电图案，以及形成在所述导电图案的表面上的第二保护层，所述第二保护层由锡或锡合金制成。
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公开(公告)号：US07476812B2
公开(公告)日：2009-01-13
申请号：US11508277
申请日：2006-08-23
Applicant: Kanako Nakajima , Masatoshi Inaba , Yoshiharu Unami
Inventor： Kanako Nakajima , Masatoshi Inaba , Yoshiharu Unami
IPC: H05K1/00
CPC classification number: H05K1/0281 , H05K3/0061 , H05K3/06 , H05K2201/0338 , H05K2201/2009 , H05K2203/1184
Abstract: A printed circuit board includes a flexible insulated substrate with a first surface and a second surface at both sides respectively, a wiring layer on the first surface, a reinforcement plate on a part of the second surface and an auxiliary layer between the second surface and the reinforcement plate. A reinforcement edge side of the reinforcement plate is located at the outside of an auxiliary edge side of the auxiliary layer.
Abstract translation: 印刷电路板包括分别具有第一表面和第二表面的柔性绝缘基板，第一表面上的布线层，第二表面的一部分上的加强板和第二表面与第二表面之间的辅助层 加强板。 加强板的加强边缘侧位于辅助层的辅助边缘侧的外侧。
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98.发明授权Wired circuit forming board, wired circuit board, and thin metal layer forming method 有权有线电路板，布线电路板和薄金属层成型方法公开(公告)号：US07417316B2
公开(公告)日：2008-08-26
申请号：US11147345
申请日：2005-06-08
Applicant: Toshiki Naito , Hiroshi Yamazaki
Inventor： Toshiki Naito , Hiroshi Yamazaki
CPC classification number: C23C14/562 , C23C14/16 , H01L2924/0002 , H05K3/108 , H05K3/388 , H05K2201/0338 , H01L2924/00
Abstract: A wired circuit forming board that can provide improved adhesion between an insulating layer and a conductive pattern and can also prevent delamination in a thin metal layer, a wired circuit board for which the same wired circuit forming board is used, and a thin metal layer forming method for forming the thin metal layer. The thin metal layer 2 is formed on the insulating base layer 1 by sputtering the first metal 35 and the second metal 36 in such a condition that a first metal diffusing region 37 for the first metal 35 to be diffused and a second metal diffusing region 38 for the second metal 36 to be diffused are overlapped with each other. This can allow formation of (i) a first unevenly-distributed metal portion 4 in which the first metal 35 is unevenly distributed and which is adjacent to the insulating base layer 1, (ii) a second unevenly-distributed metal portion 5 in which the second metal 36 is unevenly distributed and which is adjacent to the conductive pattern 6, and (iii) a metal coexisting portion 3 which is interposed between the first unevenly-distributed metal portion 4 and the second unevenly-distributed metal portion 5 and in which the first metal 35 and the second metal 36 are coexistent with each other in such a relation as to be continuously present in the thin metal layer 2 without defining any boundaries therebetween.
Abstract translation: 一种布线电路形成板，其能够提供绝缘层和导电图案之间的改善的粘附性，并且还可以防止薄金属层中的分层，使用相同布线电路形成板的布线电路板和形成金属层的薄金属层 用于形成薄金属层的方法。 薄金属层2通过溅射第一金属35和第二金属36而形成在绝缘基底层1上，使得要扩散的第一金属35的第一金属扩散区37和第二金属扩散区38 因为要扩散的第二金属36彼此重叠。 这可以形成（i）第一不均匀分布的金属部分4，其中第一金属35不均匀地分布并且与绝缘基底层1相邻，（ii）第二不均匀分布的金属部分5，其中 第二金属36不均匀分布并且与导电图案6相邻，以及（iii）介于第一不均匀分布的金属部分4和第二不均匀分布的金属部分5之间的金属共存部分3，其中 第一金属35和第二金属36彼此共存，从而连续地存在于薄金属层2中而不在其间限定任何边界。
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公开(公告)号：US20080029400A1
公开(公告)日：2008-02-07
申请号：US11432929
申请日：2006-05-12
Applicant: Stephen Mazur
Inventor： Stephen Mazur
IPC: C25D5/02
CPC classification number: C25D5/02 , C23C28/321 , C23C28/322 , C23C28/34 , C23C28/341 , C23C28/345 , C23C28/3455 , C25D5/10 , H01L21/32115 , H01L21/76855 , H01L21/76873 , H01L21/76879 , H05K3/07 , H05K3/423 , H05K2201/0338 , H05K2203/0315 , H05K2203/0361
Abstract: Processes for electroplating recessed features on a substrate are provided. The processes are useful in applications such as creating Cu interconnects on integrated circuits.
Abstract translation: 提供了用于在基板上电镀凹陷特征的工艺。 这些过程在诸如在集成电路上产生Cu互连的应用中是有用的。
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100.发明授权Method for improving the thermal cycled adhesion of thick-film conductors on dielectric 失效改善电介质厚膜导体热循环粘附性的方法公开(公告)号：US07294390B2
公开(公告)日：2007-11-13
申请号：US11111317
申请日：2005-04-21
Applicant: Bradley H. Carter , Lynda G. Flederbach , John K. Isenberg
Inventor： Bradley H. Carter , Lynda G. Flederbach , John K. Isenberg
CPC classification number: H05K1/092 , C04B37/025 , C04B2237/062 , H05K3/248 , H05K2201/0338 , H05K2201/035 , Y10T428/24917 , Y10T428/24926
Abstract: An improved electrical printed circuit exhibiting a combination of enhanced solderability and outstanding adhesion with a dielectric substrate includes a stack of two different types of conductive films. The stack includes a first conductive film that is printed onto the substrate with an ink that has been specially formulated to achieve enhanced adhesion with the substrate, and a second film that is applied over the first film using an ink that has been specifically formulated to achieve enhanced solderability.
Abstract translation: 表现出增强的可焊性和与介电基片的突出粘附性的组合的改进的电印刷电路包括两种不同类型的导电膜的叠层。 该堆叠包括第一导电膜，其被印刷在具有专门配制以实现与基板的增强的粘附性的油墨的基底上;以及第二膜，其使用特别配制成实现的油墨施加在第一膜上 增强的可焊性。
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