公开(公告)号：US07002447B2

公开(公告)日：2006-02-21

申请号：US10951003

申请日：2004-09-27

Applicant: Ronald Dedert ,  Robert Heimann ,  Craig Hoffman ,  Kevin Kurtz

Inventor： Ronald Dedert ,  Robert Heimann ,  Craig Hoffman ,  Kevin Kurtz

IPC: H01C10/38

CPC classification number: H05K3/246 ,  G01F23/36 ,  H01C10/305 ,  H01C17/06526 ,  H05K1/092 ,  H05K1/167 ,  H05K2201/0347

Abstract: A resistor card for a fuel level sensor has improved resistance to corrosion and wear. The resistor card has a substrate with a resistive layer and a conductive layer. A nickel layer covers the conductive layer. A nickel-gold alloy layer covers the nickel layer. The nickel-gold alloy layer protects the conductive layer from sulfur corrosion and improves wear resistance.

Abstract translation: 用于燃料液位传感器的电阻卡具有改善的耐腐蚀和耐磨性。 电阻卡具有具有电阻层和导电层的基板。 镍层覆盖导电层。 镍 - 金合金层覆盖镍层。 镍 - 金合金层保护导电层免受硫磺腐蚀，提高耐磨性。

公开(公告)号：US06985068B2

公开(公告)日：2006-01-10

申请号：US10951308

申请日：2004-09-27

Applicant: Ronald Dedert ,  Robert Heimann ,  Craig Hoffman ,  Kevin Kurtz

Inventor： Ronald Dedert ,  Robert Heimann ,  Craig Hoffman ,  Kevin Kurtz

IPC: H01C10/32

CPC classification number: H05K3/246 ,  G01F23/36 ,  H01C10/305 ,  H01C17/06526 ,  H05K1/092 ,  H05K1/167 ,  H05K2201/0347

Abstract: A resistor card for a fuel level sensor has improved resistance to corrosion and wear. The resistor card has a substrate with a resistive layer and a conductive layer. A nickel layer covers the conductive layer. A nickel-gold alloy layer covers the nickel layer. The nickel-gold alloy layer protects the conductive layer from sulfur corrosion and improves wear resistance.

公开(公告)号：US06977130B2

公开(公告)日：2005-12-20

申请号：US10618631

申请日：2003-07-15

Applicant: Hideo Aoki ,  Chiaki Takubo ,  Atsuko Iida ,  Yasuyuki Hotta ,  Naoko Yamaguchi

Inventor： Hideo Aoki ,  Chiaki Takubo ,  Atsuko Iida ,  Yasuyuki Hotta ,  Naoko Yamaguchi

IPC: H01L21/28 ,  G03G5/05 ,  G03G9/09 ,  G03G13/26 ,  H01L21/288 ,  H01L21/3205 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/46 ,  G03G13/16 ,  B05D1/04 ,  H05C1/00

CPC classification number: H05K3/4664 ,  G03G5/056 ,  G03G9/0926 ,  G03G13/26 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15787 ,  H05K3/1266 ,  H05K3/246 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2203/0425 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/0537 ,  H01L2924/00

Abstract: A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating/softening on the intermediate transfer base; and transferring a heated/softened resin layer onto a base material by the contact and pressurization of the resin layer. In forming the second pattern, using charged particles containing conductive metal particulates, a conductor metal layer is formed by electroless plating after a metal-containing resin pattern is transferred similarly to the first pattern formation.

Abstract translation: 提供了一种制造满足成本降低，多样化的小批量生产和更短的设计，制造，评估和校正周期的电子电路的方法。 该方法包括至少形成第一图案或形成第二图案。 形成第一图案包括：通过基本上由树脂制成的带电粒子的粘附在形成在感光基底上的静电潜像上形成可见图像; 通过可见图像的接触和加压将可见图像转印到中间转印基底上; 在中间转移基体上加热/软化; 并通过树脂层的接触和加压将加热/软化的树脂层转移到基材上。 在形成第二图案时，使用含有导电金属微粒的带电粒子，在与第一图案形成类似地转移含金属的树脂图案之后，通过无电镀形成导体金属层。

公开(公告)号：US20050277282A1

公开(公告)日：2005-12-15

申请号：US11135350

申请日：2005-05-24

Applicant: Yasuyoshi Horikawa ,  Keiichi Takemoto

Inventor： Yasuyoshi Horikawa ,  Keiichi Takemoto

IPC: H05K3/40 ,  H01L29/40

CPC classification number: H05K3/4046 ,  H05K2201/0347 ,  H05K2201/10242 ,  H05K2201/10416

Abstract: A method of manufacturing a wiring substrate of the present invention, includes a step of preparing a substrate containing a semi-cured resin layer or a thermo plastic resin layer, a step of forming a through hole that passes through the substrate, a step of inserting a conductive parts in the through hole, a step of curing the semi-resin layer or the thermo plastic resin layer in a state that the resin layer is made to flow by applying a thermal press to the substrate and filling a clearance between the through hole and the conductive parts with the resin layer, and a step of forming a wiring pattern, which is connected mutually via the conductive parts, on both surface sides of the substrate.

Abstract translation: 本发明的布线基板的制造方法包括：准备含有半固化树脂层或热塑性树脂层的基板的步骤，形成贯通基板的通孔的工序， 通孔中的导电部分，在通过向基板施加热压力使树脂层流动的状态下固化半树脂层或热塑性树脂层的步骤，并填充通孔之间的间隙 和具有树脂层的导电部件，以及在基板的两个表面侧上形成经由导电部件相互连接的布线图案的步骤。

公开(公告)号：US20050253772A1

公开(公告)日：2005-11-17

申请号：US11189503

申请日：2005-07-26

Applicant: Robert Oberle

Inventor： Robert Oberle

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q9/27 ,  H05K1/09 ,  H05K1/16 ,  H05K3/24

CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  H01Q1/22 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q9/27 ,  H05K1/095 ,  H05K1/165 ,  H05K3/242 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/0191 ,  H05K2203/0769 ,  Y10T29/49016

Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.

公开(公告)号：US20050237075A1

公开(公告)日：2005-10-27

申请号：US11170852

申请日：2005-06-30

Applicant: Alan Wood ,  Tim Corbett

Inventor： Alan Wood ,  Tim Corbett

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L23/13 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42

CPC classification number: H01L24/80 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0491 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2831 ,  G01R31/2855 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2886 ,  G01R31/2889 ,  G01R31/2893 ,  H01L22/20 ,  H01L22/22 ,  H01L23/13 ,  H01L2224/16145 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723

Abstract: A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

公开(公告)号：US20050236182A1

公开(公告)日：2005-10-27

申请号：US10517058

申请日：2003-06-02

Applicant: Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

Inventor： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

IPC: H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  H05K3/16 ,  H05K3/24 ,  H05K3/38 ,  H05K1/16

CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K3/108 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/095 ,  Y10T29/49126

Abstract: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

Abstract translation: 一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。 印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理， 和（4）通过溅射粗化然后形成金属膜涂层。 印刷电路板及其制造方法的特征在于，使用含有平均粒径为4μm以下，最大粒径为15μm的金属粒子的导电糊进行印刷，制造导体布线 或更少。 另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面 被蚀刻，在表面上形成镀覆层。

公开(公告)号：US06938336B2

公开(公告)日：2005-09-06

申请号：US10272915

申请日：2002-10-18

Applicant: Toshihide Ito ,  Satoshi Nakamura

Inventor： Toshihide Ito ,  Satoshi Nakamura

IPC: H05K3/28 ,  H05K1/11 ,  H05K3/00 ,  H05K3/26 ,  H05K3/38 ,  H05K3/46 ,  H01K3/10

CPC classification number: H05K3/0094 ,  H05K3/383 ,  H05K3/385 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/0315 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T428/24917

Abstract: A resin filled board is manufactured by forming roughened surfaces on a conductive layer in a throughhole before it is filled with a resin, forming smooth surfaces on conductive layers on the top and bottom of the board, printing the resin using a mask having an opening at a position corresponding to the throughhole to selectively fill the resin in the throughhole, and curing the resin. In this way, the surface of the conductive layer around the throughhole is smoothed, so that hardly any of the resin remains on the surfaces near the throughhole when the surfaces of the board is mechanically polished after the resin is cured. Also, the filling resin will not fall down into the throughhole.

Abstract translation: 树脂填充板通过在填充树脂之前在通孔中的导电层上形成粗糙表面来制造，在基板的顶部和底部上的导电层上形成平滑表面，使用具有开口的掩模印刷树脂 与通孔对应的位置，以选择性地填充通孔中的树脂，并固化树脂。 以这种方式，通孔周围的导电层的表面被平滑化，使得在树脂固化后机械抛光板的表面时几乎没有任何树脂残留在通孔附近的表面上。 此外，填充树脂不会落入通孔中。

公开(公告)号：US06914200B2

公开(公告)日：2005-07-05

申请号：US10832436

申请日：2004-04-27

Applicant: Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H05K1/00 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  H01R12/04 ,  H05K1/11

CPC classification number: H05K3/4632 ,  H05K1/0393 ,  H05K3/244 ,  H05K3/246 ,  H05K3/247 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.

Abstract translation: 一种多层布线基板组合体，多层布线基板组装部件及其制造方法，其中可以容易地将具有高封装密度的柔性FPC通过通孔通孔和芯片通孔层叠在一起。 通过层叠多个多层布线板组装部件来层叠多层布线基板组件，该多个多层布线基板组装部件通过制备由镀铜树脂膜制成的镀铜树脂膜10，该镀铜树脂膜由具有粘合性的树脂膜制成，该树脂膜具有 在其一个表面上结合有铜箔，其中通过所述铜箔和所述树脂膜打开通孔，以及通过丝网印刷嵌入所述镀铜树脂膜的所述铜箔的所述铜箔的通孔中的导电糊状填料， 所述导电浆料填充物的前端从所述树脂膜突出。

公开(公告)号：US06914199B2

公开(公告)日：2005-07-05

申请号：US10920185

申请日：2004-08-18

Applicant: Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H05K1/00 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11 ,  H01R12/04

CPC classification number: H05K3/4635 ,  H05K1/0393 ,  H05K3/246 ,  H05K3/247 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/249996

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components having a flexible resin film with a copper foil bonded to one surface and an adhesive layer bonded to the other surface, opening a through hole in the copper plated resin film through the copper foil, resin film, and the adhesive layer, filling the through hole with a conductive paste projecting from the adhesive layer and laterally extending beyond through hole opening of the copper foil.

Abstract translation: 多层布线基板组件，多层布线基板组装部件及其制造方法。 多层布线基板组合体是将具有柔性树脂薄膜的多个多层布线基板组件与铜箔结合在一个表面上而形成的粘合剂层，并且在该镀铜树脂中开孔 通过铜箔，树脂膜和粘合剂层，用从粘合剂层突出的导电膏填充通孔，并横向延伸超过铜箔的开孔。