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    METHOD AND APPARATUS FOR USING FLEX CIRCUIT TECHNOLOGY TO CREATE AN ELECTRODE
    91.
    发明申请
    METHOD AND APPARATUS FOR USING FLEX CIRCUIT TECHNOLOGY TO CREATE AN ELECTRODE 有权
    使用柔性电路技术创建电极的方法和装置

    公开(公告)号：US20120037406A1

    公开(公告)日：2012-02-16

    申请号：US13276646

    申请日：2011-10-19

    Applicant: Kenneth M. Curry

    Inventor： Kenneth M. Curry

    IPC: H05K1/02

    CPC classification number: H05K3/247 ,  A61B5/1486 ,  A61B2562/125 ,  A61N1/05 ,  G01N27/3271 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/28 ,  H05K3/4664 ,  H05K2201/035 ,  H05K2201/09436 ,  H05K2203/0574 ,  Y10T29/4916 ,  H01L2924/00

    Abstract: A method of creating an active electrode that may include providing a flex circuit having an electrode made of a first material and providing a first mask over the flex circuit, the first mask having an offset region and an opening that exposes the electrode. The method may also include depositing a second material over the offset region and the opening, the second material being different from the first material and providing a second mask over the second material, the second mask having an opening over a portion of the second material that is over the offset region.

    Abstract translation: 一种产生有源电极的方法，其可以包括提供具有由第一材料制成的电极并在柔性电路上提供第一掩模的柔性电路，第一掩模具有偏移区域和暴露电极的开口。 该方法还可以包括在偏移区域和开口上沉积第二材料，第二材料不同于第一材料并且在第二材料上提供第二掩模，第二掩模在第二材料的一部分上具有开口， 在偏移区域之上。

    Mounting board and method of producing the same
    93.
    发明授权
    Mounting board and method of producing the same 有权
    安装板及其制造方法

    公开(公告)号：US08039760B2

    公开(公告)日：2011-10-18

    申请号：US12822611

    申请日：2010-06-24

    Applicant: Tomoharu Sagawa ,  Atsushi Kume

    Inventor： Tomoharu Sagawa ,  Atsushi Kume

    IPC: H05K1/16

    CPC classification number: H05K3/3442 ,  H05K1/095 ,  H05K1/111 ,  H05K3/247 ,  H05K3/305 ,  H05K2201/035 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913

    Abstract: A mounting board of the invention includes: an insulative base; a plurality of first conductive elements provided on the insulative base and having lands; a plurality of second conductive elements disposed on the lands; a plurality of solder pieces each disposed on each of the second conductive elements; and an electronic component which includes electrode sections each contacting each of the solder pieces, wherein the first conductive elements are made from a first element that contains at least silver; the second conductive elements are made from a second element that contains at least copper; and the solder pieces are made from a third element that contains at least tin.

    Abstract translation: 本发明的安装板包括：绝缘基座; 设置在所述绝缘基底上并具有平台的多个第一导电元件; 设置在所述焊盘上的多个第二导电元件; 多个焊料片，各自设置在每个第二导电元件上; 以及电子部件，其包括各自接触每个焊料片的电极部分，其中所述第一导电元件由至少含有银的第一元件制成; 第二导电元件由至少包含铜的第二元件制成; 并且焊料片由至少含有锡的第三元素制成。

    Electrical contact enhancing coating
    94.
    发明授权
    Electrical contact enhancing coating 有权
    电接触增强涂层

    公开(公告)号：US07910026B2

    公开(公告)日：2011-03-22

    申请号：US11641715

    申请日：2006-12-20

    Applicant: Brian K. Kyle ,  Timothy R. Mrock

    Inventor： Brian K. Kyle ,  Timothy R. Mrock

    IPC: H01B1/22 ,  H01B3/20

    CPC classification number: H01R13/03 ,  C09D5/24 ,  H05K1/095 ,  H05K3/06 ,  H05K3/247 ,  H05K2201/0245 ,  H05K2201/035 ,  Y10T428/2982

    Abstract: The electrical contact enhancing coating is a composition that includes finely divided precious metal particles mixed with a dielectric carrier to form a coating. The dielectric carrier is a vegetable oil (preferably soybean-based) carrier of the type used as a dielectric coolant in power transformers, and is preferably high in antioxidant content. In a first embodiment, the precious metal is 100% silver having an average particle size of about 5-10 μm. In a second embodiment, the precious metal is about 65-85% silver and 15-35% gold (average particle size 0.5-1.8 μm), by weight. In a third embodiment, the precious metal is about 65-85% silver, 12.5-30% gold, and 2.5-5% palladium (average particle size 0.5-1.8 μm), by weight. The precious metals may be cryogenically treated prior to mixing with the dielectric carrier.

    Abstract translation: 电接触增强涂层是包含与电介质载体混合以形成涂层的细碎的贵金属颗粒的组合物。 电介质载体是用作电力变压器中的电介质冷却剂的类型的植物油（优选大豆基）载体，优选抗氧化剂含量高。 在第一实施方案中，贵金属是​​平均粒径为约5-10μm的100％银。 在第二实施方案中，贵重金属为约65-85％的银和15-35％的金（平均粒径为0.5-1.8μm），重量百分比。 在第三个实施方案中，贵重金属的重量为约65-85％的银，12.5-30％的金和2.5-5％的钯（平均粒度为0.5-1.8μm）。 贵金属可以在与介电载体混合之前进行低温处理。

    MOUNTING BOARD AND METHOD OF PRODUCING THE SAME
    96.
    发明申请
    MOUNTING BOARD AND METHOD OF PRODUCING THE SAME 有权
    安装板及其制造方法

    公开(公告)号：US20100258341A1

    公开(公告)日：2010-10-14

    申请号：US12822611

    申请日：2010-06-24

    Applicant: Tomoharu SAGAWA ,  Atsushi Kume

    Inventor： Tomoharu SAGAWA ,  Atsushi Kume

    IPC: H05K1/09 ,  H05K3/32

    CPC classification number: H05K3/3442 ,  H05K1/095 ,  H05K1/111 ,  H05K3/247 ,  H05K3/305 ,  H05K2201/035 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913

    Abstract: A mounting board of the invention includes: an insulative base; a plurality of first conductive elements provided on the insulative base and having lands; a plurality of second conductive elements disposed on the lands; a plurality of solder pieces each disposed on each of the second conductive elements; and an electronic component which includes electrode sections each contacting each of the solder pieces, wherein the first conductive elements are made from a first element that contains at least silver; the second conductive elements are made from a second element that contains at least copper; and the solder pieces are made from a third element that contains at least tin.

    Abstract translation: 本发明的安装板包括：绝缘基座; 设置在所述绝缘基底上并具有平台的多个第一导电元件; 设置在所述焊盘上的多个第二导电元件; 多个焊料片，各自设置在每个第二导电元件上; 以及电子部件，其包括各自接触每个焊料片的电极部分，其中所述第一导电元件由至少含有银的第一元件制成; 第二导电元件由至少包含铜的第二元件制成; 并且焊料片由至少含有锡的第三元素制成。

    ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
    97.
    发明申请
    ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
    电子元件安装系统和电子元件安装方法

    公开(公告)号：US20100230472A1

    公开(公告)日：2010-09-16

    申请号：US12377903

    申请日：2007-09-06

    Applicant: Kazuo Okamoto ,  Syoichi Nishi ,  Takeshi Morita ,  Masanori Hiyoshi ,  Kazuhiko Tomoyasu

    Inventor： Kazuo Okamoto ,  Syoichi Nishi ,  Takeshi Morita ,  Masanori Hiyoshi ,  Kazuhiko Tomoyasu

    IPC: B23K31/12 ,  B23K3/06 ,  B23K1/20

    CPC classification number: H05K3/3484 ,  H01L2224/81 ,  H05K3/1216 ,  H05K3/3436 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2203/0338 ,  H05K2203/163 ,  Y02P70/613

    Abstract: In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.

    Abstract translation: 在具有用于测量印刷在电极上的焊膏的高度的高度测量装置和电子部件放置装置的安装系统中，基于测量焊料的高度的测量结果来确定焊膏的高度是正确还是错误 糊状印在电极上。 此外，基于判定结果，是否需要焊锡膏向焊料凸块的转印，如果确定需要转印，则将糊剂转印到保持在安装头中的电子部件。 由此，可以通过在处理基板上充分地添加一定量的焊料而导致由于印刷失败引起的焊料量的不足而确保安装质量。

    Electronic component placing apparatus and electronic component mounting method
    98.
    发明授权
    Electronic component placing apparatus and electronic component mounting method 有权
    电子元件放置装置和电子元件安装方法

    公开(公告)号：US07793817B2

    公开(公告)日：2010-09-14

    申请号：US12438099

    申请日：2007-09-06

    Applicant: Kazuo Okamoto ,  Syoichi Nishi ,  Takeshi Morita ,  Masanori Hiyoshi ,  Kazuhiko Tomoyasu

    Inventor： Kazuo Okamoto ,  Syoichi Nishi ,  Takeshi Morita ,  Masanori Hiyoshi ,  Kazuhiko Tomoyasu

    IPC: B23K31/02 ,  B23K37/00

    CPC classification number: H05K3/3484 ,  B23K3/0623 ,  B23K2101/40 ,  H01L2224/81 ,  H05K3/3436 ,  H05K2201/035 ,  H05K2201/094 ,  H05K2203/0139 ,  H05K2203/0338 ,  Y02P70/613

    Abstract: To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.

    Abstract translation: 提供一种电子部件放置装置和电子部件安装方法，其可以通过焊接来安装可能导致翘曲变形的电子部件时发生冷接头。 在电子部件放置装置中，电子部件16配置有形成在基板的下表面上的多个焊料凸块16a，具有膜厚分布的膜7a，其根据状态 基于表示电子部件的回流工序中的翘曲变形的状态的部件翘曲信息，在糊状物转印部24中形成多个焊料凸块各自的翘曲变形。 由此，当通过向每个焊料凸块16a额外提供足够量的焊料，通过焊接来安装可能引起翘曲变形的电子部件时，可以防止发生冷接头。

    ELECTRONIC COMPONENT PLACING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD
    100.
    发明申请
    ELECTRONIC COMPONENT PLACING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
    电子元件放置装置和电子元件安装方法

    公开(公告)号：US20100163602A1

    公开(公告)日：2010-07-01

    申请号：US12438099

    申请日：2007-09-06

    Applicant: Kazuo Okamoto ,  Syoichi Nishi ,  Takeshi Morita ,  Masanori Hiyoshi ,  Kazuhiko Tomoyasu

    Inventor： Kazuo Okamoto ,  Syoichi Nishi ,  Takeshi Morita ,  Masanori Hiyoshi ,  Kazuhiko Tomoyasu

    IPC: B23K31/02 ,  B23K3/08

    CPC classification number: H05K3/3484 ,  B23K3/0623 ,  B23K2101/40 ,  H01L2224/81 ,  H05K3/3436 ,  H05K2201/035 ,  H05K2201/094 ,  H05K2203/0139 ,  H05K2203/0338 ,  Y02P70/613

    Abstract: To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering.In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.

    Abstract translation: 提供一种电子部件放置装置和电子部件安装方法，其可以通过焊接来安装可能导致翘曲变形的电子部件时发生冷接头。 在电子部件放置装置中，电子部件16配置有形成在基板的下表面上的多个焊料凸块16a，具有膜厚分布的膜7a，其根据状态 基于表示电子部件的回流工序中的翘曲变形的状态的部件翘曲信息，在糊状物转印部24中形成多个焊料凸块各自的翘曲变形。 由此，当通过向每个焊料凸块16a额外提供足够量的焊料，通过焊接来安装可能引起翘曲变形的电子部件时，可以防止发生冷接头。

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