公开(公告)号：US07045198B2

公开(公告)日：2006-05-16

申请号：US10280762

申请日：2002-10-24

Applicant: Yasushi Nakagiri ,  Takeshi Suzuki ,  Fumio Echigo

Inventor： Yasushi Nakagiri ,  Takeshi Suzuki ,  Fumio Echigo

IPC: B32B15/00

CPC classification number: B32B5/26 ,  B32B3/266 ,  B32B5/022 ,  B32B15/14 ,  B32B2250/05 ,  B32B2250/40 ,  H05K1/036 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/10378 ,  H05K2203/0759 ,  H05K2203/1461 ,  Y10T428/24917 ,  Y10T428/249971

Abstract: The present invention provides a prepreg and a circuit board that can achieve, e.g., low interstitial via connection resistance, excellent connection stability, and high durability, regardless of materials, physical properties, and a combination of the materials of an insulating layer. The present invention also provides a method for manufacturing the prepreg and the circuit board. The prepreg of the present invention includes a laminate including at least one first layer and at least one second layer. The first layer is an insulating layer that includes a resin. The second layer has pores that connect an upper and a lower surface of the second layer, and the upper and the lower surface of the second layer differ from each other in at least one selected from open are ratio and average pore diameter. Using this prepreg makes it possible to provide a circuit board that is characterized, e.g., by low interstitial via connection resistance, excellent connection stability, and high durability.

公开(公告)号：US20060042750A1

公开(公告)日：2006-03-02

申请号：US11194606

申请日：2005-08-02

Applicant: Masahiro Usuki ,  Makoto Fujiwara ,  Shigehiro Hoshida ,  Michio Aizawa ,  Tadashi Amano

Inventor： Masahiro Usuki ,  Makoto Fujiwara ,  Shigehiro Hoshida ,  Michio Aizawa ,  Tadashi Amano

IPC: B32B37/00

CPC classification number: B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B37/12 ,  B32B2307/202 ,  B32B2307/3065 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0346 ,  H05K3/025 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31681

Abstract: A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 μm, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 μm. The polyimide adhesive layer has a Tg>400° C.

Abstract translation: 通过将聚酰胺酸清漆涂布到载体上的非常薄的铜箔上，半干燥清漆，使用热辊压机将聚酰亚胺膜层压到涂覆有漆膜的铜箔上，制备柔性金属箔/聚酰亚胺层压体 在具有受控氧浓度的气氛中处理该层压板用于溶剂去除和酰亚胺化。 由聚酰胺酸酰亚胺化得到的聚酰亚胺粘合剂层的厚度最高达6μm，聚酰亚胺膜和聚酰亚胺粘合剂层的厚度之和高达25μm。 聚酰亚胺粘合剂层的Tg> 400℃

公开(公告)号：US20050135072A1

公开(公告)日：2005-06-23

申请号：US10743527

申请日：2003-12-22

Applicant: Liangfeng Xu ,  Tommi Reinikainen ,  Arni Kujala ,  Wei Ren ,  Ian Niemi ,  Ilkka Kartio

Inventor： Liangfeng Xu ,  Tommi Reinikainen ,  Arni Kujala ,  Wei Ren ,  Ian Niemi ,  Ilkka Kartio

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0265 ,  H05K3/4641 ,  H05K2201/0352 ,  H05K2201/0358

Abstract: A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive layers and insulative layers. The outermost three layers form an interconnect structure constructed of two conductive layers surrounding an insulative-coated conductive layer. The thicknesses of the various layers are optimized to have an increased resistance to mechanical shock resulting from, for instance, a drop onto a hard surface. In addition, the optimized PWB structure has a minimized thickness and an improved resistance to connection failures resulting from cyclical thermal loads.

Abstract translation: 提供了一种多层印刷线路板（PWB）结构以及包括PWB在内的移动终端，优化了降低可靠性，热负载下的可靠电气连接和最小厚度。 PWB包括交替的导电层和绝缘层。 最外面的三层形成由围绕绝缘涂覆的导电层的两个导电层构成的互连结构。 各层的厚度被优化以具有增加的抗机械冲击的抵抗力，例如由硬质表面上的液滴引起的机械冲击。 此外，优化的PWB结构具有最小化的厚度和改善的耐循环热负载引起的连接故障。

公开(公告)号：US20050107497A1

公开(公告)日：2005-05-19

申请号：US10503490

申请日：2003-02-04

Applicant: Kazunori Akaho ,  Koji Yonezawa ,  Motohiro Yagi ,  Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

Inventor： Kazunori Akaho ,  Koji Yonezawa ,  Motohiro Yagi ,  Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  C08L63/00

CPC classification number: C08K3/346 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/269

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17×10−3 [° C.−1] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

Abstract translation: 提供树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷板，预浸料和粘合片，其具有改进的机械性能，尺寸稳定性，耐热性和阻燃性， 特别是高温物理性能。 含有100重量份热固性树脂和0.1-65重量份无机化合物的树脂组合物，该树脂组合物的平均线性膨胀系数（α2）高达17×10 -3 [ 在比树脂组合物的玻璃化转变温度高10℃的温度到比树脂的玻璃化转变温度高50℃的温度的温度范围内， 组成。

公开(公告)号：US06616976B2

公开(公告)日：2003-09-09

申请号：US09995890

申请日：2001-11-28

Applicant: Joseph R. Montano ,  James G. Shelnut

Inventor： Joseph R. Montano ,  James G. Shelnut

IPC: B05D136

CPC classification number: C23C22/83 ,  B05D7/14 ,  B05D7/148 ,  C08L63/00 ,  C09J5/02 ,  C09J2400/163 ,  C09J2463/00 ,  C23C22/52 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/0789 ,  H05K2203/0796 ,  H05K2203/124

Abstract: A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an epoxy resin composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between innerlayers in a multiplayer circuit board.

公开(公告)号：US06591490B1

公开(公告)日：2003-07-15

申请号：US09743753

申请日：2001-01-11

Applicant: Benjamin B. Ross ,  Phillip L. Jordan ,  Jeffery A. Strole ,  Edward J. Swenson

Inventor： Benjamin B. Ross ,  Phillip L. Jordan ,  Jeffery A. Strole ,  Edward J. Swenson

IPC: H05K336

CPC classification number: H05K3/4679 ,  H05K1/0269 ,  H05K3/0082 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2201/09918 ,  H05K2203/107 ,  Y10S707/99936 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49213 ,  Y10T29/5313

Abstract: A method of constructing a multilayer electric apparatus. The method includes forming a set of conductive features and a plurality of fiducial markings on a first dielectric layer in mutual reference to each other so that their relative positions are known to a first tolerance. Also, a pattern of information corresponding to a desired photoresist exposure pattern for a second layer of the multilayer electric apparatus is stored in a computer readable format. The locations of the fiducial markings on the first layer are measured and the pattern of information for the second layer is altered in correspondence to the measured locations of the fiducial markings. The updated pattern of information is used to control a laser to selectively expose the photoresist on the second layer. Finally, the first and second layers are joined to each other.

Abstract translation: 一种构造多层电气设备的方法。 该方法包括在第一介电层上相互引用形成一组导电特征和多个基准标记，使得它们的相对位置已知为第一公差。 此外，以计算机可读格式存储对应于多层电气设备的第二层的期望的光致抗蚀剂曝光图案的信息图案。 测量第一层上的基准标记的位置，并且第二层的信息图案对应于基准标记的测量位置而改变。 更新的信息模式用于控制激光器以选择性地暴露第二层上的光致抗蚀剂。 最后，第一和第二层彼此连接。

公开(公告)号：US06500566B1

公开(公告)日：2002-12-31

申请号：US09659889

申请日：2000-09-12

Applicant: Gordon Smith

Inventor： Gordon Smith

IPC: B32B3104

CPC classification number: B32B15/08 ,  B32B7/06 ,  B32B7/12 ,  B32B2307/202 ,  B32B2457/08 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0769 ,  H05K2203/0786 ,  Y10S428/901 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/265 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/31678 ,  Y10T428/31692

Abstract: A method for making a metal-clad laminate product including: providing a carrier film; depositing directly onto the carrier film a release agent layer, the release agent layer comprising an aqueous soluble polymer; forming a conductive metal layer on the release agent layer, the metal layer having a thickness of less than about 10,000 Angstroms; bonding the metal layer to a circuit board laminate layer; and removing the carrier film from the metal layer by peeling the carrier layer from the release agent layer.

Abstract translation: 一种制造覆金属层压制品的方法，包括：提供载体膜; 在载体膜上直接沉积脱模剂层，脱模剂层包含水溶性聚合物; 在所述脱模剂层上形成导电金属层，所述金属层的厚度小于约10,000埃; 将金属层粘合到电路板层压层上; 以及通过从载体层剥离脱模剂层而从金属层除去载体膜。

公开(公告)号：US06489013B2

公开(公告)日：2002-12-03

申请号：US09788465

申请日：2001-02-21

Applicant: Akira Nagai ,  Masayuki Noda

Inventor： Akira Nagai ,  Masayuki Noda

IPC: B32B300

CPC classification number: H05K3/4655 ,  C08L33/00 ,  C08L79/08 ,  C08L2666/02 ,  C09J7/10 ,  C09J179/08 ,  C09J2433/00 ,  C09J2479/08 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A resin compound, which causes very little thermal stress even when a flip chip is mounted, has a low modulus of elasticity, and a heat resistance which is sufficiently high for solder floating at 300° C., and the resin compound also can be used in an adhesive film, a metal-clad adhesive film, a circuit board, and an assembly structure. The resin compound contains (A) a polyamide imide with siloxane bond, (B) a acrylic polymer with a weight-average molecular weight of 500,000 or more, (C) a thermoset resin, and (D) a solvent.

Abstract translation: 即使安装倒装芯片也引起很少的热应力的树脂化合物具有低的弹性模量和对于在300℃下漂浮的焊料足够高的耐热性，并且还可以使用树脂化合物 在粘合膜，金属包覆的粘合膜，电路板和组装结构中。 树脂化合物含有（A）具有硅氧烷键的聚酰胺酰亚胺，（B）重均分子量为500,000以上的丙烯酸类聚合物，（C）热固性树脂和（D）溶剂。

公开(公告)号：US20020140076A1

公开(公告)日：2002-10-03

申请号：US10109680

申请日：2002-04-01

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroshi Yamazaki ,  Mineyoshi Hasegawa ,  Satoshi Tanigawa

IPC: H01L021/44 ,  H01L021/48 ,  H01L021/4763 ,  H01L023/02

CPC classification number: H05K3/4691 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/002 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  H01L2924/00

Abstract: First and second metal foil layers are laminated on opposite surfaces of a first insulating layer to form a first board. Then, the first and second metal foil layers are formed into predetermined conductor patterns respectively. Then, second and third insulating layers of second and third boards formed separately from the first board are laminated on the first and second metal foil layers through first and second adhesive layers respectively. Then, a thin layer portion is removed and thick layer portions are formed into predetermined conductor patterns respectively in third and fourth metal foil layers of the second and third boards.

Abstract translation: 第一和第二金属箔层层叠在第一绝缘层的相对表面上以形成第一板。 然后，第一和第二金属箔层分别形成预定的导体图案。 然后，分别与第一基板形成的第二和第三板的第二绝缘层和第三绝缘层分别通过第一和第二粘合剂层层压在第一和第二金属箔层上。 然后，去除薄层部分，并且将厚层部分分别形成为第二和第三板的第三和第四金属箔层中的预定导体图案。

公开(公告)号：US20020106458A1

公开(公告)日：2002-08-08

申请号：US09995890

申请日：2001-11-29

Applicant: Shipley Company, L.L.C.

Inventor： Joseph R. Montano ,  James G. Shelnut

IPC: B05D001/36

CPC classification number: C23C22/83 ,  B05D7/14 ,  B05D7/148 ,  C08L63/00 ,  C09J5/02 ,  C09J2400/163 ,  C09J2463/00 ,  C23C22/52 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/0789 ,  H05K2203/0796 ,  H05K2203/124

Abstract: A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an epoxy resin composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between innerlayers in a multiplayer circuit board.

Abstract translation: 一种用于处理微粗化金属表面以改善金属表面和聚合物材料之间的结合的方法。 该方法包括在用增粘组合物形成微粗糙化转化涂覆的金属表面之后用环氧树脂组合物对微粗糙化转化涂覆的金属表面进行后处理。 该方法可用于电路板工业中，以改善多层电路板内层之间的结合。