公开(公告)号：US20240107669A1

公开(公告)日：2024-03-28

申请号：US17952859

申请日：2022-09-26

Applicant: Infineon Technologies Austria AG

Inventor： Darryl Galipeau ,  Danny Clavette ,  Darryl TSCHIRHART

IPC: H05K1/14 ,  H02M3/00 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/14 ,  H02M3/003 ,  H05K1/141 ,  H05K1/145 ,  H05K1/18 ,  H05K3/366 ,  H02M3/1584 ,  H05K2201/047 ,  H05K2201/09163 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166

Abstract: A circuit board assembly may include a first circuit board including a first slot. The circuit board assembly may include a second circuit board. The first circuit board may be interlocked with the second circuit board via interlocking provided by the second circuit board into the first slot.

公开(公告)号：US20230300985A1

公开(公告)日：2023-09-21

申请号：US18325551

申请日：2023-05-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jie SUN ,  Ruiming MO ,  Xichen YANG ,  Yi XU

IPC: H05K1/14 ,  H05K1/02

CPC classification number: H05K1/144 ,  H05K1/0209 ,  H05K2201/042 ,  H05K2201/047 ,  H05K2201/10098 ,  H05K2201/10719

Abstract: Embodiments of this application disclose an electronic component and an electronic device, to achieve a three-dimensional stacked structure, reduce an area, and improve heat dissipation. In embodiments of this application, the electronic component includes an upper cover plate, a lower cover plate, and an enclosure frame. The upper cover plate carries a first circuit. The lower cover plate carries a second circuit. The enclosure frame is separately connected to the upper cover plate and the lower cover plate. An interconnection circuit is disposed in the enclosure frame, and the interconnection circuit is configured to implement interconnection between the first circuit and the second circuit. The first circuit and the second circuit overlap in a vertical direction without interfering with each other.

公开(公告)号：US20230199962A1

公开(公告)日：2023-06-22

申请号：US18078238

申请日：2022-12-09

Applicant: Silergy Semiconductor Technology (Hangzhou) LTD

Inventor： Gao Fan ,  Chen Zhao

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/14 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0014 ,  H05K2201/08 ,  H05K2201/047

Abstract: A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.

公开(公告)号：US20180352666A1

公开(公告)日：2018-12-06

申请号：US15779254

申请日：2016-10-19

Applicant: Robert Bosch GmbH

Inventor： Uwe Liskow

IPC: H05K5/00 ,  H05K1/14 ,  H05K3/28 ,  H05K3/36 ,  H05K5/06

CPC classification number: H05K5/0082 ,  H05K1/144 ,  H05K3/28 ,  H05K3/368 ,  H05K5/0069 ,  H05K5/06 ,  H05K5/062 ,  H05K2201/047

Abstract: An electronic module includes a first circuit board. The first circuit board has electronic components, spacers, a cover plate, and a casting compound. The spacers are positioned so as to rest at least in corner regions of the first circuit board. The cover plate is positioned on the spacers. The casting compound acts as an end face and seals a gap formed by the spacers between the first circuit board and the cover plate, so as to form a housing for the electronic components, which are positioned therein. The casting compound secures the cover plate to the first circuit board via positive engagement. A coefficient of linear thermal expansion of the casting compound corresponds substantially to a coefficient of linear thermal expansion of the circuit board and of the cover plate.

公开(公告)号：US10057473B2

公开(公告)日：2018-08-21

申请号：US15388814

申请日：2016-12-22

Applicant: SZ DJI TECHNOLOGY CO., LTD.

Inventor： Yin Tang ,  Hualiang Qiu ,  Feihu Yang

IPC: H04N5/225 ,  H05K1/14 ,  H05K7/14

CPC classification number: H04N5/2257 ,  H04N5/225 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K7/14 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/09063 ,  H05K2203/167

Abstract: A circuit board device includes a polyhedral support frame and a circuit board unit. The circuit board unit includes two rigid boards and a flexible board connecting the two rigid boards. The two rigid boards are folded with respect to each other through the flexible board and are disposed on different sides of the support frame, respectively.

公开(公告)号：US09692160B2

公开(公告)日：2017-06-27

申请号：US14956202

申请日：2015-12-01

Applicant: STMicroelectronics (Tours) SAS

Inventor： Arnaud Edet ,  Christian Nopper

IPC: H01R12/00 ,  H01R12/71 ,  H05K1/14 ,  H01R13/66 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01R12/71 ,  H01R12/716 ,  H01R13/665 ,  H05K1/0298 ,  H05K1/14 ,  H05K1/185 ,  H05K2201/047

Abstract: An electrical connector includes a frame delimiting an elongated open cavity, and having two parallel long sides provided with contact areas capable of cooperating with contact areas of a complementary electrical connector. Each long side is formed of a multilayer printed circuit board.

公开(公告)号：US09599322B2

公开(公告)日：2017-03-21

申请号：US13678887

申请日：2011-05-10

Applicant: Raymond G. Janik ,  Carlo Scianna ,  Ted Lowl Thompson

Inventor： Raymond G. Janik ,  Carlo Scianna ,  Ted Lowl Thompson

IPC: F21V21/00 ,  F21K99/00 ,  H05K1/02 ,  H05K1/14 ,  F21V29/70 ,  F21V3/00 ,  H05K3/00 ,  F21Y101/00

CPC classification number: F21V21/00 ,  F21K9/232 ,  F21K9/90 ,  F21V3/00 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K1/14 ,  H05K3/0052 ,  H05K3/0061 ,  H05K2201/047 ,  H05K2201/10106 ,  Y10T29/49002

Abstract: A method of forming a light bulb core, and a light bulb or lamp incorporating the core. The method includes forming a heat sink having at least six working facets located equally on opposite sides of a central plane, and then mounting a light source on each of the working facets. The light sources are mounted on circuit boards, each circuit board corresponding to a respective one of the working facets. The boards are then applied to respective working facets. The bulb is composed of a screw base, an external heat sink mounted in the screw base, and the light bulb core mounted in and extending from the external heat sink. The light source comprises a plurality of light emitting diodes.

公开(公告)号：US09587807B2

公开(公告)日：2017-03-07

申请号：US14786792

申请日：2014-04-28

Applicant: CCS INC.

Inventor： Takuzo Togawa

IPC: F21V19/00 ,  F21V15/01 ,  G01N21/88 ,  F21V23/02 ,  F21V23/00 ,  H05K1/18 ,  F21V29/507 ,  H05K1/14

CPC classification number: F21V15/01 ,  F21V19/003 ,  F21V23/001 ,  F21V23/02 ,  F21V29/507 ,  F21Y2107/50 ,  F21Y2107/80 ,  G01N21/8806 ,  H05K1/148 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/10106

Abstract: A lighting apparatus which provides an heat dissipation effect, high output and large light emitting area including: housing having rectangular cylindrical shape obtained by forming belt-like body including plurality of holding bodies in rectangular cylindrical shape and connecting end portions of belt-like body formed in rectangular cylindrical shape; and circuit board mounted on inner surface of the housing and including a light source. The circuit board includes: mounting portion mounted on inner surface of the housing and having a surface provided with the light source; and connecting portion which connects mounting portions adjacent to each other in peripheral direction of the housing and is bendable at a corner of adjacent inner surfaces of the housing, and rear surface of mounting portion contacts inner surface of the holding body. Therefore, it is possible to provide lighting apparatus which provides an excellent heat dissipation effect, high output and large light emitting area.

Abstract translation: 一种提供散热效果，高输出和大发光面积的照明装置，包括：具有矩形圆柱形状的壳体，其通过形成包括多个矩形保持体的带状体形成，并且形成带状体的连接端部 矩形圆柱形; 并且电路板安装在壳体的内表面上并且包括光源。 电路板包括：安装部分，其安装在壳体的内表面上并具有设置有光源的表面; 以及连接部，其在壳体的周向连接彼此相邻的安装部，并且能够在壳体的相邻内表面的角部弯曲，并且安装部的后表面接触保持体的内表面。 因此，可以提供提供优异的散热效果，高输出和大的发光面积的照明装置。

公开(公告)号：US09288907B2

公开(公告)日：2016-03-15

申请号：US14217621

申请日：2014-03-18

Applicant: CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY ARMAMENTS BUREAU, M.N.D.

Inventor： Shao-Chung Hu ,  Kuo-Yang Horng ,  Ling-Yueh Yang ,  Wei-Ching Liu ,  Pen-Shan Chao ,  Kun-Feng Chen ,  Louis Lu-Chen Hsu

IPC: H01L23/12 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K1/14 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/11 ,  H05K1/141 ,  H05K1/148 ,  H05K1/181 ,  H05K3/32 ,  H05K3/366 ,  H05K2201/04 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/10515 ,  Y02P70/611 ,  Y10T29/49126

Abstract: A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.

Abstract translation: 介绍了微电子3D封装结构及其制造方法。 微电子3D封装结构包括具有多个第一边缘并且布置有第一电子器件的第一板; 具有多个第二边缘并且设置有第二电子设备的第二板，其中所述第二板的至少一个第二边缘连接到所述第一板的至少一个第一边缘以形成接合线; 以及设置在两个相邻板的接合线处并且适于用作传输信号的连接路径的接合连接部分。

公开(公告)号：US20150292716A1

公开(公告)日：2015-10-15

申请号：US14681444

申请日：2015-04-08

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Daiki Nakamura ,  Hisao Ikeda

IPC: F21V17/06 ,  H05K1/18 ,  F21V17/02 ,  F21V1/08 ,  F21V23/06

CPC classification number: H01L51/0097 ,  F21Y2103/00 ,  F21Y2115/20 ,  H01L2251/5338 ,  H01L2251/5361 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/2018 ,  Y02E10/549 ,  Y02P70/521

Abstract: A novel light-emitting device that is highly convenient or reliable is provided. The light-emitting device includes a framework, a flexible first light-emitting panel supported by the framework so as to form a first developable surface, and a flexible second light-emitting panel supported by the framework so as to form a second developable surface.

Abstract translation: 提供了一种非常方便或可靠的新型发光装置。 发光装置包括框架，由框架支撑以形成第一可显影表面的柔性第一发光面板和由框架支撑以形成第二可显影表面的柔性第二发光面板。