公开(公告)号：US08879275B2

公开(公告)日：2014-11-04

申请号：US13401028

申请日：2012-02-21

Applicant: Dylan J. Boday ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

IPC: H05K7/00 ,  B32B33/00 ,  B32B3/02 ,  D03D27/00 ,  D04H11/00 ,  D05C17/00

CPC classification number: C07F9/5022 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/09872 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T428/23986

Abstract: A conformal coating comprising modified porous silica particles is disclosed. A porous silica particle, such as MCM-14 or SBA-15 is modified with a sulfur gettering functionality, such as a phosphine compound, covalently bonded to silicon atoms in the porous silica particle. The conformal coating comprising the modified porous silica particles may be applied to metallic wiring areas of a circuit component, with the sulfur gettering functionality preventing sulfur from atmospheric gasses from penetrating the conformal coating to the metallic wiring.

Abstract translation: 公开了一种包含改性多孔二氧化硅颗粒的保形涂层。 诸如MCM-14或SBA-15的多孔二氧化硅颗粒用硫吸收官能团改性，例如与多孔二氧化硅颗粒中的硅原子共价结合的膦化合物。 包含改性多孔二氧化硅颗粒的保形涂层可以施加到电路部件的金属布线区域，硫吸气功能可以防止大气中的硫渗透到金属布线的保形涂层。

公开(公告)号：US20130176700A1

公开(公告)日：2013-07-11

申请号：US13735862

申请日：2013-01-07

Applicant: Blake Stevens ,  Max Sorenson ,  Alan Rae ,  Marc Chason

Inventor： Blake Stevens ,  Max Sorenson ,  Alan Rae ,  Marc Chason

IPC: H05K1/18 ,  H05K13/00

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H05K1/185 ,  H05K13/00 ,  H05K2201/09872 ,  Y10T29/49002 ,  Y10T29/49117

Abstract: A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant-coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.

Abstract translation: 防潮电子设备包括至少一部分至少部分被防潮涂层覆盖的电子部件。 防潮涂层可以位于电子设备的内部。 防潮涂层可以仅覆盖电子设备内的内部空间的边界的一部分。 防潮涂层可以包括一个或多个可辨别的边界或接缝，其可以位于电子设备的两个或更多个部件彼此接合的位置处或邻近位置处。 还公开了装配方法。

公开(公告)号：US08344268B2

公开(公告)日：2013-01-01

申请号：US12496017

申请日：2009-07-01

Applicant: Hideyuki Tsujimura ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Hiroe Kowada ,  Koso Matsuno

Inventor： Hideyuki Tsujimura ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Hiroe Kowada ,  Koso Matsuno

IPC: H05K1/11

CPC classification number: H05K3/288 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2201/0989 ,  H05K2203/0783 ,  H05K2203/1322 ,  Y10T29/49146 ,  H01L2224/0401

Abstract: An electronic component packaging structure includes a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or solubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.

Abstract translation: 电子部件封装结构包括电路板，安装在电路板上的电子部件和覆盖电子部件的防潮涂层。 防潮涂层由具有至少两层下层和上层的聚合物材料涂层构成，形成下层的聚合物材料具有较高的溶胀性和/或对所选择的修补溶剂的溶解性 与烃类溶剂相比，形成上层的聚合物材料。

公开(公告)号：US08221828B2

公开(公告)日：2012-07-17

申请号：US12209593

申请日：2008-09-12

Applicant: Jeff Chinn ,  W. Robert Ashurst ,  Adam Anderson

Inventor： Jeff Chinn ,  W. Robert Ashurst ,  Adam Anderson

IPC: B05D5/00 ,  H05K3/00 ,  B05D1/36 ,  C23C16/00 ,  B32B17/10

CPC classification number: H05K3/284 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/09872 ,  Y10T428/24355 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24388 ,  Y10T428/24405 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/269 ,  Y10T428/2839 ,  H01L2924/00

Abstract: A method of forming a film is provided. Nanoparticles are deposited on a surface of a substrate using a liquid deposition process. The nanoparticles are linked to each other and to the surface using linker molecules. A coating having a surface energy of less than 70 dyne/cm is deposited over the film to form a coated film. The coated film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than 70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on the particular environment in which the film is to be used, a durability of 10 to 500 microNewtons may be preferred. A film thickness 3 to 100 times the RMS surface roughness of the film is preferred.

Abstract translation: 提供了一种形成膜的方法。 使用液体沉积工艺将纳米颗粒沉积在基底的表面上。 使用接头分子将纳米颗粒彼此连接并连接到表面。 表面能小于70达因/厘米的涂层沉积在膜上以形成涂膜。 涂膜的RMS表面粗糙度为25nm至500nm，膜覆盖率为25％至60％，表面能小于70达因/厘米; 耐久性为10至5000微瓦。 根据使用薄膜的具体环境，可以优选10至500微瓦的耐久性。 膜的厚度为膜的RMS表面粗糙度的3〜100倍是优选的。

公开(公告)号：US07968187B2

公开(公告)日：2011-06-28

申请号：US12209629

申请日：2008-09-12

Applicant: Jeff Chinn ,  W. Robert Ashurst ,  Adam Anderson

Inventor： Jeff Chinn ,  W. Robert Ashurst ,  Adam Anderson

IPC: B32B7/12 ,  H01L23/29

CPC classification number: H05K3/284 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/09872 ,  Y10T428/24355 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24388 ,  Y10T428/24405 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/269 ,  Y10T428/2839 ,  H01L2924/00

Abstract: A composite is provided, comprising a substrate and a film on the substrate. The film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than 70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on the particular environment in which the film is to be used, a durability of 10 to 500 microNewtons may be preferred. A film thickness 3 to 100 times the RMS surface roughness of the film is preferred.

Abstract translation: 提供了一种复合材料，其包括基底和基底上的薄膜。 膜的RMS表面粗糙度为25nm至500nm，膜覆盖率为25％至60％，表面能小于70达因/厘米; 耐久性为10至5000微瓦。 根据使用薄膜的具体环境，可以优选10至500微瓦的耐久性。 膜的厚度为膜的RMS表面粗糙度的3〜100倍是优选的。

公开(公告)号：US07752751B2

公开(公告)日：2010-07-13

申请号：US12058912

申请日：2008-03-31

Applicant: Christopher James Kapusta ,  Donald Cunningham ,  Richard Joseph Saia

Inventor： Christopher James Kapusta ,  Donald Cunningham ,  Richard Joseph Saia

IPC: H01K3/10

CPC classification number: H05K9/0039 ,  C23C14/046 ,  H01L23/29 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/09872 ,  H05K2203/1311 ,  H05K2203/1361 ,  H05K2203/1366 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A system and method for providing shielding to an electrical system is disclosed. A conformal shield is formed by applying a conformal insulating coating to an electrical system. A plurality of openings are formed in the insulating coating at desired locations and a first metallic layer is deposited over the insulating coating and in each of the plurality of openings, the first metallic layer being electrically connected with the circuit board at the desired locations. A second metallic layer is then deposited onto the first metallic layer to increase a thickness of the metallic layers.

Abstract translation: 公开了一种用于向电气系统提供屏蔽的系统和方法。 通过将适形绝缘涂层施加到电气系统来形成保形屏蔽。 在绝缘涂层中在所需位置处形成多个开口，并且第一金属层沉积在绝缘涂层上方，并且在多个开口中的每一个中，第一金属层在所需位置处与电路板电连接。 然后将第二金属层沉积到第一金属层上以增加金属层的厚度。

公开(公告)号：US20100043222A1

公开(公告)日：2010-02-25

申请号：US12611376

申请日：2009-11-03

Applicant: Josh Wurzel ,  Shawn Robert Gettemy ,  Ahmad Al-Dahle ,  Carlin James Vieri ,  Wei Yao

Inventor： Josh Wurzel ,  Shawn Robert Gettemy ,  Ahmad Al-Dahle ,  Carlin James Vieri ,  Wei Yao

IPC: H05K3/20 ,  B05D5/12 ,  B29C45/14 ,  B29C45/16

CPC classification number: H05K9/0024 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/181 ,  H05K3/284 ,  H05K9/0084 ,  H05K2201/09872 ,  H05K2201/10689 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T156/1052 ,  H01L2924/00

Abstract: An electronic circuit component is provided with shielding for electromagnetic interference (“EMI”) by covering at least part of the component with a layer of electrical insulation that conforms to the shape of the surface to which the insulation is applied. At least part of the surface of the insulation is then covered by a layer of EMI shielding that conforms to the shape of the surface of the insulation to which the shielding is applied.

Abstract translation: 通过用符合施加绝缘层的表面形状的电绝缘层覆盖部件的至少一部分，电子电路部件具有屏蔽电磁干扰（“EMI”）。 绝缘体表面的至少一部分然后被符合屏蔽层所应用绝缘层表面形状的EMI屏蔽层覆盖。

公开(公告)号：US20090244878A1

公开(公告)日：2009-10-01

申请号：US12214682

申请日：2008-06-19

Applicant: Josh Wurzel ,  Shawn Robert Gettemy ,  Ahmad Al-Dahle ,  Carlin James Vieri ,  Wei Yao

Inventor： Josh Wurzel ,  Shawn Robert Gettemy ,  Ahmad Al-Dahle ,  Carlin James Vieri ,  Wei Yao

IPC: H05K9/00

CPC classification number: H05K9/0024 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/181 ,  H05K3/284 ,  H05K9/0084 ,  H05K2201/09872 ,  H05K2201/10689 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T156/1052 ,  H01L2924/00

Abstract: An electronic circuit component is provided with shielding for electro-magnetic interference (“EMI”) by covering at least part of the component with a layer of electrical insulation that conforms to the shape of the surface to which the insulation is applied. At least part of the surface of the insulation is then covered by a layer of EMI shielding that conforms to the shape of the surface of the insulation to which the shielding is applied.

Abstract translation: 通过用符合施加绝缘层的表面形状的电绝缘层覆盖部件的至少一部分，电子电路部件具有屏蔽电磁干扰（“EMI”）。 绝缘体表面的至少一部分然后被符合屏蔽层所应用绝缘层表面形状的EMI屏蔽层覆盖。

公开(公告)号：US20090110821A1

公开(公告)日：2009-04-30

申请号：US12209593

申请日：2008-09-12

Applicant: Jeff Chinn ,  W. Robert Ashurst ,  Adam Anderson

Inventor： Jeff Chinn ,  W. Robert Ashurst ,  Adam Anderson

IPC: B05D3/10

CPC classification number: H05K3/284 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/09872 ,  Y10T428/24355 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24388 ,  Y10T428/24405 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/269 ,  Y10T428/2839 ,  H01L2924/00

Abstract: A method of forming a film is provided. Nanoparticles are deposited on a surface of a substrate using a liquid deposition process. The nanoparticles are linked to each other and to the surface using linker molecules. A coating having a surface energy of less than 70 dyne/cm is deposited over the film to form a coated film. The coated film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than 70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on the particular environment in which the film is to be used, a durability of 10 to 500 microNewtons may be preferred. A film thickness 3 to 100 times the RMS surface roughness of the film is preferred.

Abstract translation: 提供了一种形成膜的方法。 使用液体沉积工艺将纳米颗粒沉积在基底的表面上。 使用接头分子将纳米颗粒彼此连接并连接到表面。 表面能小于70达因/厘米的涂层沉积在膜上以形成涂膜。 涂膜的RMS表面粗糙度为25nm至500nm，膜覆盖率为25％至60％，表面能小于70达因/厘米; 耐久性为10至5000微瓦。 根据使用薄膜的具体环境，可以优选10至500微瓦的耐久性。 膜的厚度为膜的RMS表面粗糙度的3〜100倍是优选的。

公开(公告)号：US20090110819A1

公开(公告)日：2009-04-30

申请号：US12115874

申请日：2008-05-06

Applicant: Jeffrey M. CHINN ,  Robert Ashurst ,  Adam Anderson

Inventor： Jeffrey M. CHINN ,  Robert Ashurst ,  Adam Anderson

IPC: B05D3/10

CPC classification number: H05K3/284 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/09872 ,  Y10T428/24355 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24388 ,  Y10T428/24405 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/269 ,  Y10T428/2839 ,  H01L2924/00

Abstract: A method of forming a film is provided. Nanoparticles are deposited on a surface of a substrate using a liquid deposition process. The nanoparticles are linked to each other and to the surface using linker molecules. A coating having a surface energy of less than 70 dyne/cm is deposited over the film to form a coated film. The coated film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than 70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on the particular environment in which the film is to be used, a durability of 10 to 500 microNewtons may be preferred. A film thickness 3 to 100 times the RMS surface roughness of the film is preferred.

Abstract translation: 提供了一种形成膜的方法。 使用液体沉积工艺将纳米颗粒沉积在基底的表面上。 使用接头分子将纳米颗粒彼此连接并连接到表面。 表面能小于70达因/厘米的涂层沉积在膜上以形成涂膜。 涂膜的RMS表面粗糙度为25nm至500nm，膜覆盖率为25％至60％，表面能小于70达因/厘米; 耐久性为10至5000微瓦。 根据使用薄膜的具体环境，可以优选10至500微瓦的耐久性。 膜的厚度为膜的RMS表面粗糙度的3〜100倍是优选的。