公开(公告)号：US3128332A

公开(公告)日：1964-04-07

申请号：US1875960

申请日：1960-03-30

Applicant: HUGHES AIRCRAFT CO

Inventor： BURKIG JACK W ,  RICHARDSON JOHN E

IPC: H02B1/20 ,  H05K1/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4076 ,  H02B1/207 ,  H05K1/0289 ,  H05K3/467 ,  H05K2201/0317 ,  H05K2201/09945 ,  H05K2203/175

公开(公告)号：US3019283A

公开(公告)日：1962-01-30

申请号：US80988859

申请日：1959-04-29

Applicant: THOMAS LITTLE

Inventor： THOMAS LITTLE

IPC: H01R12/00 ,  H05K1/00 ,  H05K1/03 ,  H05K3/30

CPC classification number: H05K3/306 ,  H05K1/0287 ,  H05K1/036 ,  H05K2201/09063 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10575 ,  H05K2203/1189

公开(公告)号：US20180092205A1

公开(公告)日：2018-03-29

申请号：US15614469

申请日：2017-06-05

Applicant: MC10, Inc.

Inventor： YUNG-YU HSU ,  JOHN WORK ,  KEVIN J. DOWLING

IPC: H05K1/02 ,  H01L23/538

CPC classification number: H05K1/0283 ,  A61B5/0059 ,  A61B5/6846 ,  A61B2562/164 ,  H01L23/145 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2924/15791 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration.

公开(公告)号：US09844133B2

公开(公告)日：2017-12-12

申请号：US15363579

申请日：2016-11-29

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yoshihiro Tomita ,  Koichi Hirano ,  Susumu Sawada ,  Koji Kawakita ,  Takashi Ichiryu ,  Masanori Nomura

IPC: H05K1/18 ,  H05K1/03

CPC classification number: H05K1/038 ,  H05K1/0283 ,  H05K1/0366 ,  H05K1/18 ,  H05K1/189 ,  H05K3/202 ,  H05K2201/0133 ,  H05K2201/029 ,  H05K2201/05 ,  H05K2201/09227 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: A flexible substrate is provided with: a stretchable sheet; a member located on the sheet; and a stretchable strip connected to the member, and located on the sheet. When the amount of extension of the sheet is equal to or less than a predetermined value, the sheet has a first elastic modulus, and when the amount of extension of the sheet exceeds the predetermined value, the sheet has a second elastic modulus that is greater than the first elastic modulus and greater than the elastic modulus of the strip.

公开(公告)号：US20110095419A1

公开(公告)日：2011-04-28

申请号：US12909096

申请日：2010-10-21

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tsuyoshi Kobayashi ,  Tatsuaki Denda

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tsuyoshi Kobayashi ,  Tatsuaki Denda

IPC: H01L23/498 ,  H01L21/768 ,  H05K1/11 ,  B05D5/12

CPC classification number: H05K3/3436 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01078 ,  H01L2924/12044 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0315 ,  Y02P70/613

Abstract: There is provided a conductive film. The conductive film includes: an anodized layer having a plurality of through holes extending therethrough in its thickness direction; a plurality of linear conductors each formed in a corresponding one of the through holes and each having first and second protrusions protruding from the anodized layer, wherein at least one of the first and second protrusions is covered by a coating material; and an uncured thermosetting resin layer formed on the anodized layer to cover at least one of the first and second protrusions.

Abstract translation: 提供导电膜。 导电膜包括：阳极化层，其具有在其厚度方向上延伸穿过其中的多个通孔; 多个线状导体，各自形成在所述通孔中的对应的一个中，并且每个具有从所述阳极氧化层突出的第一和第二突起，其中所述第一突起和所述第二突起中的至少一个被涂覆材料覆盖; 以及形成在所述阳极氧化层上以覆盖所述第一和第二突起中的至少一个的未固化的热固性树脂层。

公开(公告)号：US20100294552A1

公开(公告)日：2010-11-25

申请号：US12777605

申请日：2010-05-11

Applicant: Tsuyoshi KOBAYASHI ,  Michio Horiuchi ,  Yukio Shimizu ,  Yasue Tokutake

Inventor： Tsuyoshi KOBAYASHI ,  Michio Horiuchi ,  Yukio Shimizu ,  Yasue Tokutake

IPC: H05K1/16

CPC classification number: H05K3/325 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15724 ,  H01L2924/15788 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/305 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board.

Abstract translation: 一种电子部件（芯片）安装结构，包括具有端子的芯片，具有与芯片的端子电连接的端子的布线板以及设置在芯片和布线板之间的插入板，并且具有包括绝缘基底 材料具有在其厚度方向上穿透绝缘基材的大量丝状导体。 芯片的端子通过设置在插入板中的多个丝状导体电连接到布线板的端子。

公开(公告)号：US20050057906A1

公开(公告)日：2005-03-17

申请号：US10937422

申请日：2004-09-10

Applicant: Seiichi Nakatani ,  Tousaku Nishiyama

Inventor： Seiichi Nakatani ,  Tousaku Nishiyama

IPC: H05K1/02 ,  H05K3/20 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46 ,  H05K1/03

CPC classification number: H05K3/368 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01R12/523 ,  H05K1/0268 ,  H05K3/20 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4652 ,  H05K3/4694 ,  H05K2201/09945 ,  H05K2201/09972 ,  H05K2201/10378 ,  Y10T29/49126

Abstract: There is provided a connector sheet which includes an insulation sheet substrate having a front surface and a rear surface opposing to the front surface, and electrically conductive members each passing through the sheet substrate along a thickness direction of the sheet substrate, and the front surface and the rear surface contain a thermoset resin, and have tackiness under a first condition and develop adhesiveness under a second condition which is different from the first condition.

Abstract translation: 提供了一种连接器片，其包括具有与前表面相对的前表面和后表面的绝缘片基片和沿着片基片的厚度方向穿过片基片的导电部件，以及前表面和 后表面含有热固性树脂，并且在第一条件下具有粘性并且在与第一条件不同的第二条件下产生粘附性。

公开(公告)号：US6680534B2

公开(公告)日：2004-01-20

申请号：US97494701

申请日：2001-10-10

Applicant: MICRON TECHNOLOGY INC

Inventor： KINSMAN LARRY D

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/46 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K1/115 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09945 ,  H01L2924/00

Abstract: The present invention is directed to an apparatus and method for connecting integrated circuits placed on opposite sides of a circuit board through utilization of conduction elements embedded in the circuit board and extending from one surface of the board to the other. Conductive traces extend along the surface of the circuit board from the conduction elements to the integrated circuits. The conductive traces may be formed from multiple conductive layers.

Abstract translation: 本发明涉及一种用于连接放置在电路板的相对侧上的集成电路的装置和方法，该集成电路通过利用嵌入电路板中的导电元件并从板的一个表面延伸到另一个表面。 导电迹线沿着电路板的表面从导电元件延伸到集成电路。 导电迹线可以由多个导电层形成。

公开(公告)号：US20030180508A1

公开(公告)日：2003-09-25

申请号：US10388441

申请日：2003-03-17

Inventor： Ciaran Bernard McArdle ,  Rory Brian Barnes

IPC: B32B003/00

CPC classification number: H01R4/04 ,  G03F7/34 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K3/323 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2203/0769 ,  H05K2203/104 ,  Y10T428/24802 ,  H01L2924/00

Abstract: The invention provides a method of forming a monolayer of substantive particles including the steps of applying to a substrate a curable composition having substantive particles contained therein, the substantive particles having a particle size on at least one dimension thereof of at least 1 micrometer and being in two or more groups of different sizes; exposing the substantive particle-containing curable composition to a source of energy suitable for effecting polymerization of the curable composition for a sufficient time to effect polymerization of a layer of the curable composition having a thickness of no more than 50% of the height of the largest substantive particles; and optionally, removing uncured curable composition. The invention also provides a method of forming a monolayer of substantive particles in a non-random array where the curable composition comprises a ferrofluid composition. The latter method further comprises the step of subjecting the particle-containing curable ferrofluid composition to a magnetic field for a sufficient time to array the particles in a non-random manner in the composition prior to the exposure.

Abstract translation: 本发明提供了一种形成单层实质性颗粒的方法，包括以下步骤：将具有其中所含的实质性颗粒的可固化组合物施用于基材，所述实体颗粒的至少一个尺寸的颗粒尺寸至少为1微米， 两组或两组以上不同大小; 将含有实质的含颗粒的可固化组合物暴露于适于实现可固化组合物聚合足够时间的能量源，以实现可固化组合物层的厚度不超过最大厚度的50％ 实质粒子 并且任选地，除去未固化的可固化组合物。 本发明还提供了以非随机阵列形成单层实质性颗粒的方法，其中可固化组合物包含铁磁流体组合物。 后一种方法还包括以下步骤：使含有颗粒的可固化铁磁体组合物经历足够的时间以在曝光之前以非随机方式将组合物排列在组合物中。

公开(公告)号：US06402876B1

公开(公告)日：2002-06-11

申请号：US09515687

申请日：2000-02-29

Applicant: Ciaran B. McArdle ,  Joseph Burke ,  Edward K. Welch, II

Inventor： Ciaran B. McArdle ,  Joseph Burke ,  Edward K. Welch, II

IPC: B32B3100

CPC classification number: H01R4/04 ,  G03F7/34 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K3/323 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2203/0769 ,  H05K2203/104 ,  H01L2924/00

Abstract: The present invention provides a number of interrelated methods for the production of random and ordered arrays of particles and recesses, as well as films containing such arrays and recesses. The present invention also relates to the random and ordered arrays of particles and films prepared therefrom. The ordered arrays are obtained by the use of ferrofluid compositions which may be curable, solidifiable or non-curing/non-solidifiable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between leads or pads.

Abstract translation: 本发明提供了用于生产随机和有序阵列的颗粒和凹部的许多相互关联的方法，以及包含这种阵列和凹陷的膜。 本发明还涉及由其制备的颗粒和膜的随机和有序阵列。 有序阵列通过使用可固化，可固化或不固化/不可固化的铁磁流体组合物获得。 阵列和膜可以包含用于电子应用中用于实现引线或焊盘之间的接触的导电颗粒。