公开(公告)号：US09349930B2

公开(公告)日：2016-05-24

申请号：US13981821

申请日：2012-01-17

Applicant: Chung Hoon Lee

Inventor： Chung Hoon Lee

IPC: H01L33/00 ,  H01L33/64 ,  F21V23/00 ,  H05K1/02 ,  F21K99/00 ,  F21V29/15 ,  F21Y101/02 ,  F21V29/74

CPC classification number: H01L33/64 ,  F21K9/278 ,  F21V23/005 ,  F21V29/15 ,  F21V29/74 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/10106 ,  H05K2201/10575 ,  H01L2924/00

Abstract: Disclosed are a light emitting diode (LED) module and a lighting assembly. The lighting assembly comprises a light emitting device, a driver integrated circuit device for driving the light emitting device, a heat sink for dissipating heat generated from the light emitting device, and a heat shielding portion for blocking thermal interference between the driver integrated circuit device and the light emitting device. In the LED module, the driver integrated circuit device is disposed on the heat shielding portion. Accordingly, it is possible to block thermal interference between the light emitting device and the driver integrated circuit device and to decrease the size of the lighting assembly.

Abstract translation: 公开了一种发光二极管（LED）模块和照明组件。 照明组件包括发光器件，用于驱动发光器件的驱动器集成电路器件，用于散发从发光器件产生的热的散热器，以及用于阻挡驱动器集成电路器件与驱动器集成电路器件之间的热干扰的热屏蔽部分 发光装置。 在LED模块中，驱动器集成电路器件设置在热屏蔽部分上。 因此，可以阻止发光器件和驱动器集成电路器件之间的热干扰并且减小照明组件的尺寸。

公开(公告)号：US20130307016A1

公开(公告)日：2013-11-21

申请号：US13981821

申请日：2012-01-17

Applicant: Chung Hoon Lee

Inventor： Chung Hoon Lee

IPC: H01L33/64 ,  F21K99/00

CPC classification number: H01L33/64 ,  F21K9/278 ,  F21V23/005 ,  F21V29/15 ,  F21V29/74 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/10106 ,  H05K2201/10575 ,  H01L2924/00

Abstract: Disclosed are a light emitting diode (LED) module and a lighting assembly. The lighting assembly comprises a light emitting device, a driver integrated circuit device for driving the light emitting device, a heat sink for dissipating heat generated from the light emitting device, and a heat shielding portion for blocking thermal interference between the driver integrated circuit device and the light emitting device. In the LED module, the driver integrated circuit device is disposed on the heat shielding portion. Accordingly, it is possible to block thermal interference between the light emitting device and the driver integrated circuit device and to decrease the size of the lighting assembly.

Abstract translation: 公开了一种发光二极管（LED）模块和照明组件。 照明组件包括发光器件，用于驱动发光器件的驱动器集成电路器件，用于散发从发光器件产生的热的散热器，以及用于阻挡驱动器集成电路器件与驱动器集成电路器件之间的热干扰的热屏蔽部分 发光装置。 在LED模块中，驱动器集成电路器件设置在热屏蔽部分上。 因此，可以阻止发光器件和驱动器集成电路器件之间的热干扰并且减小照明组件的尺寸。

公开(公告)号：US07708473B2

公开(公告)日：2010-05-04

申请号：US12289034

申请日：2008-10-17

Applicant: Keiji Tanaka ,  Kenichiro Uchida

Inventor： Keiji Tanaka ,  Kenichiro Uchida

IPC: G02B6/36

CPC classification number: G02B6/4201 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/147 ,  H05K1/162 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/10121 ,  H05K2201/10575

Abstract: A technique is disclosed for an optical transceiver, where the frame ground is electrically isolated from the signal ground in a low frequency region and is conducted in a high frequency region, without applying a capacitor as a substantial circuit component. The transceiver includes a TOSA whose housing is grounded with the FG and connected with the driver with a FPC board. On the FPC board is formed with a parallel plate capacitor, one conductive pattern on the one surface is connected with the housing of the TOSA, while the other pattern in the opposite surface is connected with the SG. This parallel plate capacitor isolates the FG from the SG in low frequencies, while conducts the FG with the SG in high frequencies.

Abstract translation: 公开了一种用于光收发器的技术，其中框架地与低频区域中的信号地电隔离并且在高频区域中传导，而不施加电容器作为实质电路部件。 收发器包括TOSA，其外壳与FG接地，并与FPC板与驱动器连接。 在FPC基板上形成有平行平板电容器，一个表面上的一个导体图案与TOSA的外壳相连，而相反表面的另一个图案与SG连接。 这种平行电容器将FG与SG在低频下隔离，同时以高频率将SG与SG进行导通。

公开(公告)号：US5164818A

公开(公告)日：1992-11-17

申请号：US765072

申请日：1991-09-24

Applicant: Arnold Blum ,  Frank Gerth ,  Manfred Perske ,  Manfred Schmidt

Inventor： Arnold Blum ,  Frank Gerth ,  Manfred Perske ,  Manfred Schmidt

IPC: H01L23/12 ,  H01L23/48 ,  H01L23/50 ,  H01R4/02 ,  H01R4/24 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L23/48 ,  H05K3/306 ,  H05K3/32 ,  H01L2924/0002 ,  H05K2201/09472 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2203/0285 ,  H05K2203/1189 ,  H05K2203/176 ,  H05K3/281 ,  H05K3/3463

Abstract: A system for mounting VLSI devices on a substrate is disclosed, offering a high contact density. Each package consists of a semiconductor device having protruding elongated contact pin (2) on its surface and a wiring substrate having a cavity (3) on its surface. The cavities are filed with a conductive material (7) of a low melting point composition and sealed with a thin non-conductive foil (4). During packaging, the contact pins are made to penetrate the foil, and extend into the conductive alloy, thus making electrical contact therewith. To ease the penetration of the foil, the contact pins could be set into oscillating motion by means of an ultrasonic generator.

公开(公告)号：US4211890A

公开(公告)日：1980-07-08

申请号：US906742

申请日：1978-05-17

Applicant: Ryoichi Sado ,  Koichi Nei

Inventor： Ryoichi Sado ,  Koichi Nei

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H05K1/08

CPC classification number: H05K3/306 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K3/0064 ,  H05K3/325

Abstract: An electronic circuit board has protrusions of rubber-like material on the surface opposite to the surface on which the printed circuit is provided with terminal contact points located at positions in correspondence with the individual terminal contact points or with the individual groups of the terminal contact points, each of the groups being composed of the terminal contact points aligned in a row.

Abstract translation: 电子电路板在与印刷电路的表面相对的表面上具有橡胶状材料的突起，该表面设置有位于与各个端子接触点相对应的位置处的端子接触点或与端子接触点的各个组 每个组由连续排列的端子接触点构成。

公开(公告)号：US4152751A

公开(公告)日：1979-05-01

申请号：US861652

申请日：1977-12-19

Applicant: Ronald E. Sindlinger ,  Emery G. Audesse ,  Donald H. Pfefferle

Inventor： Ronald E. Sindlinger ,  Emery G. Audesse ,  Donald H. Pfefferle

IPC: F21K5/04 ,  F21K5/12 ,  G03B15/04 ,  H05B43/02 ,  H05K3/28 ,  G03B15/02

CPC classification number: H05K3/281 ,  G03B15/0442 ,  H05K2201/091 ,  H05K2201/10575 ,  H05K2203/063 ,  H05K2203/167

Abstract: A compact photoflash unit comprising a plurality of flashlamps having lead-in wires connected to a circuit board containing thereon radiation-sensitive switching circuitry for sequentially flashing the lamps. Electrically conductive reflector panels are positioned between the lamps and the circuit board, and a sheet of electrically insulating material is interposed between the reflectors and the circuit board to prevent shorting of the circuitry on the circuit board by the conductive reflector. The insulating sheet, which may be of transparent plastic, is provided with T-shaped tabs which interlock with slots in the circuit board to secure the aligned position of the insulating sheet thereon. In assembling the photoflash unit, the insulating sheet is placed on the circuit board prior to mounting the lamps, and the T-shaped tabs of the sheet are inserted in the circuit board slots to secure the aligned location of holes in the insulating sheet with lamp-mounting eyelets in the circuit board.

Abstract translation: 一种紧凑的闪光灯单元，包括多个闪光灯，其具有连接到其上包含用于顺序闪烁灯的辐射敏感切换电路的电路板的引入线。 导电反射器面板位于灯和电路板之间，并且电绝缘材料片插入在反射器和电路板之间，以防止导电反射器在电路板上的电路短路。 可以是透明塑料的绝缘片设置有与电路板中的槽互锁的T形突片，以将绝缘片的对准位置固定在其上。 在组装闪光灯单元时，在安装灯之前将绝缘片放置在电路板上，并且将片材的T形突片插入电路板槽中，以将具有灯的绝缘片中的孔的对准位置固定 - 在电路板上安装孔眼。

公开(公告)号：US3702953A

公开(公告)日：1972-11-14

申请号：US3702953D

申请日：1971-04-27

Applicant: AGFA GEVAERT AG

Inventor： FAUTH GUNTER ,  SPINNLER RAINER

IPC: G03B9/58 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0256 ,  G03B9/58 ,  H05K1/182 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2201/2036

Abstract: A printed circuit arrangement for use as a compact part of the exposure control in a photographic apparatus has an insulating plate provided with a recess for a portion of or an entire prefabricated electrical or electronic component with several coplanar terminals which contact discrete coplanar conductors applied (by printing or otherwise) to one surface of the plate. An insert of insulating material is interposed between overlapping portions of one or more conductors and one or more terminals to prevent the flow of current between those conductors and those terminals which must be insulated from each other when the plate is built into a photographic apparatus. The outline of the recess conforms to the outline of the component and the insert surrounds a portion of or the entire component and is bonded or clamped to the plate to remain in requisite position.

Abstract translation: 用作照相设备中的曝光控制的紧凑部分的印刷电路装置具有绝缘板，该绝缘板设置有用于部分或整个预制电气或电子部件的凹部，该预制电气或电子部件具有几个共面端子，该共面端子接触分立的共面导体（由 印刷或其他）到板的一个表面。 绝缘材料的插入物插入在一个或多个导体和一个或多个端子的重叠部分之间，以防止当板被内置到照相设备中时这些导体与那些必须彼此绝缘的端子之间的电流流动。 凹槽的轮廓符合部件的轮廓，并且刀片围绕部件或整个部件，并且被粘合或夹紧到板上以保持在必要位置。

公开(公告)号：US3019283A

公开(公告)日：1962-01-30

申请号：US80988859

申请日：1959-04-29

Applicant: THOMAS LITTLE

Inventor： THOMAS LITTLE

IPC: H01R12/00 ,  H05K1/00 ,  H05K1/03 ,  H05K3/30

CPC classification number: H05K3/306 ,  H05K1/0287 ,  H05K1/036 ,  H05K2201/09063 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10575 ,  H05K2203/1189

公开(公告)号：US20110062563A1

公开(公告)日：2011-03-17

申请号：US12560727

申请日：2009-09-16

Applicant: Xiaoyu Yang ,  Qing Li ,  Albert Meeks ,  Kim Le

Inventor： Xiaoyu Yang ,  Qing Li ,  Albert Meeks ,  Kim Le

IPC: H01L23/495 ,  H01L21/44 ,  H01L23/52

CPC classification number: H05K3/28 ,  G11C16/0483 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/80 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/83191 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/24 ,  H05K3/284 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/0769 ,  H05K2201/10159 ,  H05K2201/10575 ,  H05K2203/049 ,  H05K2203/1316 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Mobile ion diffusion causes a shift in the threshold voltage of non-volatile storage elements in a memory chip, such as during an assembly process of the memory chip. To reduce or avoid such shifts, a coating can be applied to a printed circuit board substrate or a leader frame to which the memory chip is surface mounted. An acrylic resin coating having a thickness of about 10 μm may be used. A memory chip is attached to the coating using an adhesive film. Stacked chips may be used as well. Another approach provides metal barrier traces over copper traces of the printed circuit board, within a solder mask layer. The metal barrier traces are fabricated in the same pattern as the copper traces but are wider so that they at least partially envelop and surround the copper traces. Corresponding apparatuses and fabrication processes are provided.

Abstract translation: 移动离子扩散导致存储芯片中的非易失性存储元件的阈值电压的偏移，例如在存储器芯片的组装过程中。 为了减少或避免这种偏移，可以将涂层施加到印刷电路板基板或表面安装存储芯片的引导框架。 可以使用厚度约为10μm的丙烯酸树脂涂层。 使用粘合膜将记忆芯片附着到涂层上。 也可以使用堆叠的芯片。 另一种方法在焊接掩模层内提供印刷电路板的铜迹线上的金属阻挡迹线。 金属阻挡迹线以与铜迹线相同的图案制造，但是更宽，使得它们至少部分地包围和包围铜迹线。 提供相应的装置和制造工艺。

公开(公告)号：US20080261353A1

公开(公告)日：2008-10-23

申请号：US12164085

申请日：2008-06-29

Applicant: Keiji Matsumoto

Inventor： Keiji Matsumoto

IPC: H01L21/00

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/1028 ,  H05K2201/10575 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

Abstract: An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board.

Abstract translation: 用于电子设备的底部填充膜包括导热片。 电子设备可以包括印刷电路板，电气部件，底部填充物和导热片。 底部填料位于电路板和组件之间。 导热片位于底部填充物内，并与底部填充物一起构成底部填充膜。 该装置可以包括将组件固定到电路板的焊料凸块，底部填充膜具有其中焊料凸块对准的孔。 电路板底面可能有焊锡凸块，有助于散热。 电路板上可能有散热片，导热片固定到散热片上，有助于散热。 导热片可以固定到促进散热的底盘上。 因此，导热片促进了从部件到至少电路板的散热。