公开(公告)号：US09532451B2

公开(公告)日：2016-12-27

申请号：US14987574

申请日：2016-01-04

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC.

Inventor： Robert Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  David Zhou

IPC: A61N1/36 ,  A61N1/375 ,  H05K1/11 ,  H05K1/09 ,  H05K1/02 ,  H05K3/40 ,  A61N1/05

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成将柔性电路连接到电子封装上的插头连接。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US09437947B2

公开(公告)日：2016-09-06

申请号：US14547497

申请日：2014-11-19

Applicant: Douglas M. Johnescu ,  Gregory A. Hull

Inventor： Douglas M. Johnescu ,  Gregory A. Hull

IPC: H01R13/60 ,  H01R12/70 ,  H05K3/30 ,  H01R12/72 ,  H01R13/518

CPC classification number: H01R12/7047 ,  H01R12/724 ,  H01R13/518 ,  H05K3/306 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10598 ,  Y10T29/49147

Abstract: An electrical connector include a movable hold down member that is configured to receive a fastener so as to secure the electrical connector to an underlying substrate to which the electrical connector is mounted.

Abstract translation: 电连接器包括可移动的压紧构件，其被配置为接收紧固件，以将电连接器固定到安装有电连接器的下面的基板。

公开(公告)号：US09370091B2

公开(公告)日：2016-06-14

申请号：US14432720

申请日：2013-10-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Manabu Kinoshita ,  Nobuo Shirokawa ,  Haruo Suenaga ,  Hisashi Morikawa ,  Hideaki Moriya

IPC: H05K5/00 ,  H05K1/02 ,  H01R12/55 ,  H01R12/71 ,  H01R4/30

CPC classification number: H05K1/0215 ,  H01R4/302 ,  H01R12/55 ,  H01R12/714 ,  H05K2201/10295 ,  H05K2201/1034 ,  H05K2201/10409

Abstract: Since a protruding portion preventing a rotation during screw fastening of a connection member is disposed to engage with an end surface of a printed circuit board, a configuration can be achieved such that the protruding portion does not interfere with an earth member, a bracket, etc. disposed on the back side of the printed circuit board, and the earth member and the bracket can freely be designed.

Abstract translation: 由于在连接构件的螺钉紧固期间防止旋转的突出部分设置成与印刷电路板的端面接合，所以可以实现这样的构造，使得突出部分不会干扰接地构件，支架等 设置在印刷电路板的背面，并且可以自由地设计接地部件和支架。

公开(公告)号：US20160158559A1

公开(公告)日：2016-06-09

申请号：US14941311

申请日：2015-11-13

Applicant: Second Sight Medical Products, Inc.

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Dao Min Zhou ,  Neil Talbot ,  Jerry Ok ,  Gailland R. Nolan

IPC: A61N1/375 ,  A61N1/05 ,  A61N1/36

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US09360167B2

公开(公告)日：2016-06-07

申请号：US14345263

申请日：2012-09-18

Applicant: CITIZEN HOLDINGS CO., LTD. ,  CITIZEN ELECTRONICS CO., LTD.

Inventor： Sadato Imai ,  Hirohiko Ishii

IPC: F21K99/00 ,  F21V29/00 ,  H01L33/60 ,  H01L33/64 ,  H01L25/075 ,  H05K3/32 ,  F21V29/51 ,  H01L33/58 ,  F21V3/00 ,  F21Y101/02 ,  F21Y111/00

CPC classification number: F21K9/23 ,  F21K9/232 ,  F21V3/00 ,  F21V29/51 ,  F21Y2107/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/60 ,  H01L33/64 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/32 ,  H05K2201/10106 ,  H05K2201/10295 ,  H05K2201/10962 ,  H01L2924/00012

Abstract: Provided is an LED module with which wide light distribution may be obtained even with a small number of attached LED devices, and which has a simple structure which may be easily assembled. An LED module includes a column-shaped mounting substrate and a plurality of LED devices. The mounting substrate has a structure further including an insulation layer between a first copper plate and a second copper plate. When mounting the plurality of LED devices on a leading end part of the mounting substrate, the first copper plate is used as the plus-side electrode, and the second copper plate is used as the minus-side electrode.

Abstract translation: 本发明提供一种LED组件，即使是少量的LED装置，也可以获得宽的配光性，并且其结构简单易于组装。 LED模块包括柱状安装基板和多个LED器件。 安装基板具有还包括在第一铜板和第二铜板之间的绝缘层的结构。 当将多个LED装置安装在安装基板的前端部时，将第一铜板用作正极侧电极，将第二铜板用作负极侧电极。

公开(公告)号：US09350092B2

公开(公告)日：2016-05-24

申请号：US14388227

申请日：2013-03-07

Applicant: KAYABA INDUSTRY CO., LTD.

Inventor： Yuki Nagai ,  Taroh Matsumae

IPC: H05K1/00 ,  H01R12/52 ,  H01R12/58 ,  H05K1/14 ,  H05K3/36 ,  H01R12/73

CPC classification number: H01R12/523 ,  H01R12/52 ,  H01R12/58 ,  H01R12/73 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/10295 ,  H05K2201/10863 ,  H05K2203/167

Abstract: An electronic substrate connecting structure is used to electrically connect a pair of electronic substrates arranged to face each other. The electronic substrate connecting structure includes a plurality of pins erected on one of the electronic substrates to electrically connect the one of the electronic substrates and the other electronic substrate, and a pin guide that has a plurality of guide holes where the pins are inserted and defines positions of the pins such that the pins are connectable to the other electronic substrate while the pins are installed in the one of the electronic substrates.

Abstract translation: 使用电子基板连接结构来电连接彼此相对布置的一对电子基板。 电子基板连接结构包括竖立在电子基板中的一个电子基板上以电连接电子基板和另一个电子基板之间的多个销，以及具有多个引导孔的销引导件，销引脚被插入并限定 销的位置使得当销安装在电子基板之一中时，销可连接到另一电子基板。

公开(公告)号：US09202798B2

公开(公告)日：2015-12-01

申请号：US13846626

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Sun Woo Yun ,  Joon Seok Chae ,  Kwang Soo Kim

IPC: H01L23/00 ,  H05K1/18 ,  H05K3/40 ,  H01L25/07 ,  H01L23/373 ,  H01L23/42 ,  H01L23/498 ,  H01L23/24

CPC classification number: H01L24/80 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/181 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10962 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/14 ,  H01L2924/0665

Abstract: Disclosed herein is a power module package including an external connection terminal; a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is buried at a predetermined depth in a thickness direction; and a semiconductor chip mounted on one surface of the substrate.

Abstract translation: 这里公开了一种功率模块封装，其包括外部连接端子; 将允许外部连接端子的一端插入其中的紧固单元埋设在厚度方向上的预定深度的基板; 以及安装在所述基板的一个表面上的半导体芯片。

公开(公告)号：US20150303596A1

公开(公告)日：2015-10-22

申请号：US14388227

申请日：2013-03-07

Applicant: KAYABA INDUSTRY CO., LTD

Inventor： Yuki NAGAI ,  Taroh MATSUMAE

IPC: H01R12/52

CPC classification number: H01R12/523 ,  H01R12/52 ,  H01R12/58 ,  H01R12/73 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/10295 ,  H05K2201/10863 ,  H05K2203/167

Abstract: An electronic substrate connecting structure is used to electrically connect a pair of electronic substrates arranged to face each other. The electronic substrate connecting structure includes a plurality of pins erected on one of the electronic substrates to electrically connect the one of the electronic substrates and the other electronic substrate, and a pin guide that has a plurality of guide holes where the pins are inserted and defines positions of the pins such that the pins are connectable to the other electronic substrate while the pins are installed in the one of the electronic substrates.

Abstract translation: 使用电子基板连接结构来电连接彼此相对布置的一对电子基板。 电子基板连接结构包括竖立在电子基板中的一个电子基板上以电连接电子基板和另一个电子基板之间的多个销，以及具有多个引导孔的销引导件，销引脚被插入并限定 销的位置使得当销安装在电子基板之一中时，销可连接到另一电子基板。

公开(公告)号：US09039453B2

公开(公告)日：2015-05-26

申请号：US14096760

申请日：2013-12-04

Applicant: Molex Incorporated

Inventor： Xiao-Jun Song

IPC: H01R13/40 ,  H01P1/00 ,  H01Q1/00 ,  H05K1/00

CPC classification number: H01P1/00 ,  H01Q1/00 ,  H05K1/00 ,  H05K3/4046 ,  H05K2201/10295

Abstract: An electrical connector includes a body, a trace, a terminal, and an engaging element. The body includes a recessed groove. The trace includes a first contact portion and a connection segment. The first contact portion is formed on a surface of the body and connected to the connection segment. The connection segment is formed on an inner surface of the recessed groove. The terminal is supported by the body and comprises a second contact portion. The terminal is partially exposed in the recessed groove and the second contact portion extends out of the body. The engaging element is provided in the recessed groove and electrically connect the connection segment and the terminal.

Abstract translation: 电连接器包括主体，轨迹，端子和接合元件。 主体包括凹槽。 迹线包括第一接触部分和连接部分。 第一接触部分形成在主体的表面上并且连接到连接段。 连接段形成在凹槽的内表面上。 端子由主体支撑并且包括第二接触部分。 端子部分地露出在凹槽中，并且第二接触部分延伸出身体。 接合元件设置在凹槽中并且电连接连接段和端子。

公开(公告)号：US08995145B2

公开(公告)日：2015-03-31

申请号：US13504807

申请日：2010-10-28

Applicant: Sumio Kagimura ,  Hiroshi Doumae

Inventor： Sumio Kagimura ,  Hiroshi Doumae

IPC: H05K3/32 ,  H01R4/34 ,  H01R12/51 ,  H01R12/58 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/32 ,  H01R4/34 ,  H01R12/515 ,  H01R12/585 ,  H05K1/0263 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10962

Abstract: A circuit board unit includes a printed circuit board and a terminal block mounted on the printed circuit board and connecting a power module and an electrical wire together. The terminal block includes a terminal connection part to be directly connected to the power module, and a wire connection part to be connected to the electrical wire. In the printed circuit board, a hole having an orthographic projection area larger than that of the terminal connection part as viewed in plane is formed. The terminal connection part is positioned below or above the hole of the printed circuit board.

Abstract translation: 电路板单元包括印刷电路板和安装在印刷电路板上并将功率模块和电线连接在一起的端子块。 端子块包括要直接连接到电源模块的端子连接部分和要连接到电线的电线连接部分。 在印刷电路板中，形成具有比平面上的端子连接部的正交投影面积大的正交投影面积的孔。 端子连接部位于印刷电路板的孔的下方或上方。