Abstract:
Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement circuits configured to compensate for parameter variations that affect the operation of memory elements, such as memory elements based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes a cross-point array comprising memory elements disposed among word lines and bit lines, where a parameter can affect the operating characteristics of a memory element. The integrated circuit further includes a data signal adjuster configured to modify the operating characteristic to compensate for a deviation from a target value for the operating characteristic based on the parameter. In some embodiments, the memory element, such as a resistive memory element, is configured to generate a data signal having a magnitude substantially at the target value independent of variation in the parameter.
Abstract:
Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement circuits configured to compensate for parameter variations in layers of memory by adjusting access signals during memory operations. In some embodiments, memory cells are based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes multiple layers of memory, a layer including sub-layers of semiconductor material. The integrated circuit also includes an access signal generator configured to generate an access signal to facilitate an access operation, and a characteristic adjuster configured to adjust the access signal for each layer in the multiple layers of memory.
Abstract:
Field programmable gate arrays using resistivity-sensitive memories are described, including a programmable cell comprising a configurable logic, a memory connected to the configurable logic to provide functions for the configurable logic, the memory comprises a non-volatile rewriteable memory element including a resistivity-sensitive memory element, an input/output logic connected to the configurable logic and the memory to communicate with other cells. The memory elements may be two-terminal resistivity-sensitive memory elements that store data in the absence of power. The two-terminal memory elements may store data as plurality of conductivity profiles that can be non-destructively read by applying a read voltage across the terminals of the memory element and data can be written to the two-terminal memory elements by applying a write voltage across the terminals. The memory can be vertically configured in one or more memory planes that are vertically stacked upon each other and are positioned above a logic plane.
Abstract:
Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to generate access signals to facilitate memory operations in scaled arrays of memory elements, such as memory implemented in third dimensional memory technology formed BEOL directly on top of a FEOL substrate that includes data access circuitry. In at least some embodiments, a non-volatile memory device can include a cross-point array having resistive memory elements disposed among word lines and subsets of bit lines, and an access signal generator. The access signal generator can be configured to modify a magnitude of a signal to generate a modified magnitude for the signal to access a resistive memory element associated with a word line and a subset of bit lines. The modified magnitude can be a function of the position of the resistive memory element in the cross-point array.
Abstract:
A re-writable memory that uses resistive memory cell elements with non-linear IV characteristics is disclosed. Non-linearity is important in certain memory arrays to prevent unselected cells from being disturbed and to reduce the required current. Non-linearity refers to the ability of the element to block the majority of current up to a certain level, but then, once that level is reached, the element allows the majority of the current over and above that level to flow.
Abstract:
A 2-terminal trapped charge memory device is disclosed with voltage switchable multi-level resistance. The trapped charge memory device has a trapped charge memory body sandwiched between two electrodes. The trapped charge memory body can be made of a variety of semiconducting or insulating materials of single-crystalline, poly-crystalline or amorphous structure while containing current carrier traps whose respective energy levels and degrees of carrier occupancy, modifiable by the height and width of an applied write voltage pulse, determine the resistance. The mechanism of modification can be through carrier tunneling, free carrier capturing, trap-hopping conduction or Frenkel-Poole conduction. The current carrier traps can be created with dopant varieties or an initialization procedure.
Abstract:
A memory array with components that can withstand high temperature fabrication is provided. Some memory materials require high temperature process steps in order to achieve desired properties. During fabrication, a memory material is deposited on structures that may include metal lines and barrier layers. Such structures are then exposed to the high temperature processing steps and should be resistant to such temperatures.
Abstract:
A multi-resistive state element that uses a treated interface is provided. A memory plug includes at least two electrodes that sandwich a multi-resistive state element. Using different treatments on both electrode/multi-resistive state element interfaces improves the memory properties of the entire memory device.
Abstract:
A device for detecting monocrystalline substrate defects, wherein a normal to the surface of the substrate is tilted by a tilt angle being contained in an angle plane, perpendicular to the surface, the device includes a detector, an illumination light source having a light beam, and arranged in a first position and/or a second position, an excitation light source illuminating the substrate and producing an emission of photoluminescence light by the substrate, imaging means imaging the substrate according to a detector field of view producing at least one image of the substrate, and processing means detecting crystalline defects using the substrate image, each illumination light source and the imaging means are arranged in a dark-field configuration, and in the first position, the illuminating light beam is parallel or quasi-parallel to the angle plane, and in the second position, the illuminating light beam is parallel or quasi-parallel to a perpendicular plane.
Abstract:
A method for characterizing structures etched in a substrate, such as a wafer is disclosed. The method includes the following steps: illuminating the bottom of at least one structure with an illumination beam issued from a light source emitting light with a wavelength adapted to be transmitted through the substrate, acquiring, with an imaging device positioned on the bottom side of said substrate, at least one image of a bottom of the at least one structure through the substrate, and measuring at least one data, called lateral data, relating to a lateral dimension of the bottom of the at least one HAR structure from the at least one acquired image. A system implementing such a method is also disclosed.