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    SILICON-ON-SAPPHIRE DEVICE WITH MINIMAL THERMAL STRAIN PRELOAD AND ENHANCED STABILITY AT HIGH TEMPERATURE
    104.
    发明申请
    SILICON-ON-SAPPHIRE DEVICE WITH MINIMAL THERMAL STRAIN PRELOAD AND ENHANCED STABILITY AT HIGH TEMPERATURE 有权
    具有最小热应变精度的SILICON-ON-SAPPHIRE器件和高温下的增强稳定性

    公开(公告)号：US20160289061A1

    公开(公告)日：2016-10-06

    申请号：US14679420

    申请日：2015-04-06

    Applicant: Honeywell International Inc.

    Inventor： Gregory C. Brown

    IPC: B81B3/00 ,  B81C1/00

    CPC classification number: B81B3/0078 ,  B81B3/004 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00904 ,  B81C2203/037 ,  G01L9/0055 ,  H01L21/76254 ,  H01L21/86

    Abstract: A silicon-on-sapphire chip with minimal thermal strain preload is provided. The chip includes a sapphire substrate having a first-sapphire surface and an opposing second-sapphire surface; and a silicon layer overlaying the first-sapphire surface. The silicon layer is formed by: creating a plurality of buried cavities in a plane within tens of microns from a first-silicon surface of a silicon wafer; laser fusing the first-silicon surface to the first-sapphire surface at room temperature to attach the silicon wafer to a sapphire wafer; and cleaving the silicon wafer along the plane including the plurality of buried cavities. A silicon-wafer layer is formed from the silicon material between the first-silicon surface and the plane of the plurality of buried cavities. The silicon-wafer layer and the sapphire wafer form a silicon-on-sapphire wafer. The silicon-on-sapphire chip is formed by dicing the silicon-on-sapphire wafer.

    Abstract translation: 提供了一种具有最小热应变预载的硅蓝宝石芯片。 该芯片包括具有第一蓝宝石表面和相对的第二蓝宝石表面的蓝宝石衬底; 以及覆盖第一蓝宝石表面的硅层。 硅层通过以下步骤形成：在距离硅晶片的第一硅表面几十微米的平面内产生多个掩埋空腔; 在室温下将第一硅表面激光熔合到第一蓝宝石表面以将硅晶片附着到蓝宝石晶片; 并且沿着包括多个掩埋腔的平面切割硅晶片。 在第一硅表面和多个掩埋腔的平面之间的硅材料形成硅晶片层。 硅晶片层和蓝宝石晶片形成蓝宝石硅片。 蓝宝石硅片通过对蓝宝石硅片进行切割而形成。

    Pressure difference sensor and method for its manufacture
    106.
    发明授权
    Pressure difference sensor and method for its manufacture 有权
    压差传感器及其制造方法

    公开(公告)号：US09442033B2

    公开(公告)日：2016-09-13

    申请号：US14434172

    申请日：2013-09-24

    Applicant: Endress + Hauser GmbH + Co. KG

    Inventor： Igor Getman ,  Rafael Teipen ,  Thomas Link ,  Peter Nommensen

    IPC: G01L9/12 ,  G01L9/00 ,  G01L13/02 ,  G01L19/06 ,  B81B3/00 ,  B81C1/00

    CPC classification number: G01L9/0072 ,  B81B3/0027 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158 ,  B81C1/00396 ,  B81C1/00531 ,  G01L9/0073 ,  G01L13/025 ,  G01L19/0618

    Abstract: A pressure difference sensor includes a measuring membrane, which is arranged between two platforms and connected pressure-tightly with the platforms, in each case, via a first insulating layer for forming pressure chambers between the platforms and the measuring membrane. The insulating layer is especially silicon oxide, wherein the pressure difference sensor further includes an electrical transducer for registering a pressure dependent deflection of the measuring membrane. The platforms have support positions, against which the measuring membrane lies at least partially in the case of overload, wherein the support positions have position dependent heights, characterized in that the support positions are formed in the first insulating layer by isotropic etching, and the particular height h of a support position, in each case, is a function of a distance from a base of the support position in the reference plane.

    Abstract translation: 压力差传感器包括测量膜，其被布置在两个平台之间，并且在每种情况下通过第一绝缘层与平台压紧连接，用于在平台和测量膜之间形成压力室。 绝缘层特别是氧化硅，其中压差传感器还包括用于记录测量膜的压力相关偏转的电传感器。 平台具有支撑位置，测量膜在过载的情况下至少部分地位于该支撑位置，其中支撑位置具有位置相关的高度，其特征在于，通过各向同性蚀刻在第一绝缘层中形成支撑位置， 在每种情况下，支撑位置的高度h是距参考平面中的支撑位置的基座的距离的函数。

    TOUCH PANEL AND ELECTRONIC DEVICE
    107.
    发明申请
    TOUCH PANEL AND ELECTRONIC DEVICE 审中-公开
    触控面板和电子设备

    公开(公告)号：US20160259485A1

    公开(公告)日：2016-09-08

    申请号：US15159063

    申请日：2016-05-19

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： Yoshiyuki KUROKAWA ,  Konami IZUMI

    IPC: G06F3/042 ,  G06F3/041

    CPC classification number: G06F3/0421 ,  B81B3/0021 ,  B81B2201/0264 ,  G02F1/13338 ,  G02F2201/44 ,  G06F3/0412 ,  G06F3/0416 ,  G06F3/042 ,  G09G3/3648 ,  H01L27/1225 ,  H01L27/1446

    Abstract: To provide a touch panel with reduced disturbance of display and with improved mechanical strength by suppressing variation in the space between a pair of substrates which form the touch panel even when in contact with an object to be detected. A pixel portion including a plurality of pixels is provided between a pair of substrates. Each pixel includes a photosensor portion which detects that the object to be detected is in contact with one of the pair of substrates, and a MEMS portion which generates a mechanical displacement in a direction perpendicular to the pair of substrates when a signal based on a detection result of the photosensor portion is input.

    Abstract translation: 通过抑制形成触摸面板的一对基板之间的空间的变化，即使在与被检测物接触的情况下，也能够提供具有降低的显示干扰和改善的机械强度的触摸面板。 包括多个像素的像素部分设置在一对基板之间。 每个像素包括光电传感器部分，其检测待检测对象与一对基板中的一个接触;以及MEMS部分，当基于检测的信号时，在垂直于该对基板的方向上产生机械位移的MEMS部分 输入光电传感器部分的结果。

    MULTI-PRESSURE MEMS PACKAGE
    109.
    发明申请
    MULTI-PRESSURE MEMS PACKAGE 有权
    多压力MEMS包装

    公开(公告)号：US20160244325A1

    公开(公告)日：2016-08-25

    申请号：US14629738

    申请日：2015-02-24

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chun-Wen Cheng ,  Chia-Hua Chu ,  Kuei-Sung Chang

    IPC: B81B7/02 ,  B81C1/00

    CPC classification number: B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/095 ,  B81C1/00293 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145

    Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) package having two MEMS devices with different pressures, and an associated method of formation. In some embodiments, the (MEMS) package includes a device substrate and a cap substrate bonded together. The bonded substrate comprises a first cavity corresponding to a first MEMS device having a first pressure and a second cavity corresponding to a second MEMS device having a different second pressure. The second cavity comprises a major volume and a vent hole connected by a lateral channel disposed between the device substrate and the cap substrate and the vent hole is hermetically sealed by a sealing structure.

    Abstract translation: 本公开涉及具有两个具有不同压力的MEMS器件的微机电系统（MEMS）封装以及相关联的形成方法。 在一些实施例中，（MEMS）封装包括结合在一起的器件衬底和帽衬底。 键合衬底包括对应于具有第一压力的第一MEMS器件的第一腔和对应于具有不同第二压力的第二MEMS器件的第二腔。 第二空腔包括主体积和通过设置在装置基板和盖基板之间的横向通道连接的通气孔，并且通气孔由密封结构气密密封。

    EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING
    110.
    发明申请
    EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING 有权
    用于高玻璃强度和稳定包装的嵌入式结构

    公开(公告)号：US20160244322A1

    公开(公告)日：2016-08-25

    申请号：US14931437

    申请日：2015-11-03

    Applicant: Continental Automotive Systems, Inc.

    Inventor： Xiaoyi Ding ,  James Nowicki

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81C1/00888 ,  B81B7/0019 ,  B81B2201/0264 ,  B81C1/00182 ,  B81C2201/019 ,  B81C2203/031 ,  B81C2203/032 ,  G01L13/025 ,  G01L19/0654

    Abstract: A sensor device is constructed to maintain a high glass strength to avoid the glass failure at low burst pressure, resulting from the sawing defects located in the critical high stress area of the glass pedestal as one of the materials used for construction of the sensor. This is achieved by forming polished recess structures in the critical high stress areas of the sawing street area. The sensor device is also constructed to have a robust bonding with the die attach material by creating a plurality of micro-posts on the mounting surface of the glass pedestal.

    Abstract translation: 传感器装置被构造成保持高的玻璃强度，以避免由于位于玻璃基座的关键高应力区域的锯切缺陷而导致的低爆破压力下的玻璃破坏，作为用于构造传感器的材料之一。 这通过在锯切街区的关键高应力区域中形成抛光的凹陷结构来实现。 传感器装置还被构造成通过在玻璃基座的安装表面上产生多个微型柱而与管芯附接材料具有牢固的结合。

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