公开(公告)号：US09828239B2

公开(公告)日：2017-11-28

申请号：US14845926

申请日：2015-09-04

Applicant: MURATA ELECTRONICS OY

Inventor： Heikki Kuisma ,  Sami Nurmi

IPC: H01L23/528 ,  B81B7/00 ,  H01L25/16 ,  H01L25/18 ,  B81C1/00 ,  H01L23/00 ,  G01P1/02 ,  H01L23/538 ,  G01L19/14 ,  G01P15/08 ,  G01C19/5783 ,  H01L25/00 ,  H01L21/56 ,  H01L27/146 ,  G01L19/00

CPC classification number: B81B7/0074 ,  B81B2201/0235 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/036 ,  B81B2207/012 ,  B81B2207/095 ,  B81C1/00333 ,  G01C19/5783 ,  G01L19/0084 ,  G01L19/148 ,  G01P1/023 ,  G01P1/026 ,  G01P15/0802 ,  H01L21/568 ,  H01L23/528 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L27/14618 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8312 ,  H01L2224/8319 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

公开(公告)号：US20170232189A1

公开(公告)日：2017-08-17

申请号：US15443484

申请日：2017-02-27

Applicant: Cam Med LLC

Inventor： Yanzhe Qin ,  Zhifei Ge

IPC: A61M5/142 ,  A61M5/145 ,  B32B37/12 ,  A61M5/168

CPC classification number: A61M5/14248 ,  A61M5/14586 ,  A61M5/16881 ,  A61M39/24 ,  A61M2005/14252 ,  A61M2205/3334 ,  A61M2205/35 ,  A61M2205/581 ,  A61M2205/582 ,  A61M2207/00 ,  B29C65/08 ,  B29C65/4825 ,  B29C66/301 ,  B29C66/474 ,  B32B37/12 ,  B32B2535/00 ,  B81B2201/036 ,  B81C1/00158 ,  B81C2201/034 ,  F04B43/043 ,  F04B53/10 ,  F16K2099/008 ,  F16K2099/0094

Abstract: A flexible patch pump for controllable accurate subcutaneous delivery of one or more medicaments to a patient includes a laminated layered structure. The pump may have a rigid reservoir layer including a number of rigid reservoirs disposed in a flexible material; a flexible microfluidic layer including a compliant membrane for sealing the rigid reservoirs, a network of microfluidic channels connecting the rigid reservoirs, and a number of inlet and/or outlet valves corresponding to the rigid reservoirs; and a flexible-rigid electronic circuit layer including a number of individually-addressable actuators. In operation, the rigid reservoirs may contain medicament that is dispensed in precise volumes at appropriate times due, for to example, to a pressure change in an addressed reservoir caused by displacement of the compliant membrane or other actuation element.

公开(公告)号：US20170001195A1

公开(公告)日：2017-01-05

申请号：US15173262

申请日：2016-06-03

Applicant: California Institute of Technology

Inventor： Marc Alexander Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake ,  Markus Enzelberger ,  Mark L. Adams ,  Carl L. Hansen

IPC: B01L3/00 ,  C12Q1/68 ,  F16K99/00

CPC classification number: B05D3/04 ,  B01J2219/00355 ,  B01J2219/00378 ,  B01J2219/00396 ,  B01J2219/00398 ,  B01J2219/00439 ,  B01J2219/005 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00612 ,  B01J2219/00621 ,  B01J2219/00659 ,  B01J2219/00707 ,  B01J2219/00722 ,  B01J2219/00725 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L7/54 ,  B01L9/527 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/0681 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2300/14 ,  B01L2300/18 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/06 ,  B01L2400/0655 ,  B01L2400/0688 ,  B32B2037/1081 ,  B65B31/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  C12Q1/6832 ,  C12Q1/6874 ,  C30B29/54 ,  F04B43/043 ,  F15C1/06 ,  F15C3/00 ,  F15C5/00 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T137/0324 ,  Y10T137/0379 ,  Y10T137/0424 ,  Y10T137/206 ,  Y10T137/2082 ,  Y10T137/2164 ,  Y10T137/2169 ,  Y10T137/2174 ,  Y10T137/2202 ,  Y10T137/2224 ,  Y10T137/3084 ,  Y10T137/7837 ,  Y10T137/86027 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24612 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Abstract translation: 一种制造弹性体结构的方法，包括：在第一微加工模具的顶部上形成第一弹性体层，所述第一微加工模具具有形成沿所述第一弹性体层的底表面延伸的第一凹槽的第一凸起突起; 在第二微加工模具的顶部上形成第二弹性体层，所述第二微加工模具具有第二凸起突起，所述第二凸起突起形成沿所述第二弹性体层的底表面延伸的第二凹槽; 将第二弹性体层的底表面粘合到第一弹性体层的顶表面上，使得控制通道在第一和第二弹性体层之间的第二凹部中形成; 以及将第一弹性体层定位在平面基底的顶部上，使得流动通道在第一弹性体层和平面基底之间的第一凹部中形成。

公开(公告)号：US20150375996A1

公开(公告)日：2015-12-31

申请号：US14845926

申请日：2015-09-04

Applicant: MURATA ELECTRONICS OY

Inventor： Heikki KUISMA

IPC: B81B7/00

CPC classification number: B81B7/0074 ,  B81B2201/0235 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/036 ,  B81B2207/012 ,  B81B2207/095 ,  B81C1/00333 ,  G01C19/5783 ,  G01L19/0084 ,  G01L19/148 ,  G01P1/023 ,  G01P1/026 ,  G01P15/0802 ,  H01L21/568 ,  H01L23/528 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L27/14618 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8312 ,  H01L2224/8319 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

Abstract translation: 公开了一种制造系统级封装器件的方法，以及一种系统级封装器件。 在该方法中，具有预定尺寸的至少一个第一种类模具，具有预定尺寸的至少一种第二种类模具，并且系统级装置中的至少一个其它部件包括在系统级封装装置中。 选择第一和第二种类模具中的至少一种用于重新定向，并且将材料添加到所选择的模具的至少一侧，使得添加的材料和所选择的模具形成重新定型的模具结构。 在重新定型的模具结构上形成连接层。 尺寸设计为重新定型的模具结构，以允许非选择的模具和至少一个另外的部件通过连接层与重新定向的模具结构接触。

公开(公告)号：US20140246618A1

公开(公告)日：2014-09-04

申请号：US14274698

申请日：2014-05-10

Applicant: RHEONIX, INC.

Inventor： Peng Zhou ,  Lincoln C. Young

IPC: F16K7/12

CPC classification number: F16K7/12 ,  B01F5/0683 ,  B01F5/0688 ,  B01F11/0071 ,  B01F13/0059 ,  B01F2215/0034 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0861 ,  B01L2300/0867 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0487 ,  B01L2400/06 ,  B01L2400/0638 ,  B01L2400/0655 ,  B01L2400/084 ,  B29C65/4895 ,  B29C66/004 ,  B29C66/54 ,  B29C66/5412 ,  B29C66/71 ,  B29K2025/00 ,  B29K2025/04 ,  B29K2033/08 ,  B29K2069/00 ,  B29K2101/12 ,  B29L2031/7496 ,  B29L2031/7506 ,  B29L2031/756 ,  B81B3/0021 ,  B81B2201/036 ,  B81B2201/054 ,  B81B2203/0127 ,  B81C1/00103 ,  B81C1/00158 ,  F04B43/028 ,  F04B43/043 ,  F04B43/06 ,  F15C1/08 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0021 ,  F16K99/0034 ,  F16K99/0055 ,  F16K99/0057 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T29/49405 ,  Y10T137/212 ,  Y10T137/2202 ,  Y10T137/2218 ,  Y10T137/8593 ,  Y10T137/85978 ,  Y10T156/1002 ,  Y10T156/1043 ,  B29K2033/12 ,  B29K2025/06

Abstract: Plastic microfluidic structures having a substantially rigid diaphragm that actuates between a relaxed state wherein the diaphragm sits against the surface of a substrate and an actuated state wherein the diaphragm is moved away from the substrate. As will be seen from the following description, the microfluidic structures formed with this diaphragm provide easy to manufacture and robust systems, as well readily made components such as valves and pumps.

Abstract translation: 塑料微流体结构具有基本上刚性的膜片，其在松弛状态之间起作用，其中隔膜抵靠衬底的表面，以及致动状态，其中隔膜移动离开衬底。 从以下描述可以看出，用这种隔膜形成的微流体结构提供易于制造和坚固的系统，以及易于制造的部件，例如阀和泵。

公开(公告)号：US08418934B2

公开(公告)日：2013-04-16

申请号：US12198267

申请日：2008-08-26

Applicant: Mehmet Arik ,  Stanton Earl Weaver

Inventor： Mehmet Arik ,  Stanton Earl Weaver

IPC: B05B1/08

CPC classification number: B81B7/0093 ,  B81B2201/036 ,  B81B2201/058 ,  B81B2203/0127 ,  B81C1/00158 ,  F04B45/047 ,  H01L23/467 ,  H01L41/0973 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A micro-electromechanical (MEM) synthetic jet actuator includes a semiconductor substrate having a cavity extending therethrough, such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The first flexible membrane also includes an orifice formed therein aligned with the first opening. The MEM synthetic jet actuator also includes a second flexible membrane that is formed on at least a portion of the second surface of the semiconductor substrate and that extends over the second opening, and a pair of actuator elements coupled to the flexible membranes and aligned with the cavity to selectively cause displacement of the first and second flexible membranes.

公开(公告)号：US08104497B2

公开(公告)日：2012-01-31

申请号：US11685654

申请日：2007-03-13

Applicant: Marc Unger ,  Hou-Pu Chou ,  Todd Thorsen ,  Axel Scherer ,  Stephen Quake ,  Markus Enzelberger ,  Mark Adams ,  Carl Hansen

Inventor： Marc Unger ,  Hou-Pu Chou ,  Todd Thorsen ,  Axel Scherer ,  Stephen Quake ,  Markus Enzelberger ,  Mark Adams ,  Carl Hansen

IPC: B08B3/04

CPC classification number: B05D3/04 ,  B01J2219/00355 ,  B01J2219/00378 ,  B01J2219/00396 ,  B01J2219/00398 ,  B01J2219/00439 ,  B01J2219/005 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00612 ,  B01J2219/00621 ,  B01J2219/00659 ,  B01J2219/00707 ,  B01J2219/00722 ,  B01J2219/00725 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L7/54 ,  B01L9/527 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/0681 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2300/14 ,  B01L2300/18 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/06 ,  B01L2400/0655 ,  B01L2400/0688 ,  B32B2037/1081 ,  B65B31/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  C12Q1/6832 ,  C12Q1/6874 ,  C30B29/54 ,  F04B43/043 ,  F15C1/06 ,  F15C3/00 ,  F15C5/00 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T137/0324 ,  Y10T137/0379 ,  Y10T137/0424 ,  Y10T137/206 ,  Y10T137/2082 ,  Y10T137/2164 ,  Y10T137/2169 ,  Y10T137/2174 ,  Y10T137/2202 ,  Y10T137/2224 ,  Y10T137/3084 ,  Y10T137/7837 ,  Y10T137/86027 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24612 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

公开(公告)号：US08075855B2

公开(公告)日：2011-12-13

申请号：US12142780

申请日：2008-06-20

Applicant: Gregory John McAvoy ,  Kia Silverbrook

Inventor： Gregory John McAvoy ,  Kia Silverbrook

IPC: F04B43/12

CPC classification number: B81C1/00246 ,  B81B2201/036 ,  F04B43/043 ,  F04B43/06 ,  F04B43/12 ,  Y10T137/2202 ,  Y10T436/2575

Abstract: A MEMS integrated circuit comprising a peristaltic microfluidic pump and control circuitry for the pump. The pump comprises a pumping chamber positioned between an inlet and an outlet; a plurality of moveable fingers positioned in a wall of the pumping chamber, the fingers being arranged in a row along the wall; and a plurality of thermal bend actuators. Each actuator is associated with a respective finger such that actuation of the thermal bend actuator causes movement of the respective finger into the pumping chamber. The control circuitry controls actuation of the plurality of actuators. The control circuitry is configured to provide a peristaltic pumping action in each pumping chamber via peristaltic movement of the fingers.

Abstract translation: 包括蠕动微流体泵和泵的控制电路的MEMS集成电路。 泵包括位于入口和出口之间的泵送室; 位于所述泵送室的壁中的多个可移动的指状物，所述指状物沿着所述壁布置成一排; 和多个热弯曲致动器。 每个致动器与相应的手指相关联，使得热弯曲致动器的致动导致相应手指进入泵送室的运动。 控制电路控制多个致动器的致动。 控制电路被配置为通过手指的蠕动运动在每个泵送室中提供蠕动泵送作用。

公开(公告)号：US20110229375A1

公开(公告)日：2011-09-22

申请号：US13050762

申请日：2011-03-17

Applicant: Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

Inventor： Ricardo Ehrenpfordt ,  Mathias Bruendel ,  Frieder Haag ,  Jochen Rupp ,  Ulrike Scholz

IPC: G01N33/00 ,  B32B37/02 ,  B32B38/10 ,  B32B37/24

CPC classification number: B01L3/5027 ,  B01J2219/00783 ,  B01L3/502707 ,  B01L2200/027 ,  B01L2300/0663 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2300/16 ,  B81B7/007 ,  B81B2201/036 ,  B81B2201/054 ,  B81B2207/098 ,  B81C2203/0154 ,  H01L23/473 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83191 ,  Y10T156/10 ,  H01L2924/00014

Abstract: A microfluidic system for purposes of analysis and diagnosis is made up of layers arranged substantially one above the other. The microfluidic system includes at least a first and a second conducting-through layer, which respectively comprise at least one channel for a fluid to be conducted through in the respective conducting-through layer. The microfluidic system further includes at least one chip layer, which comprises at least one active, micromechanical element, the active, micromechanical element being in operative connection with at least one of the channels, and the chip layer being arranged between the first and the second conducting-through layer, and the channels being fluidically connected to one another. A corresponding production method is disclosed in addition to the microfluid system.

Abstract translation: 用于分析和诊断的微流体系统由基本上彼此排列的层组成。 微流体系统至少包括第一和第二导电层，其分别包括至少一个通道，用于在相应导电层中导通的流体。 微流体系统还包括至少一个芯片层，其包括至少一个有源微机械元件，所述有源微机械元件与至少一个通道操作连接，并且所述芯片层布置在第一和第二 导通层，并且通道彼此流体连接。 除了微流体系统之外，还公开了相应的制造方法。

公开(公告)号：US07832429B2

公开(公告)日：2010-11-16

申请号：US11242694

申请日：2005-10-03

Applicant: Lincoln Young ,  Peng Zhou

Inventor： Lincoln Young ,  Peng Zhou

IPC: F15C3/00

CPC classification number: F16K7/12 ,  B01F5/0683 ,  B01F5/0688 ,  B01F11/0071 ,  B01F13/0059 ,  B01F2215/0034 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0861 ,  B01L2300/0867 ,  B01L2300/0887 ,  B01L2400/0481 ,  B01L2400/0487 ,  B01L2400/06 ,  B01L2400/0638 ,  B01L2400/0655 ,  B01L2400/084 ,  B29C65/4895 ,  B29C66/004 ,  B29C66/54 ,  B29C66/5412 ,  B29C66/71 ,  B29K2025/00 ,  B29K2025/04 ,  B29K2033/08 ,  B29K2069/00 ,  B29K2101/12 ,  B29L2031/7496 ,  B29L2031/7506 ,  B29L2031/756 ,  B81B3/0021 ,  B81B2201/036 ,  B81B2201/054 ,  B81B2203/0127 ,  B81C1/00103 ,  B81C1/00158 ,  F04B43/028 ,  F04B43/043 ,  F04B43/06 ,  F15C1/08 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0021 ,  F16K99/0034 ,  F16K99/0055 ,  F16K99/0057 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T29/49405 ,  Y10T137/212 ,  Y10T137/2202 ,  Y10T137/2218 ,  Y10T137/8593 ,  Y10T137/85978 ,  Y10T156/1002 ,  Y10T156/1043 ,  B29K2033/12 ,  B29K2025/06

Abstract: Plastic microfluidic structures having a substantially rigid diaphragm that actuates between a relaxed state wherein the diaphragm sits against the surface of a substrate and an actuated state wherein the diaphragm is moved away from the substrate. As will be seen from the following description, the microfluidic structures formed with this diaphragm provide easy to manufacture and robust systems, as well readily made components such as valves and pumps.

Abstract translation: 塑料微流体结构具有基本上刚性的膜片，其在松弛状态之间起作用，其中隔膜抵靠衬底的表面，以及致动状态，其中隔膜移动离开衬底。 从以下描述可以看出，用这种隔膜形成的微流体结构提供易于制造和坚固的系统，以及易于制造的部件，例如阀和泵。