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    Micro rotary machine and methods for using same
    101.
    发明授权
    Micro rotary machine and methods for using same 有权
    微型旋转机及其使用方法

    公开(公告)号：US08159107B2

    公开(公告)日：2012-04-17

    申请号：US11757331

    申请日：2007-06-01

    Applicant: Harold L. Stalford

    Inventor： Harold L. Stalford

    IPC: H01L41/08

    CPC classification number: H02N10/00 ,  B81B3/0024 ,  B81B2201/031 ,  B81B2201/034 ,  B81B2201/037 ,  B81B2201/051 ,  H02K7/00 ,  H02N1/002 ,  H02N11/006

    Abstract: A micro rotary machine may include a micro actuator and a micro shaft coupled to the micro actuator. The micro shaft comprises a horizontal shaft and is operable to be rotated by the micro actuator. A micro tool is coupled to the micro shaft and is operable to perform work in response to motion of the micro shaft.

    Abstract translation: 微型旋转机器可以包括微型致动器和耦合到微型致动器的微型轴。 微型轴包括水平轴，并且可由微型致动器旋转。 微型工具联接到微型轴，并且可操作以响应于微型轴的运动而执行工作。

    METHOD FOR PRODUCING A STAMP FOR HOT EMBOSSING
    103.
    发明申请
    METHOD FOR PRODUCING A STAMP FOR HOT EMBOSSING 审中-公开
    用于生产热烫印花的方法

    公开(公告)号：US20120000379A1

    公开(公告)日：2012-01-05

    申请号：US13147863

    申请日：2010-02-03

    Applicant: Jesse Greener ,  Wei Li ,  Eugenia Kumacheva

    Inventor： Jesse Greener ,  Wei Li ,  Eugenia Kumacheva

    IPC: B41F19/02 ,  B44C1/24

    CPC classification number: B81C99/009 ,  B01L3/502707 ,  B81B2201/051 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017

    Abstract: The present invention provides a process for producing a stamp for hot embossing (HE). The stamp can be constructed from any photo-resist epoxy that is stable at temperatures equal to the glass transition temperature (Tg) of the material to be stamped. The stamp can be used repeatedly without significant distortion of features. The stamp benefits from low relative cost, high fidelity of features in all three-dimensions and fast construction. The process for producing a stamp for hot embossing from a resist, comprising the steps of producing a seed layer L1 from a selected photoresist polymer material, soft baking the seed layer L1, exposing said seed layer L1 to initiate cross-linking and then post-exposure bake L1 to fully cross-link it, coating the cross-linked seed layer L1 with a second photoresist polymer layer L2; soft baking the second photoresist polymer layer L2; applying a mask to the top surface of the soft baked layer L2 and illuminating the unmasked portions of the soft baked layer L2 with UV radiation through the mask, wherein the exposed areas form the pattern of the embossing features, washing away un-exposed regions of the photoresist with a developer to leave behind a relief pattern formed in the second photoresist polymer layer L2, which relief pattern corresponds to a pattern in the mask.

    Abstract translation: 本发明提供一种用于生产热压花印花（HE）的印模的方法。 印模可以由任何光刻胶环氧树脂构成，其在等于要冲压的材料的玻璃化转变温度（Tg）的温度下是稳定的。 邮票可以重复使用，而不会出现特征的明显变形。 邮票受益于相对成本低，三维特征的高保真度和快速建设。 用于从抗蚀剂制造用于热压花的印模的方法，包括以下步骤：从所选择的光致抗蚀剂聚合物材料制备种子层L1，软化种子层L1，暴露所述种子层L1以引发交联， 曝光烘烤L1使其完全交联，用第二光致抗蚀剂聚合物层L2涂覆交联的种子层L1; 软烘烤第二光致抗蚀剂聚合物层L2; 对软烘烤层L2的上表面施加掩模，并通过掩模用UV辐射照射软烘烤层L2的未遮蔽部分，其中暴露区域形成压纹特征的图案，冲洗未曝光区域 具有显影剂的光致抗蚀剂留下形成在第二光致抗蚀剂聚合物层L2中的浮雕图案，该凹凸图案对应于掩模中的图案。

    Photostructured Mechanical Devices and Methods for Making Same
    105.
    发明申请
    Photostructured Mechanical Devices and Methods for Making Same 审中-公开
    光电结构机械设备及其制作方法

    公开(公告)号：US20110167941A1

    公开(公告)日：2011-07-14

    申请号：US12686976

    申请日：2010-01-13

    Applicant: Henry Helvajian

    Inventor： Henry Helvajian

    IPC: F16M11/00 ,  B23P11/00

    CPC classification number: B81C1/00634 ,  B81B2201/051 ,  B81B2203/0338

    Abstract: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

    Abstract translation: 使用用于将器件嵌入可光可陶瓷陶瓷体积内的光学结构化工艺步骤来处理可光电陶瓷，该器件可以包括化学，机械，电子，电磁，光学和声学设备中的一种或多种，​​所有这些都部分地通过在 陶瓷或通过陶瓷体的表面端口设置器件材料，使用内部连接和表面接口互连这些器件。

    Microchip and Process for Producing Microchip
    106.
    发明申请
    Microchip and Process for Producing Microchip 有权
    Microchip和Microchip生产工艺

    公开(公告)号：US20110135539A1

    公开(公告)日：2011-06-09

    申请号：US13057466

    申请日：2009-07-13

    Applicant: Kanji Sekihara ,  Takehiko Goshima

    Inventor： Kanji Sekihara ,  Takehiko Goshima

    IPC: G01N33/48 ,  B29C45/14

    CPC classification number: B81C99/009 ,  B01J2219/00891 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/027 ,  B01L2200/141 ,  B01L2300/0816 ,  B29C45/2628 ,  B29C45/40 ,  B29C65/02 ,  B29C66/54 ,  B29L2031/756 ,  B81B2201/051 ,  B81B2203/0338 ,  B81B2203/0384 ,  B81C2201/034

    Abstract: A microchip which comprises: a resinous base having a plurality of fine channels formed on one side thereof, one or more cylindrical parts disposed so as to protrude from the other side, and a through-hole which pierces each cylindrical part along the axis thereof and communicates with the fine channel so that the diameter of the inner wall of the through-hole gradually decreases from the tip end of the cylindrical part toward the fine channel at a first inclination angle; and a resinous covering member bonded to that side of the resinous base on which the fine channels have been formed. The microchip has been configured so that a liquid sample can be introduced from the tip end of each cylindrical part through the through-hole. The wall thickness of the cylindrical part on the end side where a liquid sample is to be introduced has been made smaller than the wall thickness thereof on the base side where the cylindrical part has been formed, by forming a step therebetween.

    Abstract translation: 一种微芯片，包括：具有形成在其一侧上的多个细通道的树脂基底，一个或多个从另一侧突出设置的圆柱形部分，以及沿着其轴线刺穿每个圆柱形部分的通孔， 与细通道连通，使得通孔的内壁的直径从圆筒部的前端朝向第一倾斜角的细通道逐渐减小; 以及与形成有微细通道的树脂基底的该侧接合的树脂覆盖部件。 微芯片已经被构造成使得液体样品可以通过通孔从每个圆柱形部分的末端引入。 通过在它们之间形成一个台阶，使得待引入液体样品的端侧的圆筒部分的壁厚比通过形成圆柱形部分的基底侧的壁厚小。

    Micro fluid chip
    108.
    发明授权
    Micro fluid chip 有权
    微流体芯片

    公开(公告)号：US07485266B2

    公开(公告)日：2009-02-03

    申请号：US11039940

    申请日：2005-01-24

    Applicant: Yuzuru Ito ,  Yoshishige Endo ,  Akira Koide

    Inventor： Yuzuru Ito ,  Yoshishige Endo ,  Akira Koide

    IPC: B01J19/26 ,  B01F340/06 ,  B01J19/00

    CPC classification number: B01F13/0062 ,  B01F5/0451 ,  B01F5/0453 ,  B01F5/0456 ,  B01F5/0646 ,  B01F5/0647 ,  B01F13/0066 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00889 ,  B01J2219/00891 ,  B81B1/00 ,  B81B2201/051

    Abstract: The invention relates to a micro fluid chip that leads liquids supplied from a plurality of liquid supply ports, respectively, to a minute flow passage, performs mixing and reaction (chemical reaction) of the liquids in the minute flow passage, and obtains a liquid having been processed from a liquid discharge port. A micro fluid chip that leads liquids supplied from a plurality of liquid supply ports, respectively, to a minute flow passage, performs mixing/reaction of the liquids in the minute flow passage, and obtains a liquid having been processed from a liquid discharge port, the micro fluid chip comprising liquid supplies that supply a plurality of flows, which are formed by division of two kinds of liquids, respectively, in an alternate arrangement, and a flow flattening portion provided downstream of the liquid supplies to be configured in flow passage such that liquids alternately arranged are decreased in dimension as they go downstream and increased in dimension in a direction, which intersects the direction of arrangement and a direction of flow, as they go downstream, to be made substantially the same or slightly large in cross sectional area in the direction of flow. According to the invention, liquids of large flow rates can be processed at high speed and an apparatus is not made large in size.

    Abstract translation: 本发明涉及将从多个液体供给口供给的液体分别引导到微小流路的微流体芯片，进行微流路中的液体的混合和反应（化学反应），得到液体 从液体排出口处理。 将从多个液体供给口供给的液体分别引导到微小流路的微流体芯片，进行微小流路中的液体的混合/反应，得到从液体排出口处理的液体， 微流体芯片包括供给多个流的液体供应源，其分别通过以交替排列分开两种液体形成的流动平面化部分和设置在流动通道中构成的液体供应的下游的流动平坦化部分， 交替布置的液体随着它们向下游而在尺寸上减小，并且随着它们向下游而在与排列方向和流动方向相交的方向上的尺寸增大，使得其横截面积基本相同或稍大 在流动的方向。 根据本发明，可以高速度地处理大流量的液体，并且不会使装置尺寸变大。

    Microfluidics Package and Method of Fabricating the Same
    110.
    发明申请
    Microfluidics Package and Method of Fabricating the Same 审中-公开
    微流体包装及其制造方法

    公开(公告)号：US20080199362A1

    公开(公告)日：2008-08-21

    申请号：US11816396

    申请日：2005-02-15

    Applicant: Ser Choong Chong ,  Ling Xie ,  Hongmiao Ji ,  Jing Li ,  Yu Chen ,  Levent Yobas

    Inventor： Ser Choong Chong ,  Ling Xie ,  Hongmiao Ji ,  Jing Li ,  Yu Chen ,  Levent Yobas

    IPC: B01L3/00

    CPC classification number: B81B7/0061 ,  B01F5/0603 ,  B01F13/0059 ,  B01L3/502707 ,  B01L3/502715 ,  B01L9/527 ,  B01L2200/028 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B81B2201/051 ,  B81B2201/058

    Abstract: A microfluidics package (1) comprising a substrate (6) having a top surface, said top surface comprises at least one fluid channel (11, 12), at least one fluidic chip (2) having a top surface, a bottom surface, at least one side surface, and at least one passage to allow a fluid to traverse from the top surface or any side surface to the bottom surface of the chip; sides are adhesive, wherein the first adhesive side of the sheet (4) is secured to the substrate (6), and the at least one fluidic chip (2) is secured by the second adhesive side of the sheet (4), said fluidic chip (2) being arranged such that the at least one passage of the fluidic chip is in fluid communication with the at least one fluid channel (11, 12) of the substrate.

    Abstract translation: 一种微流体封装（1），包括具有顶表面的衬底（6），所述顶表面包括至少一个流体通道（11,12），至少一个流体芯片（2），其具有顶表面，底表面， 至少一个侧表面和至少一个通道，以允许流体从所述芯片的顶表面或任何侧表面到所述底表面横越; 侧面是粘合剂，其中片材（4）的第一粘合剂侧固定到基底（6），并且至少一个流体碎片（2）由片材（4）的第二粘合剂侧固定，所述流体 芯片（2）布置成使得流体芯片的至少一个通道与衬底的至少一个流体通道（11,12）流体连通。

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