公开(公告)号：US09234796B1

公开(公告)日：2016-01-12

申请号：US14294443

申请日：2014-06-03

Applicant: The United States of America, as represented by the Secretary of the Navy

Inventor： Mason David Paulec ,  Jeffrey Brian Dieterich ,  Kenneth Howard Parker ,  Kevin Michael Young ,  Jack Ronald White

IPC: G01J5/08 ,  G01J3/02

CPC classification number: G01J3/0297 ,  G01J1/0252 ,  G01J1/0414 ,  G01J1/0466 ,  G01J1/08 ,  G01J1/4228 ,  G01J5/0275 ,  G01J5/047 ,  G01J5/061 ,  G01J5/0809 ,  G01J5/0846 ,  G01J5/522 ,  G01J2001/086 ,  G01J2005/0048 ,  G01J2005/0074 ,  G01J2005/0077 ,  G01J2005/068

Abstract: A low-radiance infrared airborne calibration reference is an infrared imaging and calibration method. The method includes positioning a mirror perpendicular to an optical axis of a focal plane array in both an open-face position and a mirror-reading position. Temperatures of a lens, window, and the mirror are determined. In-band radiance and offset is calculated to generate an adjusted calibration curve.

Abstract translation: 低辐射红外机载校准参考是红外成像和校准方法。 该方法包括在开放面位置和反射镜读取位置中将反射镜垂直于焦平面阵列的光轴定位。 确定透镜，窗口和反射镜的温度。 计算带内辐射和偏移量以产生调整的校准曲线。

公开(公告)号：US20150369669A1

公开(公告)日：2015-12-24

申请号：US14744410

申请日：2015-06-19

Applicant: MELEXIS TECHNOLOGIES NV

Inventor： Viktor KASSOVSKI ,  Luc BUYDENS ,  Sam MADDALENA

IPC: G01J5/12 ,  G01J5/08

CPC classification number: G01J5/12 ,  G01J5/0803 ,  G01J5/16 ,  G01J2005/0048 ,  G01J2005/066

Abstract: An infrared sensor for temperature sensing comprises a cap covering a substrate; an IR-radiation filtering window in the cap transparent to IR radiation; a first sensing element comprising a set of N thermocouples on the substrate covered by the cap, whose hot junctions may receive radiation; a second sensing element comprising a set of N thermocouples on the substrate covered by the cap whose hot junctions may not receive radiation; first connection modules for connecting a number N1 of thermocouples of the first sensing element, second connection modules for connecting a number N2 of thermocouples of the second sensing; connecting means for connecting an output of the first connection modules of the first sensing element with an output of the second connection modules of the second sensing element, and an output of the combined outputs of the sensing elements.

Abstract translation: 用于温度感测的红外传感器包括覆盖基板的盖子; IR辐射中的IR辐射过滤窗对IR辐射透明; 第一感测元件包括在由帽盖覆盖的衬底上的一组N个热电偶，其热接点可以接收辐射; 第二感测元件，包括一组N个热电偶，所述N个热电偶在所述基板上被所述盖子覆盖，所述盖子的热接头可能不接收辐射; 用于连接第一感测元件的N1个热电偶的第一连接模块，用于连接第二感测的热电偶的数量N2的第二连接模块; 连接装置，用于将第一感测元件的第一连接模块的输出与第二感测元件的第二连接模块的输出连接，以及感测元件的组合输出的输出。

公开(公告)号：US09194752B2

公开(公告)日：2015-11-24

申请号：US14657578

申请日：2015-03-13

Applicant: Robert Bosch GmbH

Inventor： Paul Koop

IPC: G01J5/10 ,  G01J5/00

CPC classification number: G01J5/10 ,  G01J5/025 ,  G01J5/026 ,  G01J5/061 ,  G01J2005/0048 ,  G01J2005/0077 ,  G01J2005/068 ,  G01J2005/106

Abstract: An IR sensor system, an IR sensor module, a temperature detection module and a corresponding calibration method are provided. The IR sensor system has an IR sensor module including a pixelated IR detection area, which has a first control unit for controlling an IR measuring operation and a calibration operation, and a storage unit connected to it, and including a temperature detection module which is detectable in a pixel subarea of the IR detection area, the temperature detection module having a temperature sensor device and a second control unit connected to it. The geometric position of the pixel subarea on the IR detection area is storable in the storage unit.

Abstract translation: 提供IR传感器系统，IR传感器模块，温度检测模块和相应的校准方法。 IR传感器系统具有红外线传感器模块，其包括像素化IR检测区域，其具有用于控制IR测量操作和校准操作的第一控制单元和与其连接的存储单元，并且包括可检测的温度检测模块 在IR检测区域的像素区域中，温度检测模块具有温度传感器装置和与其连接的第二控制单元。 IR检测区域上的像素子区域的几何位置可存储在存储单元中。

公开(公告)号：US20150219499A1

公开(公告)日：2015-08-06

申请号：US14173149

申请日：2014-02-05

Applicant: Lam Research Corporation

Inventor： Ole Waldmann ,  Eric A. Pape ,  Robert Griffith O'Neill ,  Francisco Martinez

IPC: G01J5/02 ,  H01L21/66 ,  H01L21/67 ,  H01L21/683 ,  H01L21/3065 ,  G01N35/00

CPC classification number: G01J5/02 ,  G01J5/0007 ,  G01J5/025 ,  G01J5/10 ,  G01J2005/0048 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831

Abstract: A method for calculating power input to at least one thermal control element of an electrostatic chuck includes: setting the at least one thermal control element to a first predetermined power level; measuring a first temperature of the at least one thermal control element when the at least one thermal control element is powered at the first predetermined power level; setting the at least one thermal control element to a second predetermined power level; measuring a second temperature of the at least one thermal control element when the at least one thermal control element is powered at the second predetermined power level; calculating a difference between the first temperature and the second temperature; calculating a system response of the at least one thermal control element based on the difference; inverting the system response; and calibrating the at least one thermal control element based on the inverted system response.

Abstract translation: 一种用于计算静电卡盘的至少一个热控元件的功率输入的方法，包括：将所述至少一个热控制元件设置为第一预定功率水平; 当所述至少一个热控元件以所述第一预定功率水平供电时，测量所述至少一个热控元件的第一温度; 将所述至少一个热控制元件设置到第二预定功率水平; 当所述至少一个热控元件以所述第二预定功率电平供电时，测量所述至少一个热控元件的第二温度; 计算第一温度和第二温度之间的差; 基于所述差异来计算所述至少一个热控制元件的系统响应; 反转系统响应; 以及基于所述反向系统响应来校准所述至少一个热控制元件。

公开(公告)号：US09091602B2

公开(公告)日：2015-07-28

申请号：US13520341

申请日：2011-03-18

Applicant: Bolin Cao ,  Chengzhang Tan ,  Rui Cao ,  Chenggang Liu

Inventor： Bolin Cao ,  Chengzhang Tan ,  Rui Cao ,  Chenggang Liu

IPC: G01K15/00 ,  G01N3/00 ,  G01J5/52 ,  G01J5/00

CPC classification number: G01K15/005 ,  G01J5/522 ,  G01J2005/0048

Abstract: The present invention provides a quantum theory correction method for improving the accuracy of temperature measurement of radiation thermometer and a radiation thermometer system. The invention is related to the radiation thermometer in the field of instrumentation. The present invention acquires parameters reflecting energy level structure by adopting effective physical model to process data and using keyboard input or data transmission. The temperature of the object to be measured is finally acquired and displayed on the displayer. The quantum theory correction method and radiation thermometer system effectively overcome the difficulty that the value of radiance ε(λ·T) cannot be accurately measured in the event that radiance correction method is used to improve the accuracy of radiation thermometer. Thus, the accuracy of thermometer is improved significantly.

Abstract translation: 本发明提供了一种用于提高辐射温度计和辐射温度计系统的温度测量精度的量子理论校正方法。 本发明涉及仪表领域的辐射温度计。 本发明通过采用有效的物理模型来处理数据和使用键盘输入或数据传输来获取反映能级结构的参数。 最终获取待测物体的温度并显示在显示器上。 量子理论校正方法和辐射温度计系统有效克服了使用辐射校正方法提高辐射温度计精度的情况下无法精确测量辐射值（λ·T）的值。 因此，温度计的精度明显提高。

公开(公告)号：US20150168220A1

公开(公告)日：2015-06-18

申请号：US14557554

申请日：2014-12-02

Applicant: Takeshi Nagahisa

Inventor： Takeshi Nagahisa

IPC: G01J5/10 ,  G01J5/00

CPC classification number: G01J5/10 ,  G01J5/0022 ,  G01J5/0025 ,  G01J5/06 ,  G01J2005/0048 ,  G01J2005/068

Abstract: A semiconductor integrated circuit includes an acquisition unit configured to acquire a value outputted from an infrared sensor in response to an infrared ray received from an object, and a value outputted from a temperature sensor as a function of measured temperature of the infrared sensor; a second-temperature identification circuit configured to identify a second temperature which is a temperature of the object when the temperature of the infrared sensor corresponding to a measured value which is the output value of the infrared sensor, is the first temperature, by referring to the correspondence; a third-temperature identification circuit configured to identify a third temperature which is the temperature of the infrared sensor in outputting the measured value; and a calculation circuit configured to calculate a fourth temperature which is a temperature of the object on the basis of the first temperature, the second temperature, and the third temperature.

Abstract translation: 半导体集成电路包括获取单元，其被配置为响应于从对象接收到的红外线获取从红外传感器输出的值以及从温度传感器输出的值作为红外传感器的测量温度的函数; 第二温度识别电路，被配置为当与作为红外线传感器的输出值的测量值相对应的红外线传感器的温度为第一温度时，通过参照第一温度来识别作为物体的温度的第二温度 对应; 第三温度识别电路，被配置为在输出测量值时识别作为所述红外线传感器的温度的第三温度; 以及计算电路，被配置为基于第一温度，第二温度和第三温度来计算作为物体的温度的第四温度。

公开(公告)号：US20150137300A1

公开(公告)日：2015-05-21

申请号：US14400461

申请日：2013-04-19

Applicant: Robert Bosch Gmbh

Inventor： Ingo Herrmann ,  Edda Sommer ,  Christoph Schelling ,  Christian Rettig ,  Mirko Hattass

IPC: H01L27/146 ,  H01L31/028 ,  G01J5/20

CPC classification number: H01L27/14649 ,  G01J5/20 ,  G01J2005/0048 ,  G01J2005/067 ,  H01L27/14609 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1467 ,  H01L27/14685 ,  H01L31/028

Abstract: An infrared sensor device includes a semiconductor substrate, at least one sensor element that is micromechanically formed in the semiconductor substrate, and at least one calibration element, which is micromechanically formed in the semiconductor substrate, for the sensor element. An absorber material is arranged on the semiconductor substrate in the area of the sensor element and the calibration element. One cavern each is formed in the semiconductor substrate substantially below the sensor element and substantially below the calibration element. The sensor element and the calibration element are thermally and electrically isolated from the rest of the semiconductor substrate by the caverns. The infrared sensor device has high sensitivity, calibration functionality for the sensor element, and a high signal-to-noise ratio.

Abstract translation: 红外线传感器装置包括半导体衬底，至少一个在半导体衬底中微机械地形成的传感器元件，以及用于传感器元件的微机械地形成在半导体衬底中的至少一个校准元件。 在传感器元件和校准元件的区域中的半导体衬底上布置有吸收材料。 一个洞穴分别形成在半导体衬底中，基本上位于传感器元件的下方并且基本上在校准元件的下面。 传感器元件和校准元件通过洞穴与半导体衬底的其余部分热电隔离。 红外传感器设备具有高灵敏度，传感器元件的校准功能和高信噪比。

公开(公告)号：US08993966B2

公开(公告)日：2015-03-31

申请号：US13627718

申请日：2012-09-26

Applicant: Barrett E. Cole

Inventor： Barrett E. Cole

IPC: G01J5/02 ,  G01J1/02 ,  G01J1/08 ,  G01J1/42 ,  G01J5/60 ,  G01J5/00

CPC classification number: G01J1/0228 ,  G01J1/08 ,  G01J1/4228 ,  G01J5/026 ,  G01J5/60 ,  G01J2005/0048 ,  G01J2005/0077

Abstract: A flame detector includes a medium wavelength infrared bolometer having an array of pixel elements disposed within a housing. Optics supported by the housing and disposed with respect to the bolometer direct infrared radiation from a flame to the pixel elements of the array and direct radiation from a separate background object to the pixel elements of the array. Electronics are coupled to receive signals from the bolometer and programmed to track an intensity of radiation from the background object to monitor transmission of radiation through the optics.

Abstract translation: 火焰检测器包括具有设置在壳体内的像素元件阵列的中波长红外测辐射热计。 由壳体支撑并且相对于辐射热量计从火焰到阵列的像素元件的直接红外辐射和从单独的背景物体到阵列的像素元件的直接辐射而设置的光学元件。 电子设备被耦合以从测辐射热谱仪接收信号，并被编程为跟踪来自背景物体的辐射强度以监测通过光学器件的辐射的透射。

公开(公告)号：US20140369387A1

公开(公告)日：2014-12-18

申请号：US14345019

申请日：2012-09-07

Applicant: Siegfried Krassnitzer ,  Markus Esselbach

Inventor： Siegfried Krassnitzer ,  Markus Esselbach

IPC: G01K7/10 ,  G01K7/04

CPC classification number: G01K7/10 ,  G01J5/0003 ,  G01J5/0007 ,  G01J5/061 ,  G01J2005/0048 ,  G01J2005/065 ,  G01J2005/068 ,  G01K7/04

Abstract: The present invention relates to a temperature-measuring system, comprising a temperature sensor and a reference body, wherein means for determining temperature changes of the reference body and/or for control of the temperature of the reference body are provided. When the temperature measuring-system is used in a vacuum, the reference body forms no substantial material thermal bridges to the temperature sensor and the reference body shields the temperature sensor with respect to the environment in such a way that only radiation that comes from the surfaces of the reference and from surfaces of which the temperature is to be determined reaches the surface of the temperature sensor.

Abstract translation: 本发明涉及一种温度测量系统，包括温度传感器和参考体，其中提供了用于确定参考体的温度变化和/或用于控制参考体的温度的装置。 当在真空中使用温度测量系统时，参考体不形成温度传感器的实质材料热桥，并且参考体相对于环境屏蔽温度传感器，使得只有来自表面的辐射 的参考值和从其表面测定温度到达温度传感器的表面。

公开(公告)号：US08814426B2

公开(公告)日：2014-08-26

申请号：US13513510

申请日：2010-12-14

Applicant: Kenzo Nakamura ,  Sei Kitaguchi ,  Mototaka Ishikawa

Inventor： Kenzo Nakamura ,  Sei Kitaguchi ,  Mototaka Ishikawa

IPC: G01J5/02 ,  G01J5/20 ,  G01K7/22

CPC classification number: G01J5/10 ,  G01J2005/0048 ,  G01J2005/068

Abstract: An infrared sensor comprises: an electrical insulating film sheet; first and second temperature sensor devices which are provided on one side of the electrical insulating film sheet, and are located at a distance from each other; a pair of contact electrodes, with which the first and second temperature sensor devices are attached respectively, formed on one side of the electrical insulating film sheet; an infrared absorbing film provided on the other side of the electrical insulating film sheet opposite the first temperature sensor device; and an infrared reflector film provided on the same side as the infrared absorbing film opposite the second temperature sensor device. The first and second temperature sensor devices respectively comprise: a thermistor element; and a pair of electrode layers, in which one of them is in contact with the contact electrode, formed both on the upper and lower surfaces of the thermistor element.

Abstract translation: 红外线传感器包括：电绝缘膜片; 第一和第二温度传感器装置，其设置在电绝缘膜片的一侧，并且彼此相距一定距离; 一对接触电极，分别安装有第一和第二温度传感器装置，形成在电绝缘膜片的一侧上; 设置在与第一温度传感器装置相对的电绝缘膜片的另一侧的红外线吸收膜; 以及设置在与第二温度传感器装置相对的红外线吸收膜的同一侧的红外反射膜。 第一和第二温度传感器装置分别包括：热敏电阻元件; 以及一对电极层，其中一个与接触电极接触，形成在热敏电阻元件的上表面和下表面上。