公开(公告)号：US20090233467A1

公开(公告)日：2009-09-17

申请号：US12381236

申请日：2009-03-10

Applicant: Chee Hian Lee ,  David H. McClintock ,  Chong Yeow Oo

Inventor： Chee Hian Lee ,  David H. McClintock ,  Chong Yeow Oo

IPC: H01R12/00 ,  H05K3/30

CPC classification number: H05K1/147 ,  H05K1/141 ,  H05K1/148 ,  H05K7/1402 ,  H05K2201/0133 ,  H05K2201/10189 ,  H05K2203/0191 ,  Y10T29/4913

Abstract: A circuit board connector assembly mounted in a housing and method of mounting are described. The assembly has orthogonal first and second circuit boards (CB). The CB has a CB connector containing a CB housing with CB electrical contacts. A flexible electrical link has a link connector mounted in a link connector housing with link electrical contacts. A resilient pad is mounted on a link connector housing and a flexible sheet is mounted to both the pad and the link. The sheet spans a length of the link. When the length of the link is substantially planar, the sheet provides a ramp tapering away from the pad. During mounting of the assembly in the housing, the CB connector is operatively coupled to the link connector thereby forming a first connector assembly, and an abutment edge of the second circuit board slidably engages the sheet thereby compressing the pad.

Abstract translation: 描述了安装在壳体中的电路板连接器组件和安装方法。 组件具有正交的第一和第二电路板（CB）。 CB具有CB连接器，其包含具有CB电触点的CB壳体。 柔性电连接件具有连接连接器，该连接器安装在具有连接电触头的连接连接器壳体中。 弹性垫安装在连杆连接器壳体上，并且柔性片安装到垫和连杆两者。 纸张跨越链接的长度。 当连杆的长度基本上是平面时，片材提供了远离垫片的斜面。 在将组件安装在壳体中期间，CB连接器可操作地联接到连杆连接器，从而形成第一连接器组件，并且第二电路板的邻接边缘可滑动地接合片材，从而压缩衬垫。

公开(公告)号：US20090218310A1

公开(公告)日：2009-09-03

申请号：US12393201

申请日：2009-02-26

Applicant: Lijun Zu ,  Matthew H. Frey

Inventor： Lijun Zu ,  Matthew H. Frey

IPC: B44C1/22

CPC classification number: G06F3/044 ,  B41M5/52 ,  B82Y10/00 ,  B82Y40/00 ,  C23F1/02 ,  C23F1/30 ,  G03F7/0002 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K1/032 ,  H05K3/0079 ,  H05K3/061 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2203/0108 ,  H05K2203/0537 ,  Y10T428/24802

Abstract: A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate.

Abstract translation: 图案化基板上的导体的方法包括提供用自组装单层形成分子着墨的具有凸起特征的浮雕图案的着墨弹性体印模。 然后，着色印模的凸起特征与金属涂覆的可见光透明基板接触。 然后蚀刻金属以形成对应于可见光透明基板上的着墨印模的凸起特征的导电微图案。

公开(公告)号：US07583516B2

公开(公告)日：2009-09-01

申请号：US12109230

申请日：2008-04-24

Applicant: Jiun-Nan Lu

Inventor： Jiun-Nan Lu

IPC: H05K7/12

CPC classification number: H05K7/142 ,  H05K1/0271 ,  H05K2201/0133 ,  H05K2201/10409 ,  H05K2201/2045

Abstract: An exemplary printed circuit board assembly includes a printed circuit board, four supporting members, four shock-absorption members, and four fixing members. The printed circuit board defines a plurality of cutouts therein. Each supporting member defines a positioning hole therein. The shock-absorption members are snapped in the cutouts, and each has a first surface contacting the corresponding supporting member, a second surface parallel to the first surface, and a through hole extending through the first and second surfaces. The first and second surfaces are disposed at opposite sides of the printed circuit board. Each fixing member comprises a first portion pressed on the second surface of the corresponding shock-absorption member, and a second portion extending through the through hole and engaging in the positioning hole.

Abstract translation: 示例性印刷电路板组件包括印刷电路板，四个支撑构件，四个减震构件和四个固定构件。 印刷电路板在其中限定多个切口。 每个支撑构件在其中限定定位孔。 减震构件被卡扣在切口中，并且每个具有接触相应的支撑构件的第一表面，平行于第一表面的第二表面和延伸穿过第一表面和第二表面的通孔。 第一和第二表面设置在印刷电路板的相对侧。 每个固定构件包括压在相应的减震构件的第二表面上的第一部分和延伸穿过通孔并接合在定位孔中的第二部分。

公开(公告)号：US07566238B2

公开(公告)日：2009-07-28

申请号：US11490928

申请日：2006-07-21

Applicant: Mark S. Tracy ,  Earl W. Moore

Inventor： Mark S. Tracy ,  Earl W. Moore

IPC: H01R13/648

CPC classification number: H05K1/141 ,  G06F1/185 ,  H01R12/721 ,  H01R12/83 ,  H05K1/0271 ,  H05K7/1417 ,  H05K2201/0133 ,  H05K2201/10189 ,  H05K2201/2045

Abstract: A card connector dampening assembly comprises a connector coupled to a printed circuit board and configured to receive an electronic card connected therewith and a dampening member disposed at least partially between the printed circuit board and the electronic card.

Abstract translation: 卡连接器阻尼组件包括耦合到印刷电路板并被配置为接收与其连接的电子卡的连接器和至少部分地设置在印刷电路板和电子卡之间的阻尼构件。

公开(公告)号：US20090178832A1

公开(公告)日：2009-07-16

申请号：US12353357

申请日：2009-01-14

Applicant: Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

Inventor： Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC: H05K1/03 ,  B32B27/04

CPC classification number: H05K1/0366 ,  B32B3/08 ,  B32B3/18 ,  B32B5/022 ,  B32B5/024 ,  B32B15/02 ,  B32B15/14 ,  B32B15/20 ,  B32B17/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0253 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/00 ,  B32B2457/04 ,  B32B2457/08 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10T442/2475

Abstract: A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100 ° C. is 50 ppm/° C. or less. A printed circuit board, multi layered circuit board, and electronic part are disclosed.

Abstract translation: 包含作为布的主要部分的由玻璃纤维和聚烯烃纤维组成的复合织布或无纺布的预浸料，以及提供具有低热膨胀系数的固化产物的热固性树脂组合物，其中， 50〜100℃的固化树脂组合物为50ppm /℃以下。 公开了印刷电路板，多层电路板和电子部件。

公开(公告)号：US20090169808A1

公开(公告)日：2009-07-02

申请号：US11912934

申请日：2006-04-21

Applicant: Nozomu Takano ,  Masaki Kamiya

Inventor： Nozomu Takano ,  Masaki Kamiya

IPC: B32B3/10 ,  C08L33/02 ,  B32B17/02 ,  B32B37/02 ,  B44C1/22

CPC classification number: C08G59/4042 ,  B32B15/08 ,  C08G59/621 ,  C08J5/24 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0133 ,  H05K2201/10378 ,  Y10T156/10 ,  Y10T428/14 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/26 ,  Y10T428/31692 ,  Y10T428/31855 ,  Y10T442/2992

Abstract: It is an object of the invention to provide a composite with sufficiently reliable bonding and adequately minimized generation of fluff from flaking resin dust and fibers. This object is achieved by the composite (100) of the invention that comprises a fiber sheet (101) impregnated with a resin composition (102), wherein the 20° C. storage elastic modulus of the cured resin composition (102) is 100-2000 MPa. The composite (100) optionally contains perforations (103).

Abstract translation: 本发明的一个目的是提供一种具有足够可靠的粘合并充分最小化从树脂粉尘和纤维剥落产生绒毛的复合材料。 该目的通过本发明的复合材料（100）实现，该复合材料（100）包括浸渍有树脂组合物（102）的纤维片（101），其中固化树脂组合物（102）的20℃储能弹性模量为100- 2000 MPa。 复合材料（100）任选地包含穿孔（103）。

公开(公告)号：US20090145766A1

公开(公告)日：2009-06-11

申请号：US12368019

申请日：2009-02-09

Applicant: Kenji TAKAI ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

Inventor： Kenji TAKAI ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

IPC: C25D5/02 ,  C25D5/48

CPC classification number: H05K3/4655 ,  H05K3/108 ,  H05K3/28 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/31681

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract translation: 本发明涉及一种粘附辅助剂金属箔，其包含在金属上含有环氧树脂作为不可或缺成分的粘合助剂层，其中粘合助剂层的厚度为0.1-10μm。 本发明还涉及作为具有多层的多层布线基板的印刷布线板，其中在绝缘层之间形成粘附辅助剂层。

公开(公告)号：US20090130440A1

公开(公告)日：2009-05-21

申请号：US11718367

申请日：2005-11-11

Applicant: Christian Ring ,  Thorsten Krawinkel

Inventor： Christian Ring ,  Thorsten Krawinkel

IPC: B32B15/088

CPC classification number: C09J109/02 ,  C08C19/02 ,  C08K3/08 ,  C08L63/00 ,  C08L2666/08 ,  C08L2666/14 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2409/00 ,  C09J2463/00 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2203/0191 ,  Y10T428/2804 ,  Y10T428/2826

Abstract: Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of a. an acid- or acid anhydride-modified acrylonitrile-butadiene copolymer, and b. an epoxy resin, the weight ratio of the two components a/b being greater than 1.5 and no additional nonpolymer hardener being used.

Abstract translation: 用于制造和进一步处理柔性导体轨道的热激活胶带，其中至少由一种粘合剂组成。 酸或酸酐改性的丙烯腈 - 丁二烯共聚物，和b。 环氧树脂，两种组分a / b的重量比大于1.5，不使用另外的非聚合物硬化剂。

公开(公告)号：US20090122507A1

公开(公告)日：2009-05-14

申请号：US11983248

申请日：2007-11-08

Applicant: Chris R. Snider

Inventor： Chris R. Snider

IPC: H05K9/00

CPC classification number: H05K9/003 ,  H05K9/0032 ,  H05K2201/0133

Abstract: A conductive elastomeric shielding device (400) for use with an electronic device includes a raised surface (401) and a sidewall (405) formed with the raised surface (401). A turret section (406) is formed with the sidewall (405) where an engagement member (407) projects from the turret section (406) for frictional engagement with an aperture (408) in a printed circuit (PC) board (410). The raised surface and sidewall are manufactured of an elastomeric shielding material for shielding radio frequency (RF) radiation for electronic components used therewith.

Abstract translation: 用于电子设备的导电弹性屏蔽装置（400）包括凸起表面（401）和形成有凸起表面（401）的侧壁（405）。 转台部分（406）形成有侧壁（405），其中接合构件（407）从转台部分（406）突出以与印刷电路板（410）中的孔（408）摩擦接合。 凸起的表面和侧壁由用于屏蔽用于其的电子部件的射频（RF）辐射的弹性屏蔽材料制成。

公开(公告)号：US20090107704A1

公开(公告)日：2009-04-30

申请号：US12348814

申请日：2009-01-05

Applicant: Jan Vanfleteren ,  Dominique Brosteaux ,  Fabrice Axisa

Inventor： Jan Vanfleteren ,  Dominique Brosteaux ,  Fabrice Axisa

IPC: H05K1/03 ,  H01L23/14

CPC classification number: H01L25/50 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/205 ,  H05K2201/0133 ,  H05K2201/098 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2924/00

Abstract: A composite substrate is disclosed. In one aspect, the substrate has a stretchable and/or flexible material. The substrate may further have patterned features embedded in the stretchable and/or flexible material. The patterned features have one or more patterned conducting layers.

Abstract translation: 公开了一种复合衬底。 在一个方面，基底具有可拉伸和/或柔性材料。 衬底还可以具有嵌入在可拉伸和/或柔性材料中的图案特征。 图案化特征具有一个或多个图案化导电层。