公开(公告)号：US6037048A

公开(公告)日：2000-03-14

申请号：US342088

申请日：1999-06-29

Applicant: Curtis E. Peterson ,  Roel H. Vossen ,  Yi-Bin Huang ,  Paul J. Moses, Jr.

Inventor： Curtis E. Peterson ,  Roel H. Vossen ,  Yi-Bin Huang ,  Paul J. Moses, Jr.

IPC: C08J5/24 ,  C08J5/04 ,  C08L25/00 ,  D01F6/20 ,  D01F6/22 ,  D01F6/56 ,  D01F8/10 ,  H05K1/03 ,  B32B27/02 ,  C08F12/08 ,  C08L63/02

CPC classification number: C08J5/24 ,  C08J5/04 ,  C08J5/046 ,  D01F6/20 ,  D01F6/22 ,  D01F6/56 ,  D01F8/10 ,  H05K1/0366 ,  C08J2363/00 ,  H05K2201/0158 ,  H05K2201/0278 ,  Y10S428/901 ,  Y10T428/12222 ,  Y10T428/24994 ,  Y10T428/2929 ,  Y10T428/31511 ,  Y10T428/31721 ,  Y10T428/31855 ,  Y10T428/31913 ,  Y10T428/31931

Abstract: Fibers having increased strength and small diameters can be produced from compositions comprising long chain branched syndiotactic vinyl aromatic polymers. Due to the increased fiber strength, less strand breakage occurs during processing which increases process productivity and yield.

Abstract translation: 具有增强强度和小直径的纤维可以由包含长链支化间同立构乙烯基芳族聚合物的组合物制备。 由于增加的纤维强度，在加工过程中发生较少的断裂，这提高了工艺生产率和产率。

公开(公告)号：US5785787A

公开(公告)日：1998-07-28

申请号：US561990

申请日：1995-11-22

Applicant: Robert John Wojnarowski ,  Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Wolfgang Daum

Inventor： Robert John Wojnarowski ,  Herbert Stanley Cole ,  Theresa Ann Sitnik-Nieters ,  Wolfgang Daum

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/38 ,  B32B31/12 ,  B32B31/14

CPC classification number: H05K1/024 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K3/386 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method for fabricating a low dielectric constant printed circuit board includes dispersing an additive material in a low dielectric constant porous polymer layer; providing holes through the low dielectric constant porous polymer layer; applying a metallization layer over surfaces of the low dielectric constant porous polymer layer and surfaces of the holes; patterning the metallization layer; and removing the additive material from the low dielectric constant porous polymer layer. The removal of the additive material can be accomplished by sublimation, evaporation, and diffusion.

Abstract translation: 一种制造低介电常数印刷电路板的方法，包括将添加剂材料分散在低介电常数多孔聚合物层中; 通过低介电常数多孔聚合物层提供孔; 在低介电常数多孔聚合物层的表面和孔的表面上施加金属化层; 图案化金属化层; 并从低介电常数多孔聚合物层中除去添加剂材料。 添加剂的去除可以通过升华，蒸发和扩散来实现。

公开(公告)号：US5779921A

公开(公告)日：1998-07-14

申请号：US745980

申请日：1996-11-08

Applicant: Randy E. Haslow ,  Donald G. Hutchins ,  Michael R. Leaf

Inventor： Randy E. Haslow ,  Donald G. Hutchins ,  Michael R. Leaf

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/34 ,  H05K3/42 ,  B44C1/22

CPC classification number: H05K1/0265 ,  H05K3/108 ,  H05K3/242 ,  H05K3/427 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/1572 ,  H05K3/064 ,  H05K3/243 ,  H05K3/3452 ,  Y10S205/927

Abstract: The present invention relates to a process for metallizing features of an electronic component, where the metallized features, conductive pads, conductive traces, are coated and encapsulated with at least one metal layer and the features on the front side and the back side of the component have different thicknesses

Abstract translation: 本发明涉及用于金属化电子部件特征的方法，其中金属化特征，导电焊盘，导电迹线被涂覆并用至少一个金属层封装并且部件的前侧和后侧上的特征 具有不同的厚度

公开(公告)号：US5576517A

公开(公告)日：1996-11-19

申请号：US411176

申请日：1995-03-27

Applicant: Robert J. Wojnarowski ,  Herbert S. Cole ,  Theresa A. Sitnik-Nieters ,  Wolfgang Daum

Inventor： Robert J. Wojnarowski ,  Herbert S. Cole ,  Theresa A. Sitnik-Nieters ,  Wolfgang Daum

IPC: B32B7/02 ,  B32B18/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/38 ,  H05K1/18

CPC classification number: H05K1/0313 ,  H01L21/481 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H05K1/024 ,  H05K1/0373 ,  H05K3/0032 ,  H01L2224/2402 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/3011 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2203/083 ,  H05K2203/122 ,  H05K3/386 ,  Y10S521/918 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: An electronic structure includes a circuit chip having chip pads and supported by a substrate, and a low dielectric constant porous polymer layer having pores and situated over the substrate and circuit chip. The porous polymer layer has at least one via therein aligned with at least one of the chip pads, and a pattern of electrical conductors extends over a portion of the porous polymer layer and into the at least one via. The pattern of electrical conductors does not significantly protrude into the pores of the porous polymer layer.

Abstract translation: 电子结构包括具有芯片焊盘并由衬底支撑的电路芯片，以及具有孔并位于衬底和电路芯片上的低介电常数多孔聚合物层。 多孔聚合物层具有与至少一个芯片焊盘对准的至少一个通孔，并且电导体图案在多孔聚合物层的一部分上延伸到至少一个通孔中。 电导体的图案不会显着地突出到多孔聚合物层的孔中。

公开(公告)号：US5552210A

公开(公告)日：1996-09-03

申请号：US335510

申请日：1994-11-07

Applicant: Allen F. Horn, III ,  Robert L. Bush ,  Michael E. St. Lawrence

Inventor： Allen F. Horn, III ,  Robert L. Bush ,  Michael E. St. Lawrence

IPC: C08K3/22 ,  C08L27/12 ,  C08L71/00 ,  C08L71/12 ,  C08L101/00 ,  H01B3/02 ,  H05K1/03 ,  H05K1/16 ,  B32B3/00

CPC classification number: H05K1/0373 ,  C08K3/22 ,  H05K1/032 ,  H05K1/034 ,  H05K1/162 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/2995 ,  Y10T428/3154

Abstract: A high dielectric (K'.gtoreq.5), comparatively low thermal coefficient (absolute value of TCK'.ltoreq.200 ppm/.degree.C.) polymeric composite matrix is presented comprising commonly available and low cost fillers such as titania, alumina and magnesium oxide.

Abstract translation: 提出了高介电常数（K'> = 5），相对较低的热系数（TCK'绝对值<200ppm /℃）的聚合物复合基质，其包括常用的和低成本的填料如二氧化钛，氧化铝和 氧化镁。

公开(公告)号：US5004649A

公开(公告)日：1991-04-02

申请号：US327815

申请日：1989-03-23

Applicant: Komei Yamasaki ,  Keisuke Funaki

Inventor： Komei Yamasaki ,  Keisuke Funaki

IPC: B32B27/30 ,  G11B5/73 ,  H01G4/18 ,  H01G4/20 ,  H05K1/00 ,  H05K1/03

CPC classification number: H01G4/18 ,  B32B27/30 ,  G11B5/7305 ,  H01G4/20 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  Y10S428/91 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31746 ,  Y10T428/31757 ,  Y10T428/31797

Abstract: A resin laminate comprising a layer of styrene-based polymer having mainly syndiotactic configuration and a thermoplastic resin layer, a metallized laminate comprising a layer of the styrene-based polymer described above and a metal layer, and process for producing these laminates are disclosed. In the laminate, the styrene-based polymer layer and the thermoplastic resin layer may be biaxially stretched.The laminates are expected to be utilized for electrostatic capacitors, hot stamping foils, flexible printed circuit board substrates, food wrapping films, and other functional films including magnetic tapes, and ornament films.

公开(公告)号：US4833022A

公开(公告)日：1989-05-23

申请号：US87195

申请日：1987-08-20

Applicant: William G. Bridges ,  Thomas A. Armer

Inventor： William G. Bridges ,  Thomas A. Armer

IPC: B32B15/08 ,  H05K1/03

CPC classification number: H05K1/036 ,  B32B15/08 ,  H05K1/032 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0355 ,  Y10T428/266 ,  Y10T428/31544 ,  Y10T428/31696 ,  Y10T428/31699

Abstract: Polymer/copper laminates and a method for their manufacture employing smooth, untreated, wrought-copper and characterized by cohesive and adhesive strength in the resulting laminates.

公开(公告)号：US4751136A

公开(公告)日：1988-06-14

申请号：US091603

申请日：1987-08-31

Applicant: Masaki Kamiya ,  Takao Sugawara ,  Kenji Tsukanishi ,  Yutaka Yamaguchi ,  Mitsuo Yokota ,  Masao Asaoka

Inventor： Masaki Kamiya ,  Takao Sugawara ,  Kenji Tsukanishi ,  Yutaka Yamaguchi ,  Mitsuo Yokota ,  Masao Asaoka

IPC: H01Q9/04 ,  H01Q15/14 ,  H05K1/02 ,  H05K1/03 ,  H05K3/38 ,  B32B3/10 ,  B32B3/14 ,  B32B5/16

CPC classification number: H05K1/036 ,  H01Q15/142 ,  H01Q9/0407 ,  H05K1/024 ,  H05K2201/0116 ,  H05K2201/0158 ,  H05K3/386 ,  Y10T428/249982 ,  Y10T428/249985 ,  Y10T428/249986 ,  Y10T428/24999 ,  Y10T428/31692

Abstract: A substrate for high-frequency circuits best suited as a substrate for a flat antenna to receive satellite-broadcast microwaves or as a similar substrate, the substrate comprising (i) a porous insulator layer wherein the proportion by volume of open cells to all the cells is at least 50% and (ii) a metal foil laminated over at least one side of the insulator layer through (iii) a water-impermeable film, and a process for making such substrates.

Abstract translation: 一种用于高频电路的衬底，其最适合作为用于平坦天线的衬底以接收卫星广播微波或类似衬底，所述衬底包括（i）多孔绝缘体层，其中开放电池的体积比例与所有电池 至少为50％，（ii）通过（iii）不透水膜层压在绝缘体层的至少一侧上的金属箔，以及制造这种基板的工艺。

公开(公告)号：US4635346A

公开(公告)日：1987-01-13

申请号：US669364

申请日：1984-11-08

Applicant: Kazuhiro Matsuzaki

Inventor： Kazuhiro Matsuzaki

IPC: H01L21/58 ,  H01L21/98 ,  H05K1/03 ,  H05K3/30 ,  C08L23/26

CPC classification number: H01L24/85 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/50 ,  H05K3/305 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/10636 ,  H05K2203/0769 ,  H05K2203/0783 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A method for producing a hybrid integrated circuit includes steps of: applying an adhesive to an electronic part mounting conductor on an insulating substrate; adhering an electronic part to the applied adhesive and hardening the adhesive to temporarily fix the electronic part; fixing the temporarily fixed electronic part on the conductor with solder; and dissolving the hardened adhesive in a solvent and removing it. Upon being hardened, the adhesive can withstand the heat of molten solder and can be dissolved in a solvent and removed therewith.

Abstract translation: 一种制造混合集成电路的方法包括以下步骤：将粘合剂施加到绝缘基板上的电子部件安装导体上; 将电子部件粘附到所施加的粘合剂上并使粘合剂硬化以临时固定电子部件; 用焊料将临时固定的电子部件固定在导体上; 并将硬化的粘合剂溶解在溶剂中并将其去除。 在硬化时，粘合剂可以承受熔融焊料的热量，并且可以溶解在溶剂中并且被除去。

公开(公告)号：US4395459A

公开(公告)日：1983-07-26

申请号：US200894

申请日：1980-10-27

Applicant: C. George Herschdorfer ,  Dennis J. Vaughan

Inventor： C. George Herschdorfer ,  Dennis J. Vaughan

IPC: B29C47/00 ,  B29C70/50 ,  B32B27/12 ,  H05K1/03 ,  H05K3/02 ,  B29D7/14 ,  B29D7/16 ,  B29D9/04 ,  B29D23/04

CPC classification number: B29C47/0004 ,  B29C70/506 ,  B32B27/12 ,  H05K1/0313 ,  H05K1/0366 ,  H05K3/022 ,  B29C47/0021 ,  B29C47/0026 ,  B29C47/0057 ,  B29C47/0059 ,  B29C47/0066 ,  B29C47/02 ,  B29K2101/10 ,  B29K2301/10 ,  H05K1/032 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/122 ,  H05K2203/1545 ,  Y10T428/2962 ,  Y10T428/2964 ,  Y10T428/31536 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31794 ,  Y10T428/31797 ,  Y10T428/31855 ,  Y10T428/31913 ,  Y10T428/31938

Abstract: A process of producing reinforced laminates from crosslinkable thermoplastic olefin polymer material. In the process, a normally solid, high molecular weight crosslinkable thermoplastic olefin polymer containing a catalyst which reacts with and effects crosslinking of the polymer and which has a decomposition temperature above the melting temperature of the polymer, is heated to a molten state at a temperature above the polymer melting temperature but below the catalyst decomposition temperature. A continuous nonreinforced sheet is then formed from the molten polymer at a temperature below the decomposition temperature and is applied to at least one surface of a substrate to form a laminate. The laminate is then heated under pressure to a temperature above the decomposition temperature of the catalyst to effect substantially complete crosslinking of the polymer and is cooled to a temperature below the polymer melting temperature to a self-supporting state to fix the shape of the laminate.

Abstract translation: 从可交联热塑性烯烃聚合物材料生产增强层压材料的方法。 在该方法中，含有与聚合物反应并实现聚合物交联并且具有高于聚合物熔融温度的分解温度的催化剂的通常为固体，高分子量的可交联热塑性烯烃聚合物在温度下被加热至熔融状态 高于聚合物熔融温度但低于催化剂分解温度。 然后在低于分解温度的温度下由熔融聚合物形成连续的非增强片，并施加到基底的至少一个表面以形成层压体。 然后将层压体在压力下加热到高于催化剂分解温度的温度，以实现聚合物的基本上完全的交联，并将其冷却至低于聚合物熔融温度的温度，使之达到自支撑状态以固定层压体的形状。