公开(公告)号：US08603624B2

公开(公告)日：2013-12-10

申请号：US13510770

申请日：2010-10-29

Applicant: Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

Inventor： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

IPC: B32B15/00

CPC classification number: H05K1/0373 ,  B32B5/28 ,  B32B15/14 ,  C08G59/38 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257 ,  Y10T442/20 ,  Y10T442/3455

Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.

Abstract translation: 公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿 平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子， 平均粒径（D50）为2〜15μm，并且含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子 ）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自一组的无机成分（B）的配合比（体积比） 勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

公开(公告)号：US08603590B2

公开(公告)日：2013-12-10

申请号：US11924363

申请日：2007-10-25

Applicant: Lucien D. Laude ,  Neil Hamilton Talbot ,  Robert J. Greenberg

Inventor： Lucien D. Laude ,  Neil Hamilton Talbot ,  Robert J. Greenberg

IPC: B05D3/06 ,  B05D5/04 ,  B05D5/12 ,  C08J7/06 ,  C08J7/12

CPC classification number: H05K3/185 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/204 ,  H05K1/0289 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/007 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2203/016 ,  H05K2203/1105

Abstract: The invention relates to a method of embedding a metal trace in a silicone containing polymer layer, by the steps of applying an agent that does not adhere to a substrate; applying a polymer layer on the non adhering agent; irradiating a surface of the polymer with a light beam emitted by an excimer laser creating cuts, grooves, blind holes or vias; immersing the irradiated polymer in an autocatalytic bath containing metal ions and metallizing the polymer; thermally treating the metallized polymer layer to induce diffusion of the metalized metal into the first polymer layer; applying a polymer layer on the thermally treated metallized polymer; and thermally treating the metallized polymer.

Abstract translation: 本发明涉及一种将含金属痕迹嵌入有机硅聚合物层中的方法，通过以下步骤：施加不粘附到基底上的试剂; 在非粘合剂上施加聚合物层; 用由准分子激光器发射的光束照射聚合物的表面，产生切口，凹槽，盲孔或通孔; 将照射的聚合物浸入含有金属离子的自催化浴中并使聚合物金属化; 热处理金属化聚合物层以诱导金属化金属扩散到第一聚合物层中; 将聚合物层施加在经热处理的金属化聚合物上; 并对金属化聚合物进行热处理。

公开(公告)号：US20130319735A1

公开(公告)日：2013-12-05

申请号：US14000834

申请日：2012-02-15

Applicant: Hiroharu Inoue ,  Shingo Yoshioka ,  Koji Kishino ,  Takatoshi Abe

Inventor： Hiroharu Inoue ,  Shingo Yoshioka ,  Koji Kishino ,  Takatoshi Abe

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  B32B15/08 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975

Abstract: A metal-clad laminate of the present invention comprises an insulating layer, and a metal layer that is present at least on one surface side of the insulating layer. The insulating layer is a laminate of at least three layers: a center layer, a first resin layer that is present on one surface side of the center layer, and a second resin layer that is present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a respective resin composition. The elastic modulus of the cured product of the resin composition contained in the center layer is lower than the elastic moduli of both the cured product of the resin composition contained in the first resin layer and the cured product of the resin composition contained in the second resin layer.

Abstract translation: 本发明的覆金属层压板包括绝缘层和存在于绝缘层的至少一个表面侧上的金属层。 绝缘层是至少三层的层叠体：中心层，存在于中心层的一个表面侧的第一树脂层和存在于中心层的另一个表面侧的第二树脂层。 中心层，第一树脂层和第二树脂层各自含有各自的树脂组合物的固化产物。 包含在中心层中的树脂组合物的固化产物的弹性模量低于包含在第一树脂层中的树脂组合物的固化产物和包含在第二树脂中的树脂组合物的固化产物的弹性模量 层。

公开(公告)号：US20130284495A1

公开(公告)日：2013-10-31

申请号：US13932070

申请日：2013-07-01

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Alexandre Blander ,  Peter J. Brofman ,  Donald W. Henderson ,  Gareth G. Hougham ,  Hsichang Liu ,  Eric D. Perfecto ,  Srinivasa S.N. Reddy ,  Krystyna W. Semkow ,  Kamalesh K. Srivastava ,  Brian R. Sundlof ,  Julien Sylvestre ,  Renee L. Weisman

IPC: H01B1/02 ,  H01B13/00

CPC classification number: H01B1/02 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/36 ,  B23K35/3602 ,  B82Y30/00 ,  C22C13/00 ,  H01B13/00 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0209 ,  H05K2201/0257 ,  Y10T29/49117 ,  H01L2924/00

Abstract: In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.

Abstract translation: 在本发明的一个实施方案中，将尺寸为1nm至1000nm的惰性纳米尺寸颗粒加入到焊球中。 惰性纳米尺寸颗粒可以包括金属氧化物，金属氮化物，金属碳化物，金属硼化物等。惰性纳米尺寸颗粒可以是单一化合物，或者可以是具有不同材料的涂层的金属材料。 在本发明的另一个实施方案中，将少量与锡形成稳定的高熔点金属间化合物的元素金属添加到焊料球中。 添加的至少一种元素金属与锡形成金属间化合物的沉淀物，其作为细颗粒分散在焊料中。

公开(公告)号：US20130220677A1

公开(公告)日：2013-08-29

申请号：US13770225

申请日：2013-02-19

Applicant: Hitachi Cable, Ltd. ,  Hitachi Cable Fine-Tech, Ltd.

Inventor： Satoru AMOU ,  Tomiya ABE ,  Daisuke SHANAI ,  Hiroaki KOMATSU ,  Kenichi MURAKAMI

IPC: C09J181/06 ,  H05K1/02 ,  B32B5/00

CPC classification number: C09J171/00 ,  B32B3/08 ,  B32B5/00 ,  B32B7/12 ,  B32B15/08 ,  B32B27/08 ,  B32B27/281 ,  B32B2307/306 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2457/08 ,  C08G2650/54 ,  C08L79/08 ,  C09J181/06 ,  H05K1/02 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/2826 ,  Y10T428/31681 ,  Y10T428/31721 ,  C08K5/3415 ,  C08K7/04

Abstract: Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.

Abstract translation: 提供了保存稳定性，可靠性和低温粘合性优异的热固性粘合剂组合物; 以及使用该组合物得到的卷曲耐热膜和布线膜。 热固性粘合剂组合物包含100重量份在其结构中具有双酚S骨架的苯氧基树脂; 5〜30重量份在其结构中含有多个马来酰亚胺基团的马来酰亚胺化合物; 和3〜20体积％的无机针状填料。 通过将热固性粘合剂组合物涂布在聚酰亚胺膜上，然后干燥获得耐热粘合剂膜。 通过将导体布线层放置在耐热粘合膜上而获得布线膜。

公开(公告)号：US20130219514A1

公开(公告)日：2013-08-22

申请号：US13857323

申请日：2013-04-05

Applicant: TransUnion Rental Screening Solutions, Inc.

Inventor： Michael A. Britti ,  Robert D. Thornley ,  Joel R. Springer ,  Michael J. Mauseth ,  Michael J. Collins

IPC: G06F21/62

CPC classification number: H01L23/49822 ,  G06F21/62 ,  G06Q10/06 ,  G06Q10/0635 ,  G06Q10/10 ,  G06Q10/1053 ,  G06Q20/3674 ,  G06Q40/02 ,  G06Q40/025 ,  G06Q50/16 ,  G06Q50/20 ,  H01L21/48 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0271 ,  H05K3/4682 ,  H05K2201/0191 ,  H05K2201/0209

Abstract: Systems and methods for screening applicants are disclosed herein. A method of screening applicants is performed by a screening server. The server begins by receiving a selection of screening services and an applicant profile that identifies an applicant. The screening continues by generating screening results specified by the selection of screening services based on the applicant profile. A property manager is then notified that the screening results are available for the applicant based upon the applicant profile. The screening results are then provided to the property manager based upon the applicant profile. Based on these screening results, the screener or property manager can make a decision about the applicant and communicate a decision action to the applicant.

公开(公告)号：US08512856B2

公开(公告)日：2013-08-20

申请号：US12672599

申请日：2008-08-07

Applicant: Koji Takeuchi ,  Masami Matsuda ,  Kaoru Ono ,  Makoto Hosoda

Inventor： Koji Takeuchi ,  Masami Matsuda ,  Kaoru Ono ,  Makoto Hosoda

IPC: B32B5/16 ,  B32B9/04 ,  B32B9/06

CPC classification number: H05K1/056 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0281 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/31663 ,  H01L2924/00

Abstract: The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing a wiring board, including coating a surface of a metal substrate, which is made of an aluminum plate, with a composition containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties, curing the composition, then bonding a copper foil to the cured composition, and partially removing the copper foil, thereby forming a wiring layer.

Abstract translation: 本发明提供一种在长时间使用时提供良好散热的接线板。 本发明还提供了一种制造布线板的方法，其包括用含有聚硅氧烷结构的物质和具有绝缘和散热性能的无机颗粒的由铝板制成的金属基材的表面涂覆的方法 固化组合物，然后将铜箔粘合到固化的组合物上，并部分地除去铜箔，从而形成布线层。

公开(公告)号：US20130206463A1

公开(公告)日：2013-08-15

申请号：US13397010

申请日：2012-02-15

Applicant: Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: H05K1/02 ,  C07F9/40 ,  B32B1/06 ,  C08K5/5333

CPC classification number: C07F9/4012 ,  C08K3/36 ,  C08K5/5333 ,  C08K9/04 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/1372

Abstract: A non-halogenated flame retardant filler having phosphorous-modified inorganic particles imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. Phosphorous-modified silica particles, for example, may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a non-halogenated flame retardant filler comprised of phosphorous-modified silica particles. In an exemplary method of synthesizing phosphorous-modified silica particles, a vinyl-terminated phosphorous-based monomer (e.g., a phosphorous based flame retardant functionalized to contain a vinyl functional group) is reacted with vinyl functionalized silica particles (i.e., the silica particle surface is functionalized to contain a vinyl functional group). Alternatively, hydrosilated terminated silica particles may be reacted with a vinyl-terminated phosphorous-based monomer to produce phosphorous-modified silica particles.

Abstract translation: 具有磷改性的无机颗粒的非卤化阻燃填料对诸如使用热固性塑料或热塑性塑料的印刷电路板（PCB），连接器以及其他制品制成的制品赋予阻燃性。 例如，磷改性二氧化硅颗粒可以用作流变控制（粘度，流动等）和阻燃剂的填料。 在示例性应用中，PCB叠层叠层包括通过包含由磷改性二氧化硅颗粒构成的非卤化阻燃填料的介电材料彼此分开的导电平面。 在合成磷改性二氧化硅颗粒的示例性方法中，将乙烯基封端的磷基单体（例如，官能化含有乙烯基官能团的磷系阻燃剂）与乙烯基官能化二氧化硅颗粒（即，二氧化硅颗粒表面 被官能化以含有乙烯基官能团）。 或者，氢化硅烷封端的二氧化硅颗粒可以与乙烯基封端的磷基单体反应以产生磷改性的二氧化硅颗粒。

公开(公告)号：US08507801B2

公开(公告)日：2013-08-13

申请号：US13059497

申请日：2009-08-18

Applicant: Toshiyuki Kawaguchi ,  Kazutoki Tahara ,  Tsutomu Saga

Inventor： Toshiyuki Kawaguchi ,  Kazutoki Tahara ,  Tsutomu Saga

IPC: H05K1/00

CPC classification number: H05K1/0234 ,  H05K1/0218 ,  H05K1/167 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/2036 ,  Y10T428/24331 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31935

Abstract: A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.

Abstract translation: 通过粘合层将具有形成在覆盖膜体的表面上的电阻层的覆盖层膜粘附到具有形成在基板表面上的导电层的印刷线路板主体而形成印刷布线板。 电阻层通过粘合剂层与导电层分离并与之相对。

公开(公告)号：US08501583B2

公开(公告)日：2013-08-06

申请号：US12497996

申请日：2009-07-06

Applicant: Takashi Kitae ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

Inventor： Takashi Kitae ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

IPC: H01L21/30 ,  H01L21/4763

CPC classification number: H05K3/3436 ,  H01L21/563 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/0695 ,  H01L2924/05432 ,  H01L2924/0001

Abstract: A resin containing a conductive particle and a gas bubble generating agent is supplied in a space between the substrates each having a plurality of electrodes. The resin is then heated to melt the conductive particle contained in the resin and generate gas bubbles from the gas bubble generating agent. A step portion is formed on at least one of the substrates. In the process of heating the resin, the resin is pushed aside by the growing gas bubbles, and as a result of that, the conductive particle contained in the resin is led to a space between the electrodes, and a connector is formed in the space. At the same time, the resin is led to a space between parts of the substrates at which the step portion is formed, and cured to fix the distance between the substrates.

Abstract translation: 在每个具有多个电极的基板之间的空间中提供含有导电颗粒和气泡发生剂的树脂。 然后将树脂加热以熔化包含在树脂中的导电颗粒，并从气泡发生剂产生气泡。 在至少一个基板上形成台阶部。 在加热树脂的过程中，通过生长的气泡将树脂推开，其结果是，包含在树脂中的导电颗粒被引导到电极之间的空间，并且在空间中形成连接器 。 同时，树脂被引导到形成台阶部分的基板的部分之间的空间，并固化以固定基板之间的距离。