公开(公告)号：US20140097005A1

公开(公告)日：2014-04-10

申请号：US14046408

申请日：2013-10-04

Applicant: Tyco Electronics Japan G. K.

Inventor： Katsunori Fukuda ,  Akira Torigoe

IPC: H05K1/03

CPC classification number: H05K1/0306 ,  H05K3/246 ,  H05K3/387 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239

Abstract: A glass wiring board is provided that includes a glass substrate and a primer layer. The prime layer is disposed on the glass substrate and includes an intermediate layer and a copper plating layer disposed on the intermediate layer. The intermediate layer includes a resin coupling agent and a metal element dispersed in the resin coupling agent.

Abstract translation: 提供一种玻璃布线板，其包括玻璃基板和底漆层。 主层设置在玻璃基板上，并且包括设置在中间层上的中间层和镀铜层。 中间层包括树脂偶联剂和分散在树脂偶联剂中的金属元素。

公开(公告)号：US20120156512A1

公开(公告)日：2012-06-21

申请号：US13404395

申请日：2012-02-24

Applicant: Kosuke Nakano ,  Hidekiyo Takaoka

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B32B15/04 ,  B23K1/20 ,  B23K35/24

CPC classification number: B23K35/025 ,  B23K1/00 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  B23K2101/40 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83211 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  Y10T403/479 ,  Y10T428/31678 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference, i.e. a difference in between the lattice constant of the intermetallic compound and the lattice constant of the second metal component, of 50% or greater.

Abstract translation: 包括由第一金属粉末和熔点高于第一金属的第二金属粉末组成的金属成分的焊膏和焊剂成分。 第一金属是Sn或含有Sn的合金，第二金属是与第一金属形成熔点为310℃以上的金属间化合物的金属或合金，并且具有晶格常数差，即差 金属间化合物的晶格常数和第二金属成分的晶格常数之间的比例为50％以上。

公开(公告)号：US08158503B2

公开(公告)日：2012-04-17

申请号：US11474453

申请日：2006-06-26

Applicant: Tomoyuki Abe

Inventor： Tomoyuki Abe

IPC: H01L21/44

CPC classification number: H05K3/4614 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/3473 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0215 ,  H05K2201/10378 ,  H01L2924/00

Abstract: A multilayer interconnection substrate is disclosed that includes a multilayer interconnection layer having at least a first interconnection layer and a second interconnection layer stacked with an insulating layer provided therebetween, and a connection via configured to electrically connect the first interconnection layer and the second interconnection layer. The connection via includes an internal conductor and a metal film covering the internal conductor. The internal conductor is an aggregate of metal particles.

Abstract translation: 公开了一种多层互连衬底，其包括具有至少第一互连层和层叠有设置在其间的绝缘层的第二互连层的多层互连层，以及经配置以电连接第一互连层和第二互连层的连接通孔。 连接通孔包括内部导体和覆盖内部导体的金属膜。 内部导体是金属颗粒的聚集体。

公开(公告)号：US08102005B2

公开(公告)日：2012-01-24

申请号：US12371269

申请日：2009-02-13

Applicant: Hiroko Yamamoto ,  Osamu Nakamura

Inventor： Hiroko Yamamoto ,  Osamu Nakamura

IPC: H01L21/70

CPC classification number: H01L21/76838 ,  H01L21/28008 ,  H01L21/28026 ,  H01L21/28079 ,  H01L21/28123 ,  H01L21/288 ,  H01L21/76823 ,  H01L21/76825 ,  H01L21/76894 ,  H01L27/1292 ,  H01L29/458 ,  H01L29/4908 ,  H01L29/66757 ,  H01L29/66765 ,  H01L2224/4847 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13091 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0215 ,  H05K2203/0597 ,  H05K2203/107 ,  H05K2203/1131 ,  Y02P70/605 ,  Y10T428/24917 ,  H01L2924/00

Abstract: The present invention provides a method for forming a wiring having a minute shape on a large substrate with a small number of steps, and further a wiring substrate formed by the method. Moreover, the present invention provides a semiconductor device in which cost reduction and throughput improvement are possible due to the small number of steps and reduction of materials and which has a semiconductor element with a minute structure, and further a manufacturing method thereof. According to the present invention, a composition including metal particles and organic resin is irradiated with laser light and a part of the metal particles is baked to form a conductive layer typified by a wiring, an electrode or the like over a substrate. Further, a semiconductor device having the baked conductive layer as a wiring or an electrode is formed.

Abstract translation: 本发明提供了一种在具有少量步骤的大基板上形成具有微小形状的布线的方法，并且还提供了通过该方法形成的布线基板。 此外，本发明提供一种半导体器件，其中由于少量的步骤和材料的减少以及具有微小结构的半导体元件，成本降低和生产率提高是可能的，并且还提供了其制造方法。 根据本发明，用激光照射包含金属颗粒和有机树脂的组合物，并且将一部分金属颗粒烘烤以形成通过基板上的布线，电极等代表的导电层。 此外，形成具有烘烤的导电层作为布线或电极的半导体器件。

公开(公告)号：US08022551B2

公开(公告)日：2011-09-20

申请号：US11399856

申请日：2006-04-07

Applicant: Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

Inventor： Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H01L29/40

CPC classification number: H01L24/13 ,  B32B15/01 ,  C22C5/02 ,  C22C9/02 ,  C22C11/06 ,  C22C13/00 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/4924 ,  H01L23/49513 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81409 ,  H01L2224/81815 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/045 ,  H05K2201/09572 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract translation: 在半导体器件和衬底之间形成的每一个接合点包括Cu的金属球或Sn的其它材料和化合物以及金属球，金属球通过化合物结合在一起。

公开(公告)号：US20110138615A1

公开(公告)日：2011-06-16

申请号：US12753697

申请日：2010-04-02

Applicant: Keung Jin Sohn ,  Chang Gun Oh ,  Tae Eun Chang

Inventor： Keung Jin Sohn ,  Chang Gun Oh ,  Tae Eun Chang

IPC: H05K3/00 ,  B23P17/04 ,  B23P19/00

CPC classification number: H05K3/0097 ,  H05K3/4682 ,  H05K2201/0215 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/104 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53265

Abstract: Disclosed herein is a carrier for manufacturing a printed circuit board, including: a magnetic sheet; and a metal layer attached to at least one side of the magnetic sheet by magnetic properties of the magnetic sheet. The carrier is advantageous in that its structure can be simplified without performing a vacuum or releasing process at the time of the attachment and separation of the carrier, thus reducing process cost and process time and maintaining the size of a printed circuit board.

Abstract translation: 本文公开了一种用于制造印刷电路板的载体，包括：磁性片; 以及通过磁性片的磁性能而附着在磁性片的至少一侧的金属层。 载体的优点在于，可以简化其结构，而不会在载体的附着和分离时执行真空或释放过程，从而降低工艺成本和加工时间并保持印刷电路板的尺寸。

公开(公告)号：US20110108776A1

公开(公告)日：2011-05-12

申请号：US13009688

申请日：2011-01-19

Applicant: Takahiro MATSUMOTO ,  Toshiaki Yamada ,  Hirotaka Tsuruya

Inventor： Takahiro MATSUMOTO ,  Toshiaki Yamada ,  Hirotaka Tsuruya

IPC: H01B1/08

CPC classification number: H05K1/162 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/40 ,  C04B35/628 ,  C04B35/62821 ,  C04B2235/3293 ,  C09C1/00 ,  H01B1/08 ,  H01B3/006 ,  H01B3/02 ,  H01B3/10 ,  H01G4/206 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/268 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: There are disclosed insulated ultrafine powder comprising electroconductive ultrafine powder which is in the form of sphere, spheroid or acicular each having a minor axis in the range of 1 to 100 nm and an insulating film applied thereto; a process for producing the same which is capable of covering the surfaces of the insulated ultrafine powder with the insulating film having a thickness in the range of 0.3 to 100 nm without causing any clearance or vacancy; and a resin composite material which uses the same. A high dielectric constant of the material is assured by adding a small amount of insulated ultrafine powder wherein an insulating film is applied to the electroconductive ultrafine powder, while maintaining the processability and moldability that are the characteristics inherent in a resin material.

Abstract translation: 公开了包含导电性超细粉末的绝缘超细粉末，其为球状，球状或针状，各具有1〜100nm的短轴和施加于其上的绝缘膜; 其制造方法能够利用厚度在0.3〜100nm范围内的绝缘膜覆盖绝缘超细粉末的表面，而不会产生任何间隙或空位; 和使用该树脂复合材料的树脂复合材料。 通过在保持作为树脂材料中固有的特性的加工性和成型性的同时，通过添加少量绝缘超细粉末来确保材料的高介电常数，其中绝缘膜被施加到导电超细粉末。

公开(公告)号：US20110061230A1

公开(公告)日：2011-03-17

申请号：US12953158

申请日：2010-11-23

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H01R43/00

CPC classification number: H05K1/0254 ,  C25D5/54 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.

Abstract translation: 一种方法包括提供具有特征电压的电压可切换电介质材料，将电压可切换电介质材料暴露于与导电材料相关的离子源，并且产生电源和可切换电介质材料之间的电压差大于 特征电压。 允许电流从电压可切换介电材料流出，并且导电材料沉积在可开关电介质材料上。 身体包括电​​压可​​切换电介质材料和使用电化学过程沉积在可开关电介质材料上的导电材料。 在一些情况下，使用电镀沉积导电材料。

公开(公告)号：US20110051376A1

公开(公告)日：2011-03-03

申请号：US12941894

申请日：2010-11-08

Applicant: Daewoong Suh ,  Stephen E. Lehman, JR. ,  Mukul Renavikar

Inventor： Daewoong Suh ,  Stephen E. Lehman, JR. ,  Mukul Renavikar

IPC: H05K7/00 ,  H05K1/11

CPC classification number: H05K3/3484 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/11 ,  H01L2224/11822 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/81011 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H05K3/244 ,  H05K3/3436 ,  H05K2201/0215 ,  H05K2201/0341 ,  H05K2203/0435 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract translation: 描述了一种微电子组件及其制造方法。 在一个示例中，微电子组件包括具有一个或多个区域以接收一个或多个焊球的表面的微电子器件，所述一个或多个区域具有包括Ni的表面光洁度。 将包含Cu的焊料材料（例如焊剂或糊料）施加到Ni表面光洁度上，并且一个或多个焊球通过在一个或多个焊球之间形成焊料接头的回流工艺耦合到微电子器件，焊料 包含Cu的材料，并且所述一个或多个区域具有包括Ni的表面光洁度。

公开(公告)号：US20110017501A1

公开(公告)日：2011-01-27

申请号：US12935662

申请日：2009-03-26

Applicant: Tadahiro Ohmi ,  Akinobu Teramoto ,  Masayuki Ishizuka ,  Nobuhiro Hidaka ,  Yasushi Shirakata

Inventor： Tadahiro Ohmi ,  Akinobu Teramoto ,  Masayuki Ishizuka ,  Nobuhiro Hidaka ,  Yasushi Shirakata

IPC: H05K1/00 ,  B32B5/16 ,  B32B5/00 ,  B05D7/00 ,  B05D3/12

CPC classification number: H05K1/0373 ,  B22F1/02 ,  B22F2998/00 ,  C22C2202/02 ,  H01F1/24 ,  H01F1/26 ,  H01F1/37 ,  H05K1/0233 ,  H05K1/024 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/086 ,  Y10T428/24 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  B22F3/16

Abstract: This invention provides a composite material useful for size reduction of electronic components and circuit boards mounted on electronic equipment and exhibiting a low magnetic loss (tan δ), and a manufacturing method thereof. The composite material contains an insulating material and particulates dispersed in this insulating material, the particulates being previously coated with an insulating material having substantially the same composition as that of the coating insulating material. The particulates consist of an organic or inorganic substance and preferably have a flat shape. The insulating material may be an insulating material commonly used in the field of electronic components. The composite material of the invention is preferably manufactured by a manufacturing method in which the particulates are previously coated with an insulating material and dispersed in an insulating material having substantially the same composition as that of the coating insulating material. The composite material of the invention can be applied as a material for circuit boards and/or electronic components to realize further reduction in size and power consumption of information and telecommunication equipment in a frequency band of several hundred MHz to 1 GHz.

Abstract translation: 本发明提供一种复合材料及其制造方法，该复合材料可用于安装在电子设备上的电子部件和电路板的尺寸减小并且具有低的磁损耗（tanδ）。 复合材料包含绝缘材料和分散在该绝缘材料中的微粒，预先用绝缘材料涂覆颗粒，该绝缘材料具有与涂层绝缘材料基本相同的组成。 微粒由有机或无机物构成，优选具有平坦的形状。 绝缘材料可以是电子部件领域中常用的绝缘材料。 本发明的复合材料优选通过制造方法制造，其中颗粒预先用绝缘材料涂覆并分散在具有与涂层绝缘材料基本相同的组成的绝缘材料中。 本发明的复合材料可以用作电路板和/或电子部件的材料，以实现在数百MHz至1GHz的频带内的信息和电信设备的尺寸和功耗的进一步减小。