公开(公告)号：US09173281B2

公开(公告)日：2015-10-27

申请号：US13944715

申请日：2013-07-17

Applicant: Electronics and Telecommunications Research Institute

Inventor： Yong Hee Kim ,  Sang Don Jung ,  Nam Seob Baek ,  Gookhwa Kim

IPC: H05K3/02 ,  H05K3/10 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/02 ,  H05K3/10 ,  H05K3/4007 ,  H05K2201/0257 ,  H05K2201/099

Abstract: Provide are an electrode sensor and a method of fabricating the same. the method may include providing a substrate with a first electrode, forming a resist layer on the substrate to cover the first electrode, patterning the resist layer to expose a portion of the first electrode, forming an insulating layer on the substrate, removing the insulating layer on the resist layer and the resist layer to form a well in the insulating layer, and forming a second electrode in the well to be electrically connected to the first electrode. According to the method, it is possible to prevent the first electrode from being damaged. In addition, the second electrode may be configured have an increased surface area, and thus, the electrode can have low impedance.

Abstract translation: 提供电极传感器及其制造方法。 该方法可以包括提供具有第一电极的衬底，在衬底上形成抗蚀剂层以覆盖第一电极，图案化抗蚀剂层以暴露第一电极的一部分，在衬底上形成绝缘层，去除绝缘层 在所述抗蚀剂层和所述抗蚀剂层上，在所述绝缘层中形成阱，以及在所述阱中形成电连接到所述第一电极的第二电极。 根据该方法，可以防止第一电极被损坏。 此外，第二电极可以被配置为具有增加的表面积，因此电极可以具有低阻抗。

公开(公告)号：US09167684B2

公开(公告)日：2015-10-20

申请号：US13902149

申请日：2013-05-24

Applicant: Nokia Corporation

Inventor： Mark Lee Allen ,  Chris Bower ,  Darryl Cotton

IPC: H05K1/16 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09 ,  H01L23/00 ,  H05K3/10

CPC classification number: H05K1/0272 ,  H01L23/52 ,  H01L24/00 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/24101 ,  H01L2224/24226 ,  H01L2224/24997 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2224/2919 ,  H01L2224/82101 ,  H01L2224/82138 ,  H01L2224/8284 ,  H01L2224/82862 ,  H01L2224/82874 ,  H01L2224/82877 ,  H01L2224/82986 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H05K1/092 ,  H05K1/097 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0257 ,  H05K2201/0302 ,  H05K2201/09036 ,  H05K2201/09227 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A substrate including a fluid reservoir and a connected fluid channel, the fluid reservoir positioned away from a component region of the substrate, the fluid channel configured to extend from the fluid reservoir to guide an electrically conductive fluid from the fluid reservoir at a reservoir end of the fluid channel through the fluid channel to a component end of the fluid channel, the component end extending to the component region of the substrate to enable the formation of an electrical connection to a connector of an electronic component appropriately positioned in the component region, formation of the electrical connection allowing the electronic component to be interconnected to other electronic components using one or more of the fluid reservoir and fluid channel.

Abstract translation: 包括流体储存器和连接的流体通道的基板，所述流体储存器远离所述基板的部件区域定位，所述流体通道被配置为从所述流体储存器延伸以在所述流体储存器的储存器端部处从所述流体储存器引导导电流体 通过流体通道的流体通道流到流体通道的部件端，部件端部延伸到基板的部件区域，以使得能够形成与适当地定位在部件区域中的电子部件的连接器的电连接，形成 的电连接，允许使用一个或多个流体储存器和流体通道将电子部件互连到其他电子部件。

公开(公告)号：US09107275B2

公开(公告)日：2015-08-11

申请号：US13503772

申请日：2010-11-02

Applicant: Shlomo Magdassi ,  Michael Grouchko ,  Michael Layani

Inventor： Shlomo Magdassi ,  Michael Grouchko ,  Michael Layani

IPC: H01L31/0224 ,  H05B33/28 ,  C23C4/18 ,  C23C26/00 ,  H01L31/18 ,  C23C16/513 ,  B05D3/10 ,  B05D5/06 ,  B05D5/12 ,  H01L33/42

CPC classification number: H05B33/28 ,  B05D3/107 ,  B05D5/061 ,  B05D5/12 ,  C23C4/18 ,  C23C16/513 ,  C23C26/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/10 ,  H01L31/022466 ,  H01L31/1884 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2933/0016 ,  H05K1/0225 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/125 ,  Y02E10/50 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/249978 ,  Y10T428/249979 ,  H01L2924/00

Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

Abstract translation: 本发明提供了用于制造导电透明膜的方法和包括其的电子或光电子器件。

公开(公告)号：US20150047885A1

公开(公告)日：2015-02-19

申请号：US14080810

申请日：2013-11-15

Applicant: Industrial Technology Research Institute

Inventor： Yu-Pei Chang ,  Ming-Huan Yang ,  Chun-Yi Chiu

IPC: H05K1/02 ,  H05K3/10 ,  H05K1/09

CPC classification number: H05K3/02 ,  B82Y40/00 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/097 ,  H05K3/20 ,  H05K3/4685 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/09245 ,  H05K2203/1105 ,  H05K2203/1142 ,  Y10S977/932 ,  Y10T428/24802

Abstract: Provided is a patterned conductive film may include a conductive interconnected nano-structure film. The conductive interconnected nano-structure film may include a first region and a second region adjacent to the first region. A conductivity of the first region may be at least 1000 times a conductivity of the second region.

Abstract translation: 提供了图案化的导电膜可以包括导电互连的纳米结构膜。 导电互连的纳米结构膜可以包括与第一区域相邻的第一区域和第二区域。 第一区域的电导率可以是第二区域的电导率的至少1000倍。

公开(公告)号：US08916089B2

公开(公告)日：2014-12-23

申请号：US12155674

申请日：2008-06-06

Applicant: Mark Allen ,  Tomi Mattila ,  Ari Alastalo ,  Heikki Seppä

Inventor： Mark Allen ,  Tomi Mattila ,  Ari Alastalo ,  Heikki Seppä

IPC: B22F7/00

CPC classification number: H05K3/02 ,  H05K3/105 ,  H05K3/1266 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/0117 ,  H05K2203/0121 ,  H05K2203/0143 ,  H05K2203/0517 ,  H05K2203/105 ,  H05K2203/1131 ,  H05K2203/1545

Abstract: This publication discloses a method and apparatus for functionalizing nanoparticle systems. The method comprises treating a nanoparticle-containing layer so as to produce a pattern of structurally transformed zones, the treatment comprising applying an electric field through the nanoparticle layer. According to the invention an AC-field capacitively coupled to the nanoparticle-containing layer is used as said electric field. The treatment preferably results in at least partly sintered structures, which can be used as conductors, for example. The document discloses several realizations for utilization of the disclosed functionalization in mass-fabrication lines.

Abstract translation: 该出版物公开了一种功能化纳米粒子体系的方法和装置。 该方法包括处理含纳米颗粒的层以产生结构转化区的图案，该处理包括通过纳米颗粒层施加电场。 根据本发明，使用电容耦合到含纳米粒子层的AC场作为所述电场。 处理优选地导致例如至少部分烧结的结构，其可以用作导体。 该文献公开了在批量生产线中利用所公开的功能化的几种实现。

公开(公告)号：US08821676B2

公开(公告)日：2014-09-02

申请号：US13099394

申请日：2011-05-03

Applicant: Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

Inventor： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC: B29C65/02 ,  B32B5/02 ,  B32B5/16

CPC classification number: H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract translation: 一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US20140242287A1

公开(公告)日：2014-08-28

申请号：US13775208

申请日：2013-02-24

Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC

Inventor： Suk Kwan KWONG ,  Weijuan ZHOU ,  Wenjia ZHOU ,  Dennis Chit Yiu CHAN ,  Dennis Kwok-Wai YEE

IPC: B01J31/06

CPC classification number: C23C18/31 ,  B01J23/38 ,  B01J23/44 ,  B01J23/50 ,  B01J31/06 ,  B01J35/0013 ,  B01J37/0217 ,  B01J37/0219 ,  B01J37/16 ,  C23C18/1831 ,  C23C18/1834 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/30 ,  C23C18/38 ,  H05K3/185 ,  H05K3/381 ,  H05K3/422 ,  H05K2201/0257 ,  H05K2203/0766 ,  H05K2203/0783 ,  H05K2203/095

Abstract: A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has π electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface.

Abstract translation: 包含贵金属纳米颗粒和由至少两种单体聚合的聚合物的溶液，（1）具有两个或更多个羧基或羧酸盐基团的单体和（2）具有＆ 电子可用特征。 该溶液可用于在非导电表面上无电镀金属的方法的催化剂。

公开(公告)号：US08800479B2

公开(公告)日：2014-08-12

申请号：US13962379

申请日：2013-08-08

Applicant: The Boeing Company

Inventor： Jonathan B. Vance ,  Scott R. Johnston

IPC: B05B5/04 ,  B05B5/043 ,  H05K3/14 ,  B05B5/025 ,  H05K3/12 ,  H01L51/00

CPC classification number: B05B5/025 ,  H01L51/0022 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/105

Abstract: A system for in-process orientation of particles used in direct-write inks for fabricating a component may include a device for polarizing direct-write particles in an aerosol. An outlet may direct the aerosol including the polarized direct-write particles on a substrate to form a component. An apparatus may cause the polarized direct-write particles to be aligned in a selected orientation to form the component with predetermined characteristics when deposited on the substrate.

Abstract translation: 用于制造组件的直写式油墨中使用的颗粒的在线取向系统可以包括用于使气溶胶中的直写式颗粒偏振的装置。 出口可将包括极化直写式颗粒的气溶胶引导到基底上以形成组分。 当沉积在基底上时，装置可以使极化的直写粒子以选定的取向对准以形成具有预定特征的组分。

公开(公告)号：US08760606B2

公开(公告)日：2014-06-24

申请号：US12905664

申请日：2010-10-15

Applicant: Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

Inventor： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

IPC: G02F1/1333

CPC classification number: H01L31/022425 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01B1/02 ,  H01L27/1421 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/022466 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/1884 ,  H01L33/38 ,  H01L33/40 ,  H01L51/0021 ,  H01L51/0048 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5212 ,  H05K1/095 ,  H05K1/097 ,  H05K3/06 ,  H05K3/245 ,  H05K3/249 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10S977/95 ,  Y10T29/49155

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是透明的，可图案化的，并且适合作为诸如触摸屏，液晶显示器，等离子显示面板等的视觉显示装置中的透明电极。

公开(公告)号：US20140113109A1

公开(公告)日：2014-04-24

申请号：US14124509

申请日：2011-06-10

Applicant: Satoru Kurita ,  Takashi Hinotsu ,  Shinya Sasaki

Inventor： Satoru Kurita ,  Takashi Hinotsu ,  Shinya Sasaki

IPC: C09J11/06

CPC classification number: C09J11/06 ,  B22F1/0018 ,  B22F1/0062 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/24413 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00014

Abstract: A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.

Abstract translation: 使用银纳米颗粒的接合材料响应于组成的轻微变化而显着改变涂层材料性质，并且其稳定性对于大量施加而言不足。 使用银纳米颗粒的接合材料满足大量印刷的要求，获得尺寸稳定性，并提供光滑的印刷表面。 接合材料包括至少具有1nm至200nm的平均初级粒径且已经涂覆有碳原子数为8以下的有机物的分散介质和由有机物构成的粘度调节剂的银纳米粒子， 并且具有100Pa·s以下的粘度（在剪切速度15.7 [1 / s]下测定）和在剪切速度为15.7°下测定的触变性比（在剪切速度3.1 [1 / s]下测定） [1 / s]）为4以下。