公开(公告)号：US4360560A

公开(公告)日：1982-11-23

申请号：US18734

申请日：1979-03-08

Applicant: Siegfried Kopnick ,  Dirk Huthwelker ,  Arnold Franz ,  Lothar Jacob

Inventor： Siegfried Kopnick ,  Dirk Huthwelker ,  Arnold Franz ,  Lothar Jacob

IPC: B32B29/00 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  B32B27/04 ,  B32B27/30 ,  B32B27/42 ,  B32B31/12 ,  H05K1/00

CPC classification number: H05K1/036 ,  B32B29/00 ,  H05K3/387 ,  H05K2201/0133 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1476 ,  H05K3/181 ,  Y10S428/901 ,  Y10T428/31877 ,  Y10T442/3561 ,  Y10T442/3577

Abstract: A base material for the production of printed circuits according to the additive method includes a laminate base made up of laminated-together core sheets impregnated with hardenable resin, and a cover layer made up of a substrate sheet preimpregnated with phenolic resol resin and provided with an adhesive layer of an elastomeric polymer. The preimpregnated substrate sheet is also provided with a further resin impregnation containing a self-crosslinking copolymer of acrylic monomers and up to 30% by weight of a hardenable phenolic resol resin.

Abstract translation: 用于根据添加剂方法生产印刷电路的基材包括由浸渍有可硬化树脂的层叠在一起的芯片构成的层叠基材和由预先浸渍有酚醛树脂树脂的基材片构成的覆盖层， 弹性体聚合物的粘合剂层。 预浸渍的基材片还具有进一步的树脂浸渍，其含有丙烯酸单体的自交联共聚物和最多30重量％的可硬化酚醛树脂树脂。

公开(公告)号：US4302501A

公开(公告)日：1981-11-24

申请号：US913879

申请日：1978-06-08

Applicant: Koreyuki Nagashima

Inventor： Koreyuki Nagashima

IPC: B32B15/04 ,  B32B5/26 ,  B32B15/08 ,  H05K1/03 ,  H05K3/04 ,  B32B5/28 ,  B32B5/32 ,  H05K1/00

CPC classification number: B32B5/26 ,  H05K1/036 ,  H05K3/041 ,  H05K2201/0116 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0108 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249965 ,  Y10T428/266 ,  Y10T428/269

Abstract: The insulating substrate comprises an insulating sheet made of cellulose material and a prepreg impregnated with a thermosetting resin and bonded to at least one surface of the insulating substrate. A printed circuit board is prepared by forming electric conductors arranged in a predetermined circuit pattern on the surface of the prepreg.

Abstract translation: 绝缘基板包括由纤维素材料制成的绝缘片和浸渍有热固性树脂并与绝缘基底的至少一个表面接合的预浸料。 通过在预浸料坯的表面上形成以预定电路图案布置的导电体来制备印刷电路板。

公开(公告)号：US4170508A

公开(公告)日：1979-10-09

申请号：US919472

申请日：1978-06-27

Applicant: Joachim Wortmann ,  Burkhard Schonrogge ,  Joseph Cremer ,  Franz-Josef Dany

Inventor： Joachim Wortmann ,  Burkhard Schonrogge ,  Joseph Cremer ,  Franz-Josef Dany

IPC: B32B27/18 ,  C08K3/32 ,  H05K1/03 ,  C09J5/02

CPC classification number: H05K1/0373 ,  B32B27/18 ,  C08K3/32 ,  H05K2201/012 ,  H05K2201/0284 ,  H05K2201/0293

Abstract: Self-extinguishing laminates are made by an improved process, wherein individual layers of a carrier material are impregnated with a thermosetting phenolic resin containing a flame-retardant agent and the impregnated layers are placed one above another and bonded together by compressing them at elevated temperature and under elevated pressure to give a hardened laminate. More specifically, finely pulverulent phosphorus pentanitride as a flame-retarding agent is dispersed in the plasticized or non-plasticized thermosetting phenolic resin, with or without a diluent; the phenolic resin, based on its solid matter content, and the phosphorus pentanitride being used in an approximate ratio by weight of 100:4 to 100:15; and the phenolic resin, based on its solid matter content, and the carrier being used in an approximate ratio by weight of 100:80 to 100:150.

Abstract translation: 通过改进的方法制造自熄性层压体，其中载体材料的各层用含有阻燃剂的热固性酚醛树脂浸渍，并且将浸渍层一个放置在另一个上，并将其通过在高温下压缩而粘合在一起， 在高压下得到硬化层压板。 更具体地，作为阻燃剂的细粉状磷化磷酸铝分散在具有或不具有稀释剂的增塑或未塑化的热固性酚醛树脂中; 基于其固体物质含量的酚醛树脂和近似重量比为100:4至100:15使用的五氮化磷; 和酚醛树脂，基于其固体成分含量，载体的使用重量比约为100:80至100:50。

公开(公告)号：US3981761A

公开(公告)日：1976-09-21

申请号：US392001

申请日：1973-08-27

Applicant: Yasuhiro Kojima ,  Niiti Matunaga ,  Motoki Nawa

Inventor： Yasuhiro Kojima ,  Niiti Matunaga ,  Motoki Nawa

IPC: B44C1/16 ,  B41M3/12 ,  B44C1/175 ,  C04B41/86 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/20 ,  H05K3/28 ,  B32B7/04

CPC classification number: H05K3/207 ,  B41M3/12 ,  B44C1/175 ,  H05K1/0284 ,  H05K1/167 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0284 ,  H05K2203/0531 ,  H05K2203/0786 ,  H05K3/28 ,  Y10S428/901 ,  Y10S428/914

Abstract: A process for the manufacture of printed substrates and decalcomania compositions used therefor comprising a permeable backing paper, water-soluble binder, printed pattern such as hybrid or monolithic circuit, and removable cover coat, these components being laminated one upon another.

Abstract translation: 用于制造用于其的印刷基材和decalcomania组合物的方法包括可渗透的背纸，水溶性粘合剂，诸如混合或单片电路的印刷图案和可移除的覆盖层，这些组分彼此层压。

公开(公告)号：US3729819A

公开(公告)日：1973-05-01

申请号：US3729819D

申请日：1970-01-09

Applicant: NIPPON TOKI KK

Inventor： HORIE I

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/20 ,  H05K3/40 ,  B41M3/08

CPC classification number: H05K3/207 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/16 ,  H05K3/403 ,  H05K2201/0284 ,  H05K2203/0531 ,  H05K2203/0786 ,  Y10T29/49155

Abstract: A transfer device comprises a base layer of paper or the like, an adhesive layer attached to said base layer directly or by means of a thin paper, a conductive pattern or circuit element pattern printed on said adhesive layer and, further, a carrier layer over said pattern. Printed wiring, integrated circuits or the like are fabricated by printing a circuit pattern on the base layer and covering same with the carrier layer, removing the base layer and mounting the circuit pattern and carrier layer on a substrate.

Abstract translation: 转印装置包括纸层等的基层，直接或通过薄纸附着到所述基底层的粘合剂层，印刷在所述粘合剂层上的导电图案或电路元件图案，以及另外的载体层 说模式。 印刷布线，集成电路等通过在基底层上印刷电路图案并与载体层相同的方式制造，除去基底层并将电路图案和载体层安装在基底上。

公开(公告)号：US08815375B2

公开(公告)日：2014-08-26

申请号：US13395659

申请日：2010-09-09

Applicant: Wolfgang Schmidt ,  Kirsten Barth-Gremmel

Inventor： Wolfgang Schmidt ,  Kirsten Barth-Gremmel

IPC: B41M5/00 ,  B44C1/17 ,  G03G7/00 ,  B41M5/52 ,  B41M5/50

CPC classification number: B41M5/5218 ,  B41M5/506 ,  B41M5/52 ,  B41M5/5254 ,  H01L51/0096 ,  H05K1/0386 ,  H05K1/0393 ,  H05K3/1208 ,  H05K3/125 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/05 ,  H05K2203/013 ,  Y02E10/549 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/249979

Abstract: Support materials for printing electrically conductive structures by means of inkjet printing with inks which contain conductive particles lead to low resistances for the printed structures without thermal post-treatment when they contain a microporous layer with a mean pore size of less than 100 nm as an outer layer.

Abstract translation: 用于通过喷墨印刷印刷导电结构的支撑材料，其中含有导电颗粒的油墨导致印刷结构的低电阻，当它们含有平均孔径小于100nm的微孔层作为外部时，不进行热后处理 层。

公开(公告)号：US20120275119A1

公开(公告)日：2012-11-01

申请号：US13508994

申请日：2010-11-15

Applicant: Mark Allen ,  Jaakko Leppäniemi ,  Tomi Mattila

Inventor： Mark Allen ,  Jaakko Leppäniemi ,  Tomi Mattila

IPC: B05D5/12 ,  H05K7/00 ,  H05K3/30 ,  C11D7/60 ,  H05K3/00 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: H05K3/32 ,  B82Y30/00 ,  C09D11/52 ,  H05K1/038 ,  H05K3/12 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/38 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/10106 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

Abstract: The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate is used which is capable of facilitating said removal of encapsulating material. The particles may be nanoparticles. In particular, the substrate-facilitated removal may result in sintering of the particles. The invention provides a novel way of functionalizing electronic structures using particulate matter and for conveniently producing e.g. printed electronics devices.

Abstract translation: 本发明涉及一种从沉积在基底上的封装颗粒中去除包封材料的方法。 根据该方法，使用能够促进所述去除封装材料的基板。 颗粒可以是纳米颗粒。 特别地，底物促进的去除可能导致颗粒的烧结。 本发明提供了使用颗粒物质使电子结构功能化的新颖方法，并且方便地生产例如 印刷电子设备。

公开(公告)号：US08025766B2

公开(公告)日：2011-09-27

申请号：US12529845

申请日：2008-03-04

Applicant: Hiroaki Kuwahara ,  Yoshio Bando ,  Chunyi Zhi ,  Chengchun Tang ,  Dmitri Golberg

Inventor： Hiroaki Kuwahara ,  Yoshio Bando ,  Chunyi Zhi ,  Chengchun Tang ,  Dmitri Golberg

IPC: D21F11/00

CPC classification number: D21H13/46 ,  B82Y10/00 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0386 ,  H05K2201/026 ,  H05K2201/0284

Abstract: A boron nitride fiber paper having a very small fiber diameter and exhibiting excellent heat resistance, mechanical properties and heat conductivity. The fiber paper is composed of a fiber assembly which contains boron nitride fibers having a fiber diameter of not more than 1 μm in an amount of not less than 40 wt %.

Abstract translation: 具有非常小的纤维直径且显示出优异的耐热性，机械性能和导热性的氮化硼纤维纸。 纤维纸由含有不小于40重量％的纤维直径不大于1μm的氮化硼纤维的纤维集合体组成。

公开(公告)号：US20100284187A1

公开(公告)日：2010-11-11

申请号：US12663072

申请日：2008-05-21

Applicant: Hans Layer ,  Bertrand Jannon

Inventor： Hans Layer ,  Bertrand Jannon

IPC: F21S4/00

CPC classification number: H05K1/181 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0386 ,  H05K1/056 ,  H05K2201/0284 ,  H05K2201/09254 ,  H05K2201/09318 ,  H05K2201/0949 ,  H05K2201/10106 ,  Y02P70/611

Abstract: Planar illumination device comprise light-emitting illumination elements arranged on a carrier, containing an electrically conductive layer and an insulating 5 layer (LEDs). The light-emitting illumination elements are connected to current feed lines in the form of a conductor path. The light-emitting illumination elements are arranged as a succession of identical units on a continuous conductor path, in each case on the electrically insulating layer of the carrier. The current discharge from the light-emitting illumination elements is represented by a conductor discharging the current and by means of a connection to the electrically conductive layer of the carrier. The planar illumination device has any number of units extending in the longitudinal and transverse direction. Cutting zones, along which any units or groups of units can be separated off or separated out, are arranged between the units.

Abstract translation: 平面照明装置包括布置在载体上的发光照明元件，其包含导电层和绝缘5层（LED）。 发光照明元件以导体路径的形式连接到电流馈电线。 发光照明元件在连续的导体路径上排列成相同的单元，每种情况都在载体的电绝缘层上。 来自发光照明元件的电流放电由导体排出电流并通过与载体的导电层的连接来表示。 平面照明装置具有在纵向和横向方向上延伸的任何数量的单元。 任何单位或一组单位可以分离或分离的切割区域布置在单元之间。

公开(公告)号：US07738261B2

公开(公告)日：2010-06-15

申请号：US11941363

申请日：2007-11-16

Applicant: Takuro Sekiya

Inventor： Takuro Sekiya

IPC: H05K7/02 ,  H05K1/00

CPC classification number: H05K3/125 ,  B41J2/2135 ,  B41J2/2142 ,  B41J3/28 ,  B41J3/407 ,  B41J3/543 ,  H05K1/0313 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/1208 ,  H05K2201/0284 ,  Y10T442/2762 ,  Y10T442/277

Abstract: A functional device fabrication apparatus is provided for forming a wiring pattern or an electronic device on a substrate using paper or paper-based material by depositing solid content of a solution on the substrate. The functional device fabrication apparatus includes a jet head. The jet head jets the solution including electronic function material onto the substrate as dot patterns. The jet head includes a device for dispensing a droplet of the solution from the jet head. A drive signal applied to the device is configured to cause the droplet jetted by the device to have a specific shape before impacting a face of the substrate.

Abstract translation: 提供了一种功能元件制造装置，用于通过在基板上沉积溶液的固体含量，使用纸或纸基材料在基板上形成布线图案或电子器件。 功能元件制造装置包括喷头。 喷射头将包含电子功能材料的溶液喷射到基板上作为点图案。 喷射头包括用于从喷射头分配溶液的液滴的装置。 施加到装置的驱动信号被配置为使得在冲击基板的表面之前由装置喷射的液滴具有特定形状。