公开(公告)号：US20030008590A1

公开(公告)日：2003-01-09

申请号：US10162027

申请日：2002-06-04

Applicant: Polymer Group, Inc.

Inventor： Jerry Zucker ,  Nick Mark Carter

IPC: B32B005/02 ,  B32B027/04 ,  B32B027/12 ,  D04H001/46 ,  D04H003/10 ,  D04H005/02

CPC classification number: H05K1/0366 ,  B29C70/12 ,  B29C70/16 ,  B29C70/50 ,  B29L2031/3425 ,  D04H1/48 ,  D04H1/49 ,  D04H1/495 ,  D04H3/11 ,  D04H5/02 ,  D04H5/03 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/107 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/09045 ,  H05K2201/09127 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/065 ,  Y10T442/259 ,  Y10T442/689

Abstract: The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (Printed Circuit Board) and similar application. By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.

Abstract translation: 本发明涉及非织造基材，特别涉及赋予三维图像的非织造基材，其中三维非织造基材特别适用于PCB（印刷电路板）的支撑基板和类似应用。 通过利用浸渍有耐用的树脂基质，PCB和类似应用的水刺，三维成像的支撑基底，可以赋予独特且有用的性能特性，以改善结构性能。

公开(公告)号：US06407017B1

公开(公告)日：2002-06-18

申请号：US09416047

申请日：1999-10-12

Applicant: Masanori Wada ,  Sadamitsu Murayama ,  Michikage Matsui

Inventor： Masanori Wada ,  Sadamitsu Murayama ,  Michikage Matsui

IPC: D02G300

CPC classification number: H01B3/52 ,  D21H13/24 ,  D21H13/26 ,  D21H15/02 ,  D21H15/06 ,  D21H17/52 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/2973 ,  Y10T428/2976 ,  Y10T428/2978 ,  Y10T442/609 ,  Y10T442/61 ,  Y10T442/611 ,  Y10T442/69 ,  Y10T442/697

Abstract: A wholly aromatic polyamide (aramid) fiber synthetic paper sheet includes 70-96 wt % of an aramid staple fiber component which includes 30 wt % or more of a para-type aramid staple fibers each having two or more annular projections spaced from each other and having an average ratio R/&ggr; of the largest diameter R of the annular projections to the smallest diameter &ggr; of the annular projection-free portions of the staple fiber, of 1.1 or more, and 4-30 wt % of a binder component, namely a resinous binder and/or heat resistant fibrids.

Abstract translation: 全芳族聚酰胺（芳族聚酰胺）纤维合成纸片包括70-96重量％的芳族聚酰胺短纤维组分，其包含30重量％或更多的对位型芳族聚酰胺短纤维，每个具有两个或更多个环形突起彼此间隔开， 具有环形突起的最大直径R与短纤维的无环形突起部的最小直径γ的平均比R /γ为1.1以上，粘合剂成分为4-30重量％，即 树脂粘合剂和/或耐热纤维素。

公开(公告)号：US06368698B1

公开(公告)日：2002-04-09

申请号：US09573977

申请日：2000-05-19

Applicant: Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

IPC: B32B300

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

Abstract translation: 印刷电路板由至少一种包含至少50重量％的丙烯酸纤维的无纺布片材或纤维网层制成，任何平衡物基本上不导电的纤维，填料和粘合剂。 片材或纤维网优选通过泡沫方法制成，并且可以含有60-80％的直链聚丙烯腈纤维和40-20％的原纤化（纸浆）纤维。 纤维网或片材优选通过热压延来压缩，使其具有约0.1-1克/立方厘米的密度; 并且网或片可以具有介于约20-120克/平方米之间的基重。 幅材或片材还可以具有1-40％的基本上不导电的有机或无机粘合剂，或者可以是基本上不含粘合剂的。 使用这些非织造网或片的层制成的印刷电路板是常规的，包括预浸材料，导电电路元件和电子元件，并且与机织玻璃和非织造芳族聚酰胺产品相比具有改进的性能， 包括改进的纤维固结，易于板的构建，以及改善的MD / CD比和稳定性。

公开(公告)号：US06339116B1

公开(公告)日：2002-01-15

申请号：US08770212

申请日：1996-12-19

Applicant: Ali Afzali-Ardakani ,  Jeffrey Donald Gelorme ,  Laura Louise Kosbar

Inventor： Ali Afzali-Ardakani ,  Jeffrey Donald Gelorme ,  Laura Louise Kosbar

IPC: C08G5900

CPC classification number: C08H6/00 ,  H05K1/0313 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/178

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fiberglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

Abstract translation: 描述了生物基交联组合物，制造方法和结构，特别是使用组合物的生物基印刷线路板和制造结构的方法。 生物基材料如木质素，作物油，木材树脂，单宁和多糖及其组合是优选使用热交联剂和引发剂交联的。 制造的材料具有适用于印刷线路板的性能，其通过用生物基材料，交联剂和引发剂的混合物浸渍玻璃纤维或生物基布而制成，其通过常规方法加工以生产印刷线路板。

公开(公告)号：US06319605B1

公开(公告)日：2001-11-20

申请号：US09147630

申请日：1999-02-04

Applicant: Sadamitsu Murayama ,  Michikage Matsui

Inventor： Sadamitsu Murayama ,  Michikage Matsui

IPC: B32B2734

CPC classification number: C08J5/06 ,  D21H13/20 ,  D21H13/24 ,  D21H13/26 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/903 ,  Y10T428/2969 ,  Y10T428/31562 ,  Y10T428/31681 ,  Y10T428/31725 ,  Y10T428/31993

Abstract: A heat resistant fiber sheet composed of staple fibers consisting of a heat resistant organic high molecular polymer and fibrids consisting of a heat resistant organic high molecular polymer as main components, having excellent heat resistance, dimensional stability to heat, interlaminar peeling strength, electric insulation resistance under a high humidity, etc., and also good resin impregnating property in spite of having a high bulk density, and especially suitable for a base substrates for an electric insulating material and a laminate for an electric circuit, is obtained by setting the amount of the staple fibers occupying in the total amount of the sheet as 40 to 97% by weight and the amount of the fibrids as 3 to 60% by weight and partially softening and/or melting the fibrids so as to act as a binder.

Abstract translation: 由耐热有机高分子聚合物和由耐热有机高分子聚合物组成的纤维状物作为主要成分的短纤维组成的耐热纤维片材，耐热性，热稳定性，层间剥离强度，电绝缘电阻 在高湿度等下，并且尽管具有高的堆积密度，并且特别适合于用于电绝缘材料的基底和用于电路的层压板的树脂浸渍性能通过设定量 占片材总量的短纤维为40〜97重量％，纤条体的量为3〜60重量％，部分软化和/或熔融纤条体，以起粘合剂的作用。

公开(公告)号：US06258203B1

公开(公告)日：2001-07-10

申请号：US09399775

申请日：1999-09-21

Applicant: Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

IPC: D04H500

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

公开(公告)号：US06200074B1

公开(公告)日：2001-03-13

申请号：US09287811

申请日：1999-04-07

Applicant: James J. Miller ,  Paul E. Dinneweth ,  Hans Vandervelde ,  James T. Hegeduis

Inventor： James J. Miller ,  Paul E. Dinneweth ,  Hans Vandervelde ,  James T. Hegeduis

IPC: B23B3500

CPC classification number: H05K3/0047 ,  B23B35/005 ,  B23B2250/12 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0152 ,  H05K2203/0214 ,  H05K2203/0786 ,  H05K2203/127 ,  Y10T408/03 ,  Y10T408/561 ,  Y10T408/5623

Abstract: A method and materials for drilling through-holes in printed circuit boards with a drilling tool is disclosed. The method involves the use of a lubricating entry material placed on the top surface of a stack of printed circuit boards and a lubricating backup board placed beneath the bottom surface of the stack of printed circuit boards. The lubricating entry material has a core with skins attached on both sides by a lubricant/adhesive. Similarly, the backup board has a core with skins attached on both sides by a lubricant/adhesive. The skins are hard enough to support the top and bottom surfaces of the printed circuit boards and thereby reduce burring at the entry point and exit point of the through-hole. The lubricant/adhesive coats the drilling tool during the drilling operation to reduce friction and thereby reduce the temperature of the drilling tool.

Abstract translation: 公开了一种用于在具有钻孔工具的印刷电路板中钻通孔的方法和材料。 该方法包括使用放置在印刷电路板堆叠的顶表面上的润滑入口材料和布置在印刷电路板堆叠的底表面下方的润滑支撑板。 润滑进入材料具有芯，其两侧通过润滑剂/粘合剂附着表皮。 类似地，备用板具有通过润滑剂/粘合剂在两侧附着表皮的芯。 表皮很难承受印刷电路板的顶表面和底表面，从而减少通孔入口点和出口处的毛刺。 润滑剂/粘合剂在钻孔操作期间涂覆钻孔工具以减少摩擦，从而降低钻具的温度。

公开(公告)号：US6042936A

公开(公告)日：2000-03-28

申请号：US936045

申请日：1997-09-23

Applicant: Ulrich W. Kempf

Inventor： Ulrich W. Kempf

IPC: B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H21/54 ,  D21H25/06 ,  H05K1/03 ,  B32B5/16 ,  B32B9/00

CPC classification number: D21H21/54 ,  B32B27/04 ,  C08J5/24 ,  H05K1/0366 ,  H05K1/0373 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H25/06 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/27 ,  Y10T428/2933 ,  Y10T428/2962

Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.

Abstract translation: 具有低介电常数且含有基本均匀分布的中空玻璃 - 微球填料的预浸料基板及其制造方法。 用浸渍和层压技术处理预浸料底物以形成具有低介电常数和良好机械和电学性能的层压材料，适合作为用于高性能电路中的表面安装装置的基材。 改进了用于制造高性能电路板和制造表面贴装集成电路的预浸料。 改进用于制造表面贴装集成电路的高性能电路板。

公开(公告)号：US5972811A

公开(公告)日：1999-10-26

申请号：US90789

申请日：1998-06-04

Applicant: Michael E. St. Lawrence ,  Doris I. Hand ,  Vincent R. Landi ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

Inventor： Michael E. St. Lawrence ,  Doris I. Hand ,  Vincent R. Landi ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

IPC: C08J5/08 ,  C08J5/10 ,  C08J5/24 ,  C08K3/00 ,  C08K3/10 ,  C08K3/22 ,  C08K3/24 ,  C08K3/34 ,  C08K3/38 ,  C08K3/40 ,  C08K5/00 ,  C08K5/02 ,  C08K5/06 ,  C08K5/3417 ,  C08K7/00 ,  C08K7/02 ,  C08K7/14 ,  C08K7/16 ,  C08K7/20 ,  C08L9/00 ,  C08L21/00 ,  C08L27/18 ,  C08L47/00 ,  C08L53/00 ,  C08L53/02 ,  C08L77/10 ,  H01B3/30 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B7/00

CPC classification number: C08J5/24 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  C08J2309/00 ,  C08L15/00 ,  C08L23/04 ,  C08L53/00 ,  C08L7/00 ,  C08L9/02 ,  C08L9/06 ,  H05K1/0203 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/2934 ,  Y10T442/2992 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3455

Abstract: An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene and a co-curable second resin distinct from the first resin. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.

Abstract translation: 提供了一种电气基材材料，其包含聚丁二烯或聚异戊二烯的热固性基质和不同于第一树脂的可共固化的第二树脂。 可以任选地加入过氧化物固化引发剂和/或交联剂。 存在非常高的表面积的颗粒填料，优选热解法二氧化硅也是优选的，因为其存在导致预浸料，其具有非常小的粘性，因此可以容易地由操作者处理。 这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。 虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。 本发明的组合物特别适用于制造用于微波和数字电路的电路基板，通常将热固性组合物的形式层压在诸如铜的金属导电箔的一个或两个相对的表面上。

公开(公告)号：US5879794A

公开(公告)日：1999-03-09

申请号：US745396

申请日：1996-11-08

Applicant: Joseph E. Korleski, Jr.

Inventor： Joseph E. Korleski, Jr.

IPC: C09J11/04 ,  B32B5/28 ,  C08L27/18 ,  C09J7/02 ,  C09J7/04 ,  C09J123/06 ,  C09J123/12 ,  C09J127/18 ,  C09J201/00 ,  H05K1/03 ,  B32B5/18 ,  B32B27/04 ,  B32B27/20 ,  B32B27/32

CPC classification number: B32B5/28 ,  C09J7/04 ,  H05K1/0353 ,  H05K1/0366 ,  C08L27/18 ,  C09J2400/263 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/249953 ,  Y10T428/249978 ,  Y10T428/249982 ,  Y10T428/249985 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/24999 ,  Y10T428/249991 ,  Y10T428/249992 ,  Y10T428/249993 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  Y10T428/2878 ,  Y10T428/2883 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31678 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31935 ,  Y10T428/31938 ,  Y10T442/2861 ,  Y10T442/291 ,  Y10T442/2918 ,  Y10T442/2926 ,  Y10T442/2934 ,  Y10T442/2951 ,  Y10T442/2975 ,  Y10T442/2984 ,  Y10T442/2992 ,  Y10T442/56 ,  Y10T442/57 ,  Y10T442/699

Abstract: A method of preparing an adhesive composite is provided where a fluoropolymer having nodes and interconnected fibrils with a void volume formed from the node and interconnected fibril structure is at least partially filled with a paste formed from a thermoset or thermoplastic adhesive and a particulate vapor phase formed inorganic filler having uniform surface curvature, sufficient adhesive and filler are present to provide a composite having between about 5 to about 40 volume percent polymeric substrate, 10-95 volume percent adhesive and filler imbibed within the voids of said substrate and 5 to 85 volume percent inorganic filler is contained within the composite. In the composite, the ratio of mean flow pore size to largest particle size is at least above 0.7; or the ratio of mean flow pore size to average particle size is greater than 1.5; or the ratio of minimum pore size to average particle size is at least above 0.8; or the ratio of minimum pore size to largest particle size is at least above 0.4.

Abstract translation: 提供一种制备粘合剂复合材料的方法，其中具有节点和具有由节点和相互连接的原纤维结构形成的空隙体积的相互连接的原纤维的含氟聚合物至少部分地填充有由热固性或热塑性粘合剂形成的糊料和形成的颗粒气相 存在具有均匀表面曲率的无机填料，足够的粘合剂和填料，以提供具有介于约5至约40体积％的聚合物基质，10-95体积％的粘合剂和填充物的填料在所述底物的空隙内吸收的复合物，以及5-85体积％ 无机填料包含在复合材料中。 在复合材料中，平均流量孔径与最大粒径之比至少高于0.7; 或平均流量孔径与平均粒径之比大于1.5; 或最小孔径与平均粒径之比至少在0.8以上; 或者最小孔径与最大粒径的比率至少高于0.4。