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    Circuit board for mounting electronic components
    102.
    发明授权
    Circuit board for mounting electronic components 失效
    用于安装电子元件的电路板

    公开(公告)号：US4949225A

    公开(公告)日：1990-08-14

    申请号：US237385

    申请日：1988-08-29

    Applicant: Katsumi Sagisaka ,  Sadahisa Furuhashi

    Inventor： Katsumi Sagisaka ,  Sadahisa Furuhashi

    IPC: H01L25/00 ,  H01L23/12 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K3/20 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K5/00

    CPC classification number: H05K3/4092 ,  H01R12/523 ,  H05K3/202 ,  H05K3/4641 ,  H05K5/0091 ,  H01L2224/16 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K3/429 ,  H05K3/4611

    Abstract: In a circuit board wherein a plurality of leads 21 electrically independent of one another protrude from a base member 10, and the respective leads 21 are electrically connected with connection portions 31 of an electronic component 30 mounted on the base member 10; an electronic component mounting circuit board 100 characterized in that internal connection portions 22 are unitarily formed on inner sides of metal members 20 constructing said respective leads 21, that the base members 10 are integrally disposed on both surfaces of said internal connection portions 22, that the electronic components 30 are mounted on said base members 10, and that said electronic components 30 and said internal connection portions 22 are electrically connected. Thus, according to the present invention, it is possible to provide a simply constructed electronic component mounting circuit board which facilitates the design of circuits, which dispenses with the resin molding of the connected portions between the electronic components and the respective leads and affords excellent connection reliability, which can readily form a heat radiating structure, and in which the thermal matching with the electronic components is excellent.

    Abstract translation: 在彼此电独立的多个引线21从基体10突出的电路板中，各引线21与安装在基座部件10上的电子部件30的连接部31电连接。 一种电子部件安装电路板100，其特征在于，内部连接部22一体地形成在构成所述各个引线21的金属部件20的内侧，基部部件10一体地设置在所述内部连接部22的两个表面上， 电子部件30安装在所述基座部件10上，电子部件30和内部连接部22电连接。 因此，根据本发明，可以提供一种简单构造的电子部件安装电路板，其有助于电路的设计，其省去了电子部件和各个引线之间的连接部分的树脂模制，并且提供了良好的连接 可靠性，其可以容易地形成散热结构，并且其中与电子部件的热匹配是优异的。

    Electrical junction box and method for its manufacture
    103.
    发明授权
    Electrical junction box and method for its manufacture 失效
    电接线盒及其制造方法

    公开(公告)号：US4944684A

    公开(公告)日：1990-07-31

    申请号：US212966

    申请日：1988-06-28

    Applicant: Joseph D. Leibowitz

    Inventor： Joseph D. Leibowitz

    IPC: H01R9/24 ,  H01R31/02 ,  H05K1/00 ,  H05K1/02 ,  H05K3/30 ,  H05K3/46 ,  H05K7/02

    CPC classification number: H05K3/4611 ,  H01R31/02 ,  H05K1/0263 ,  H05K7/026 ,  H01R9/2466 ,  H05K1/0298 ,  H05K2201/0352 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K3/308

    Abstract: An improved electrical junction box includes a housing, a multilayer printed circuit board supported by the interior of the housing and an array of electrical connectors supported by the exterior of the housing. The electrical connectors make electrical contact with one or more circuit traces in the multilayer circuit board. The circuit traces are of varying thicknesses according to the current levels to be conducted by the traces, thus minimizing the amount of copper required to fabricate the junction box. The circuit traces with the greater thicknesses are positioned in the outer layers of the circuit board to enhance heat dissipation from the circuit board.

    Abstract translation: 改进的电接线盒包括壳体，由壳体的内部支撑的多层印刷电路板和由壳体的外部支撑的电连接器阵列。 电连接器与多层电路板中的一个或多个电路迹线电接触。 电路迹线根据由走线进行的电流水平而具有不同的厚度，从而最小化制造接线盒所需的铜的量。 具有较大厚度的电路迹线位于电路板的外层中，以增强电路板的散热。

    Interconnection apparatus for wiring harnesses
    105.
    发明授权
    Interconnection apparatus for wiring harnesses 失效
    线束互连装置

    公开(公告)号：US4685753A

    公开(公告)日：1987-08-11

    申请号：US843850

    申请日：1986-03-26

    Applicant: Isao Isshiki ,  Hitoshi Hayashi

    Inventor： Isao Isshiki ,  Hitoshi Hayashi

    IPC: H02G3/16 ,  H01R13/66 ,  H01R13/73 ,  H05K1/02 ,  H05K3/40 ,  H05K7/02 ,  H05K7/14 ,  H01R9/09

    CPC classification number: H01R23/68 ,  H05K1/0263 ,  H05K7/02 ,  H01R12/7088 ,  H01R13/66 ,  H05K2201/0352 ,  H05K2201/10272 ,  H05K3/4084

    Abstract: An apparatus for interconnecting functional component circuits and branch circuits of a wiring harness. A wiring board includes a plurality of tab contact members and mounted on one surface of the wiring board is a first printed-circuit board including a plurality of control element components forming functional component circuits. Also mounted on the other surface of the wiring board is a second printed-circuit board which includes the functional element components of the components forming the functional component circuits.

    Abstract translation: 一种用于互连线束的功能元件电路和分支电路的装置。 布线基板包括多个突片接触部件，并且安装在布线板的一个表面上，是包括形成功能元件电路的多个控制元件部件的第一印刷电路板。 还安装在布线板的另一个表面上的是第二印刷电路板，其包括形成功能元件电路的部件的功能元件部件。

    Manufacture of printed circuit boards
    106.
    发明授权
    Manufacture of printed circuit boards 失效
    印刷电路板的制造

    公开(公告)号：US4610758A

    公开(公告)日：1986-09-09

    申请号：US615261

    申请日：1984-05-30

    Applicant: Geoffrey C. Wilson

    Inventor： Geoffrey C. Wilson

    IPC: H05K3/00 ,  H05K3/06 ,  H05K3/24 ,  H05K3/34 ,  H05K3/42 ,  B05D5/12 ,  C23F1/02

    CPC classification number: H05K3/3452 ,  H05K3/243 ,  H05K3/427 ,  H05K2201/0352 ,  H05K2201/2081 ,  H05K2203/0574 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/242 ,  H05K3/244 ,  Y10S428/901 ,  Y10T29/49165

    Abstract: A method of manufacture of a printed circuit board having plated-through holes interconnecting printed conductors formed on each of two external surfaces, includes the step of masking those areas of the external surfaces where solder will subsequently be required to adhere. The unmasked conductive areas are then coated with a material which prevents wetting by normal soldering techniques. The masking material is subsequently removed. The coating material may be electroless nickel, or electroplated nickel or suitable nickel alloys.

    Abstract translation: 制造具有互连形成在两个外表面中的每一个上的印刷导体的具有电镀通孔的印刷电路板的方法包括掩蔽随后需要焊料粘附的外部表面的那些区域的步骤。 然后将未掩蔽的导电区域涂覆防止通过正常焊接技术润湿的材料。 随后除去掩蔽材料。 涂层材料可以是无电镍，或电镀镍或合适的镍合金。

    Multilayer wiring substrate and module including same
    110.
    发明授权
    Multilayer wiring substrate and module including same 有权
    多层布线基板和包括其的模块

    公开(公告)号：US09538644B2

    公开(公告)日：2017-01-03

    申请号：US14246266

    申请日：2014-04-07

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Hiromichi Kitajima

    IPC: H05K1/02 ,  H05K3/46 ,  H05K3/34

    CPC classification number: H05K1/0298 ,  H01L2224/16225 ,  H01L2924/15174 ,  H05K3/341 ,  H05K3/4629 ,  H05K2201/0352 ,  H05K2201/09045 ,  H05K2201/09672

    Abstract: A multilayer wiring substrate includes a multilayer body in which a plurality of insulating layers is stacked and to which an electronic component is mounted, a plurality of connection terminals disposed on one principal surface of the multilayer body for connection to the electronic component, and a plurality of rear electrodes disposed on the other principal surface of the multilayer body, wherein the connection terminals are each arranged in overlapped relation to one of the rear electrodes when looked at in a plan view of the multilayer wiring substrate.

    Abstract translation: 多层布线基板包括堆叠多个绝缘层并且安装电子部件的多层体，设置在多层体的一个主面上的多个连接端子，用于与电子部件连接，多个连接端子 设置在所述多层体的另一主面上的后电极，其中，当在所述多层布线基板的俯视图中观察时，所述连接端子与所述后电极中的一个重叠地布置。

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