公开(公告)号：US20150369467A1

公开(公告)日：2015-12-24

申请号：US14767349

申请日：2014-07-22

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Hirohisa SAITO ,  Kensaku MOTOKI

IPC: F21V29/70 ,  H05K1/18 ,  H05K1/11 ,  F21V7/05 ,  H05K3/00 ,  H05K3/46 ,  F21V21/00 ,  F21V19/00 ,  H05K1/02 ,  H05K3/30

CPC classification number: F21V29/70 ,  F21V7/05 ,  F21V19/0025 ,  F21V21/00 ,  H01L2224/16225 ,  H01L2924/15159 ,  H05K1/0206 ,  H05K1/028 ,  H05K1/115 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/4688 ,  H05K2201/062 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/10106

Abstract: A heat dissipation circuit board comprises a printed circuit board including an insulating film disposed at a back surface and one or more land parts disposed at a front surface, one or more electronic components mounted on the one or more land parts, and an adhesive layer stacked on a back surface of the insulating film. The insulating film and the adhesive layer are removed in a first region that covers at least projection regions of the one or more land parts for each of the electronic components, and removed portions of the insulating film and the adhesive layer are filled with a thermally conductive adhesive.

Abstract translation: 散热电路板包括印刷电路板，其包括布置在后表面的绝缘膜和设置在前表面的一个或多个接地部分，安装在所述一个或多个接地部分上的一个或多个电子部件和层叠的粘合剂层 在绝缘膜的背面上。 绝缘膜和粘合剂层在覆盖每个电子部件的至少一个或多个焊盘部的突出区域的第一区域中移除，并且绝缘膜和粘合剂层的去除部分填充有导热 胶粘剂。

公开(公告)号：US09195281B2

公开(公告)日：2015-11-24

申请号：US14341678

申请日：2014-07-25

Applicant: Ultravision Holdings, LLC

Inventor： William Y. Hall

IPC: H04N7/00 ,  G06F1/18 ,  G06F3/14 ,  G06F3/147 ,  G06F1/16 ,  G09F9/302 ,  G09F13/22 ,  G09G3/32

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1446 ,  G06F3/147 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/14 ,  G09G2300/026 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02P70/611

Abstract: Embodiments of the present invention relate to integrated modular display systems. In one embodiment, a modular multi-panel display system includes a mechanical support structure, and a plurality of LED display panels detachably mounted to the mechanical support structure so as to form an integrated display panel. Each LED panel includes an LED array and an LED driver coupled to the LED array. Each panel further includes a power supply unit disposed outside the housing and electrically coupled to the receiver circuit. The mechanical structure is configured to provide mechanical support to the plurality of LED display panels without providing hermetic sealing. Each of the plurality of LED display panels is hermetically sealed.

Abstract translation: 本发明的实施例涉及集成模块化显示系统。 在一个实施例中，模块化多面板显示系统包括机械支撑结构和可拆卸地安装到机械支撑结构上的多个LED显示面板，以形成集成的显示面板。 每个LED面板包括LED阵列和耦合到LED阵列的LED驱动器。 每个面板还包括设置在壳体外部并电耦合到接收器电路的电源单元。 机械结构被配置为在不提供气密密封的情况下向多个LED显示面板提供机械支撑。 多个LED显示面板中的每一个被气密地密封。

公开(公告)号：US20150312457A1

公开(公告)日：2015-10-29

申请号：US14793111

申请日：2015-07-07

Applicant: OLYMPUS CORPORATION

Inventor： Kazuaki KOJIMA

IPC: H04N5/225 ,  H05K1/18 ,  A61B1/05 ,  H05K5/04 ,  H04N5/369 ,  H05K3/34 ,  H05K1/02

CPC classification number: H04N5/2257 ,  A61B1/0011 ,  A61B1/00124 ,  A61B1/051 ,  G02B23/2484 ,  H04N5/2253 ,  H04N5/369 ,  H05K1/021 ,  H05K1/181 ,  H05K1/189 ,  H05K3/3431 ,  H05K5/04 ,  H05K2201/055 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/1305 ,  H05K2203/302

Abstract: A manufacturing method of an image pickup apparatus includes a step of manufacturing an image pickup device chip, a step of manufacturing a wiring board having first terminals and second terminals disposed on both sides of a first primary surface with a central flexible portion intervened in between, a step of joining a heat conductive block to a second primary surface of the wiring board, a step of joining the image pickup device chip to the first terminals of the wiring board, a step of performing solder joining of core wires of a cable to the second terminals of the wiring board by conducting heat generated by a heat tool through the heat conductive block, a step of bending the wiring board, and a step of performing housing inside a frame member, and sealing with sealing resin.

Abstract translation: 图像拾取装置的制造方法包括制造图像拾取器件芯片的步骤，制造具有第一端子的布线板和布置在第一主表面的两侧上的第二端子的步骤，中间柔性部分介于其间， 将导热块接合到布线基板的第二主面的步骤，将图像拾取器件芯片连接到布线板的第一端子的步骤，将电缆的芯线焊接到 通过导热块导热由热工具产生的热量的布线板的第二端子，弯曲布线板的步骤，以及在框架构件内进行壳体的步骤，并用密封树脂密封。

公开(公告)号：US09165857B2

公开(公告)日：2015-10-20

申请号：US13672413

申请日：2012-11-08

Applicant: Intel Corporation

Inventor： David W. Song ,  Je-Yong Chang

IPC: H01L23/34 ,  H05K7/20 ,  H01L23/473 ,  H05K3/30 ,  H01L23/427 ,  H05K1/02

CPC classification number: H05K7/20272 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H05K1/0209 ,  H05K7/20218 ,  H05K7/2039 ,  H05K2201/066 ,  Y10T29/4913

Abstract: A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device.

Abstract translation: 一种散热盖，其包括具有第一表面，相对的第二表面和从所述板第二表面延伸的至少一个侧壁的板。 散热盖还包括至少一个流体输送管道和至少一个流体移除管道，每个至少一个流体移除管道在板的第一和第二表面之间延伸，以及至少一个从板的第二表面延伸的间隔突起，以建立和保持 板的第二表面和微电子器件，当散热盖定位成从微电子器件移除热量时。

公开(公告)号：US20150282383A1

公开(公告)日：2015-10-01

申请号：US14291996

申请日：2014-05-30

Applicant: DEERE & COMPANY

Inventor： BRIJ N. SINGH ,  JOHN N. OENICK

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/2089 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/0306 ,  H05K1/141 ,  H05K7/20436 ,  H05K7/205 ,  H05K7/20927 ,  H05K2201/066

Abstract: An electronic assembly for an inverter comprises a substrate having a dielectric layer and metallic circuit traces. A plurality of terminals are arranged for connection to a direct current source. A first semiconductor and a second semiconductor are coupled together between the terminals of the direct current source. A primary metallic island (e.g., strip) is located in a primary zone between the first semiconductor and the second semiconductor. The primary metallic island has a greater height or thickness than the metallic circuit traces. The primary metallic island provides a heat sink to radiate heat.

公开(公告)号：US09148946B1

公开(公告)日：2015-09-29

申请号：US14291872

申请日：2014-05-30

Applicant: DEERE & COMPANY

Inventor： Brij N Singh ,  John N Oenick ,  Aron Fisk

IPC: H01L23/10 ,  H01L23/34 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K7/2089 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/0306 ,  H05K1/141 ,  H05K7/20436 ,  H05K7/205 ,  H05K7/20927 ,  H05K2201/066

Abstract: An electronic assembly for an inverter comprises a substrate having a dielectric layer and metallic circuit traces. A plurality of terminals are arranged for connection to a direct current source. A first semiconductor and a second semiconductor are coupled together between the terminals of the direct current source. A primary metallic island (e.g., strip) is located in a primary zone between the first semiconductor and the second semiconductor. The primary metallic island has a greater height or thickness than the metallic circuit traces. The primary metallic island provides a heat sink to radiate heat.

Abstract translation: 用于逆变器的电子组件包括具有电介质层和金属电路迹线的衬底。 布置多个端子用于连接到直流电源。 第一半导体和第二半导体在直流源的端子之间耦合在一起。 主金属岛（例如，条）位于第一半导体和第二半导体之间的主区域中。 主金属岛具有比金属电路迹线更大的高度或厚度。 主金属岛提供散热器散热。

公开(公告)号：US20150271912A1

公开(公告)日：2015-09-24

申请号：US14223668

申请日：2014-03-24

Applicant: Yokoyama Tetsuo ,  Sanamoto Masashi

Inventor： Yokoyama Tetsuo ,  Sanamoto Masashi

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K1/18

CPC classification number: H05K7/20 ,  H05K1/0203 ,  H05K1/0225 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/10166

Abstract: A noise suppression circuit board design to provide a power supply to an inductive heating element is disclosed. The noise suppression circuit provides a configuration for a multi-layer circuit board that has radiation noise emissions below the CISPR 11 (limits and methods of measurements of radio disturbance characteristics of industrial, scientific and medical (ISM) radio-frequency equipment) thresholds in the 30 MHz to 1 GHz frequency range.

Abstract translation: 公开了一种用于向感应加热元件提供电源的噪声抑制电路板设计。 噪声抑制电路为具有低于CISPR 11的辐射噪声发射（工业，科学和医疗（ISM）射频设备的无线电干扰特性的限制和测量方法）阈值的多层电路板提供了一个配置。 30 MHz至1 GHz频率范围。

公开(公告)号：US20150260390A1

公开(公告)日：2015-09-17

申请号：US14210442

申请日：2014-03-14

Applicant: Eric Colin Bretschneider

Inventor： Eric Colin Bretschneider

IPC: F21V29/76 ,  F21V19/00 ,  F21V23/00

CPC classification number: F21V19/0055 ,  F21V29/763 ,  F21Y2115/10 ,  H05K1/0209 ,  H05K2201/066 ,  H05K2201/10106

Abstract: A composite heat sink with improved mechanical strength and thermal conductivity can be made using a printed circuit board with machined recesses on the back side. The printed circuit board is mated to a heat sink with surface features that match the machined side of the printed circuit board. A thin layer of thermally conductive material such as a gap filler pad, thermal grease, thermal gel, thermal epoxy or the like may be added between the printed circuit board and the heat sink prior to joining them together. Mechanical attachments such as screws, rivets and snap features may be used to form the printed circuit board and the heat sink into a single composite structure.The machined recesses in the printed circuit board are machined from the areas under and near surface mount components that generate a significant amount of heat. This reduces the thickness of printed circuit board material under the surface mount components and significantly improves thermal conduction.

Abstract translation: 具有改进的机械强度和导热性的复合散热器可以使用背面具有加工凹槽的印刷电路板来制造。 印刷电路板与散热器配合，其表面特征与印刷电路板的加工侧相匹配。 在将它们连接在一起之前，可以在印刷电路板和散热片之间添加薄层的导热材料，例如间隙填充垫，导热油脂，热凝胶，热环氧树脂等。 可以使用诸如螺钉，铆钉和卡扣特征的机械附件来将印刷电路板和散热器形成为单个复合结构。 印刷电路板中的加工凹槽是从表面安装部件下方和附近的区域加工的，这些部件产生大量的热量。 这降低了印刷电路板材料在表面贴装部件下的厚度，并显着改善了热传导。

公开(公告)号：US20150235915A1

公开(公告)日：2015-08-20

申请号：US14304331

申请日：2014-06-13

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yu-Min Liang ,  Mirng-Ji Lii ,  Jiun Yi Wu

IPC: H01L23/14 ,  H01L23/00 ,  H05K1/03 ,  H01L21/48 ,  H05K1/18 ,  H01L25/065 ,  H01L23/538

CPC classification number: H01L23/145 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/17 ,  H01L24/19 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/83005 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1533 ,  H01L2924/15331 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/18162 ,  H05K1/0203 ,  H05K1/182 ,  H05K3/007 ,  H05K3/4697 ,  H05K2201/066 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/014

Abstract: An embodiment device package includes a package substrate and a first and a second die bonded to the package substrate. The package substrate includes a build-up portion comprising a first contact pad and a plurality of bump pads. The package substrate further includes an organic core attached to the build-up portion, a through-via electrically connected to the first contact pad and extending through the organic core, a second contact pad on the through-via, a connector on the second contact pad, and a cavity extending through the organic core. The cavity exposes the plurality of bump pads, and the first die is disposed on the cavity and is bonded to the plurality of bump pads.

Abstract translation: 实施例器件封装包括封装衬底和结合到封装衬底的第一和第二裸片。 封装衬底包括积累部分，其包括第一接触焊盘和多个凸块焊盘。 封装衬底还包括附着到积聚部分的有机芯，通孔，电连接到第一接触焊盘并延伸穿过有机芯，通孔上的第二接触焊盘，第二接触件上的连接器 垫和延伸穿过有机芯的空腔。 所述腔暴露所述多个凸块焊盘，并且所述第一裸片设置在所述腔上并且结合到所述多个凸块焊盘。

公开(公告)号：US20150235609A1

公开(公告)日：2015-08-20

申请号：US14664526

申请日：2015-03-20

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: G09G5/00 ,  G06T1/60 ,  G09G3/32 ,  G06F3/14

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1423 ,  G06F3/1446 ,  G06F3/147 ,  G06T1/60 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/003 ,  G09G5/14 ,  G09G2300/026 ,  G09G2300/04 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K999/99 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/1028 ,  Y02P70/611

Abstract: In one embodiment, a modular multi-panel display system includes a mechanical support structure, and an array of LED display panels arranged in rows and columns and mounted to the mechanical support structure so as to form an integrated display. None of the LED display panels have a receiver card within the panel. A receiver box is mounted to the mechanical support. The receiver box is housed in a housing that is separate from housings of each of the LED display panels. The receiver box includes a receiver card coupled to feed data to be displayed on the integrated display to a plurality of the LED display panels. A control box is outside of the mechanical support and electrically connected to the receiver box through a data connection. A plurality of electrical connections electrically connects the receiver box with a first display panel in each row of display panels.

Abstract translation: 在一个实施例中，模块化多面板显示系统包括机械支撑结构以及排列成行和列并安装到机械支撑结构上以形成集成显示器的LED显示面板阵列。 LED显示屏中没有一个在面板内有接收卡。 接收盒安装在机械支架上。 接收盒被容纳在与每个LED显示面板的壳体分开的壳体中。 接收器盒包括接收器卡，该接收器卡耦合到将要在集成显示器上显示的数据馈送到多个LED显示面板。 控制箱位于机械支架之外，并通过数据连接与接收箱电连接。 多个电连接将接收器盒与每排显示面板中的第一显示面板电连接。