公开(公告)号：US5262594A

公开(公告)日：1993-11-16

申请号：US596479

申请日：1990-10-12

Applicant: Eric R. Edwin ,  James J. Tumlinson ,  Jerome A. Wilson ,  Thad C. McMillan, Jr. ,  Rollin G. Meyer ,  Darryl J. McKenney

Inventor： Eric R. Edwin ,  James J. Tumlinson ,  Jerome A. Wilson ,  Thad C. McMillan, Jr. ,  Rollin G. Meyer ,  Darryl J. McKenney

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H05K1/00

CPC classification number: H05K3/4691 ,  H05K3/3452 ,  H05K1/0366 ,  H05K2201/0909 ,  H05K2203/0557 ,  H05K2203/308 ,  H05K3/341 ,  Y10S428/901 ,  Y10T29/49155

Abstract: A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.

Abstract translation: 公开了一种具有刚性部分和从刚性部分延伸的柔性部分的刚性柔性印刷电路板。 刚性柔性印刷电路板能够通过提供用于保护柔性部分免受高温的间隔件和盖子，耐受在大量生产环境中经历的高温，利用红外回流炉。 还公开了一种使用红外回流炉在大容量生产环境中在刚性柔性印刷电路板上组装部件和装置的方法。

公开(公告)号：US5142448A

公开(公告)日：1992-08-25

申请号：US650481

申请日：1991-02-05

Applicant: Horst Kober ,  Uwe Horch

Inventor： Horst Kober ,  Uwe Horch

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/0909 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing rigid-flexible multilayer printed circuit boards and the products thereof. The method comprises the compression molding several layers of materials comprised of a rigid layer, a flexible insulating layer, adhesives, and conductive metal to form a laminate. Flexibility is provided in the printed circuit board by slots in the rigid layer which define the flexible region, the application of flexible insulating material over the defined flexible region, and the removal of the rigid material which occupied the defined flexible region (plug). As disclosed by the present method, a flexible insulating layer is provided in the flexible regions only without the use of preliminary laminates. This method does not require the use of pressure equalizing cushions and does not result in relief formation on an upper layer of conductive metal during compression molding. After forming the composite laminate, it may be shaped as desired, and plated through holes may be provided in the rigid layer by known techniques.

Abstract translation: 一种硬质柔性多层印刷电路板的制造方法及其制造方法。 该方法包括压缩成型由刚性层，柔性绝缘层，粘合剂和导电金属组成的几层材料，以形成层压体。 在印刷电路板中通过限定柔性区域的刚性层中的槽，在限定的柔性区域上施加柔性绝缘材料以及去除占据限定的柔性区域（插塞）的刚性材料来提供柔性。 如本方法所公开的，柔性绝缘层仅在不使用预备层压体的情况下设置在柔性区域中。 该方法不需要使用均压垫，并且在压缩成型期间不会在导电金属的上层形成浮雕形成。 在形成复合层压材料之后，可以根据需要成型，并且可以通过已知技术在刚性层中提供通孔的电镀。

公开(公告)号：US5133118A

公开(公告)日：1992-07-28

申请号：US740931

申请日：1991-08-06

Applicant: Scott A. Lindblad ,  Gary E. Meinke

Inventor： Scott A. Lindblad ,  Gary E. Meinke

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34 ,  H05K13/00

CPC classification number: H05K3/0097 ,  H05K13/0015 ,  H05K3/341 ,  H05K1/0268 ,  H05K1/0269 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0165 ,  H05K2203/1545 ,  H05K2203/162 ,  H05K3/0052 ,  H05K3/303 ,  H05K3/3484 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49121 ,  Y10T29/49144 ,  Y10T29/5136 ,  Y10T29/5137

Abstract: A process for preparation of electronic packages including printed circuits wherein the circuit portions of the package are formed from a web including a plurality of circuits maintained in an array during processing. Holding tabs are provided to maintain the integrity of the array, with the holding tabs being in the form of releasable retention tabs for temporarily holding the array together and accommodating multiple-up processing of the electronic package. For certain portions of the process, the web is separated into multiple-up circuit packages wherein the circuits are disposed within the central portion of the panel, and with the lateral edges and ends collectively defining an annular circuit-free zone. Multiple fiducial points are located within or around the circuit patterns, thereby eliminating or reducing the requirement for circuit-specific tooling and permitting multiple-up handling of the circuits in each array.

Abstract translation: 一种用于制备包括印刷电路的电子封装的方法，其中封装的电路部分由包括在处理期间保持在阵列中的多个电路的幅材形成。 提供保持突片以保持阵列的完整性，其中保持突片为可释放的固定突片的形式，用于将阵列暂时保持在一起并且容纳电子封装的多重处理。 对于该过程的某些部分，幅材被分离成多重电路封装，其中电路设置在面板的中心部分内，并且侧边缘和端部共同限定环形电路区域。 多个基准点位于电路图案内或周围，从而消除或减少对电路特定工具的需求，并允许对每个阵列中的电路进行多重处理。

公开(公告)号：US5112230A

公开(公告)日：1992-05-12

申请号：US728460

申请日：1991-07-11

Applicant: Michael J. DeSimone

Inventor： Michael J. DeSimone

IPC: H05K1/00

CPC classification number: H05K1/0293 ,  H05K1/029 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/0195 ,  H05K2203/175 ,  Y10T29/49156

Abstract: A reconfigurable substrate is provided for supporting electrical elements. A conductive strip is disposed on the substrate for linking at least two electrical elements. The substrate has a portion has a portion proximate to the strip for permitting subsequent removal thereof, thereby severing the conductive strip. Thus, a connection of electrical elements may be selectively varied as a function of specification of options which become operative by subsequent removal of a portion of the substrate proximate to the conductive strip.

Abstract translation: 提供了用于支撑电气元件的可重新配置的基板。 导电带设置在基板上用于连接至少两个电气元件。 衬底具有一部分靠近条带的部分，以允许随后的去除，从而切断导电条。 因此，电气元件的连接可以根据选项的规格的选择而有选择地变化，这些选项通过随后移除靠近导电带的基板的一部分而变得有效。

公开(公告)号：US5069195A

公开(公告)日：1991-12-03

申请号：US365458

申请日：1989-06-13

Applicant: Gian P. Barozzi

Inventor： Gian P. Barozzi

IPC: B26F3/00 ,  B28B11/14 ,  B28D5/00 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K3/0052 ,  B28D5/0023 ,  B28D5/0052 ,  H05K1/0306 ,  H05K2201/0909 ,  H05K2203/302 ,  Y10T225/325 ,  Y10T225/329 ,  Y10T225/371

Abstract: An apparatus for the automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits includes a support plate provided with grooves on its lower face defining bending lines juxtaposed with the fracture lines of the platelet urged against an upper face of plate by upper pressing members being in contact with each of single elements of the platelet defined by the fracture lines and lower retractable members controlled in a predetermined sequence for successive bending of the plate and the platelet subdivided in a plurality of single elements.

公开(公告)号：US5032737A

公开(公告)日：1991-07-16

申请号：US557887

申请日：1990-07-24

Applicant: David R. Holm ,  Rudolph A. Peterson, Jr.

Inventor： David R. Holm ,  Rudolph A. Peterson, Jr.

IPC: B60R16/02 ,  B60R16/023 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36 ,  H05K5/00

CPC classification number: B60R16/0239 ,  H05K1/148 ,  H05K5/0017 ,  H05K2201/0909 ,  H05K2201/10287 ,  H05K3/0052 ,  H05K3/363 ,  Y10T29/49144 ,  Y10T29/49162

Abstract: The ignition switch for a vehicle such as a lawn and garden tractor is connected directly to a printed circuit board which also includes interlock systems components. The circuit board with the switch and other components is wave soldered in an automated process to make good electrical connections for reduced voltage drops, thereby reducing the number of relays required. Wiring harnesses are also soldered directly to the board during the soldering step. In the preferred embodiment, the ignition switch is fixed to the board and supports the board from the console of the vehicle. However, if the switch or another component on the circuit board needs to be remotely located with respect to the remainder of the board, the switch or component is mounted on a break-away section of the board, and the wires connecting the board sections are soldered with the remainder of the components during the automated process. After the board is manufactured as one assembly, the section is snapped apart from the remainder of the board, and the board and break-away section are mounted at the desired locations on the vehicle.

Abstract translation: 用于诸如草坪和园林拖拉机的车辆的点火开关直接连接到还包括互锁系统部件的印刷电路板。 具有开关和其他部件的电路板以自动化过程进行波焊，以实现良好的电气连接，降低电压降，从而减少所需的继电器数量。 在焊接步骤中，线束也直接焊接到电路板上。 在优选实施例中，点火开关固定到板上并从车辆的控制台支撑板。 然而，如果电路板上的开关或其他部件需要相对于板的其余部分远程定位，则开关或部件安装在板的断开部分上，连接板部分的电线是 在自动化过程中与其余部件焊接。 在板被制造为一个组件之后，该部分与板的其余部分相隔开，并且板和分离部分安装在车辆上所需的位置。

公开(公告)号：US4985808A

公开(公告)日：1991-01-15

申请号：US266140

申请日：1988-11-02

Applicant: Jeffrey P. Zernov

Inventor： Jeffrey P. Zernov

IPC: H01C17/23 ,  H05K1/00 ,  H05K1/16

CPC classification number: H01C17/23 ,  H05K1/0293 ,  H05K1/029 ,  H05K1/167 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/171 ,  H05K2203/175

Abstract: A printed circuit or printed wire board has a resistor network thereon, wired through conductors that are arranged so that individual circuit paths for different resistor combinations pass onto one of a plurality of peripheral tabs on the printed circuit board. The tabs are joined to the main portion of the circuit board through a frangible connection which permits breaking off the tabs. The main circuit into which the board is to be connected is tested to determine the needed circuit characteristics, and all but one of the tabs on the board are removed to provide the required circuit connections for matching the printed wire board circuit to the main circuit. The breakaway tabs permit selecting a particular circuit impedance so that the board is matched to the main circuit in which it is connected. The board is primarily used for compensation of a communications network where the loop loss of a telephone system is set to the right value.

Abstract translation: 印刷电路板或印刷线路板上具有电阻网络，布线通过导体布置成使得用于不同电阻器组合的各个电路路径通过印刷电路板上的多个外围接片中的一个。 突片通过允许断开突片的易碎连接而连接到电路板的主要部分。 测试电路板连接的主电路以确定所需的电路特性，除去电路板上的所有突出部分之外的所有电路，以提供所需的电路连接，以将印刷线路板电路与主电路匹配。 分离片允许选择特定的电路阻抗，使得电路板与其连接的主电路匹配。 电路板主要用于对电话系统的环路损耗设置为正确值的通信网络的补偿。

公开(公告)号：US4930215A

公开(公告)日：1990-06-05

申请号：US401087

申请日：1989-08-24

Applicant: Pascal Roche ,  Yin H. Muoy

Inventor： Pascal Roche ,  Yin H. Muoy

IPC: H01P3/08 ,  H01P11/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01P3/085 ,  H01P11/00 ,  H05K1/117 ,  H05K1/0237 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/0919 ,  Y10T29/49126

Abstract: A symmetrical strip line type microwave circuit, the input-output connection zones of which are made in the following way:a groove is made in that of the insulating substrates which does not bear the central conductor of the symmetrical strip line circuit, along the contour of the desired connection zone;the two substrates are bonded together;the exterior of the structure is protected by electrolytic deposition of a tin-lead alloy;a counter-groove is made in the first substrate along the contour of the connection zone, and that portion of the substrate located inside the zone is eliminated.

Abstract translation: 一种对称的带状线型微波电路，其输入输出连接区域以如下方式制成：沿绝缘基板的不对称带状线电路的中心导体沿着轮廓形成凹槽 的所需连接区域; 两个基板结合在一起; 通过锡铅合金的电解沉积来保护结构的外观; 沿着连接区域的轮廓在第一基板中形成相对凹槽，并且消除位于区域内部的基板的该部分。

公开(公告)号：US4700880A

公开(公告)日：1987-10-20

申请号：US868832

申请日：1986-05-29

Applicant: Steven L. Glover

Inventor： Steven L. Glover

IPC: H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  B23K31/02

CPC classification number: H05K1/148 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K3/0052 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/363 ,  Y10T29/49149

Abstract: A manufacturing process is taught for building electrical equipment having two circuit boards therein which are electrically interconnected by a ribbon conductor. The process includes forming the shape of both boards on a single blank of circuit board material with the two boards juxtaposed in such a position that after the mask of the perimeter of the boards have been cut from the blank of material they still remain joined in one region. All of the elements are then disposed on the joined circuit boards including the ribbon conductor. After all the component parts, including the ribbon conductor have been disposed in place, they are soldered to the joined boards by a single wave soldering operation. After this the board are broken apart and otherwise configured for disposal in spaced apart relationship in the apparatus which they serve.

Abstract translation: 教授制造工艺，用于建造其中具有由带状导体电互连的两个电路板的电气设备。 该方法包括在电路板材料的单个坯料上形成两个板的形状，其中两个板并置在这样的位置，即在板的周边的掩模已经从材料的坯料切割出来之后，它们仍保持连接在一个 地区。 然后将所有元件设置在包括带状导体的接合电路板上。 包括带状导体在内的所有部件已经被放置就位后，通过单波峰焊接操作将其焊接到接合的板上。 在此之后，电路板被分开并且以其他方式配置为在它们所服务的装置中处于间隔开的关系中。

公开(公告)号：US4547795A

公开(公告)日：1985-10-15

申请号：US478591

申请日：1983-03-24

Applicant: Richard W. Wulff

Inventor： Richard W. Wulff

IPC: H01L23/498 ,  H01L23/58 ,  H01L23/60 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01L23/14 ,  H01L23/12 ,  H01L23/48

CPC classification number: H01L22/32 ,  H01L23/49805 ,  H01L23/60 ,  H05K3/403 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/092 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10727 ,  H05K2203/175 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061

Abstract: An integrated circuit semiconductor chip or the like is packaged on a leadless chip carrier. The chip carrier comprises a substrate with an integral coplanar extension frangibly connected to one or more sides. Each such extension has a metallized conductive area forming a shorting bar, interconnecting at least some of the metallized conductive traces formed on the substrate. The extensions with the shorting bars remain attached to the substrate while the chip is being installed to prevent damage to the chip from electrostatic discharges. After chip installation is completed, the extensions are separated from the substrate, thereby removing the interconnections between the traces. In a preferred embodiment, a scoring line along the peripheral edge of the substrate provides the frangible connection to the extension, and the extension is provided with holes along the scoring line to allow side metallization of the substrate.

Abstract translation: 集成电路半导体芯片等封装在无引线芯片载体上。 芯片载体包括具有易于连接到一个或多个侧面的整体共面延伸的基底。 每个这样的延伸部具有形成短路棒的金属化导电区域，互连至少部分形成在基板上的金属化导电迹线。 当安装芯片时，具有短路棒的延伸部分保持附着于基板，以防止芯片因静电放电而损坏。 芯片安装完成后，延伸部分与基板分离，从而消除了迹线之间的互连。 在优选实施例中，沿着衬底的周缘的刻痕线提供与延伸部的易碎连接，并且延伸部沿着刻痕线设置有孔，以允许衬底的侧面金属化。