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    Transmission line with stripped semi-rigid cable
    101.
    发明申请
    Transmission line with stripped semi-rigid cable 失效
    传输线与剥离的半刚性电缆

    公开(公告)号：US20060022775A1

    公开(公告)日：2006-02-02

    申请号：US10903535

    申请日：2004-07-30

    Applicant: John Greeley

    Inventor： John Greeley

    IPC: H01P3/08

    CPC classification number: H05K1/0243 ,  H01P3/06 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/09809 ,  H05K2201/09981 ,  H05K2201/10356

    Abstract: A high frequency coax transmission line structure is configured with a stripped semi-rigid cable (no shield). The stripped cable is inserted lengthwise into a metallized grounded slot formed in a printed wiring board. The dielectric barrel of the stripped cable contacts each of the elongated side and bottom walls of the slot. An exposed portion of center conductor at each end of the cable lays tangent on a corresponding one of connection points (at each end of the slot). The structure reduces loss for long transmission line lengths, and fixes the mounting depth and routing for a consistent transition. Inductive compensation can be provided at the connections point at each end of the slot to mitigate transition discontinuity.

    Abstract translation: 高频同轴传输线结构配置有剥离的半刚性电缆（无屏蔽）。 剥离的电缆被纵向插入形成在印刷电路板中的金属化接地槽中。 剥离的电缆的电介质筒接触槽的细长侧壁和底壁中的每一个。 电缆每端处的中心导体的暴露部分在相应的一个连接点（在插槽的每一端）处切线。 该结构减少了长传输线路长度的损耗，并且固定了安装深度和路由以实现一致的转换。 可以在插槽每端的连接点处提供感应补偿，以减轻过渡不连续性。

    High frequency via with stripped semi-rigid cable
    102.
    发明申请
    High frequency via with stripped semi-rigid cable 失效
    高频通道带剥离的半刚性电缆

    公开(公告)号：US20060022774A1

    公开(公告)日：2006-02-02

    申请号：US10903534

    申请日：2004-07-30

    Applicant: John Greeley

    Inventor： John Greeley

    IPC: H01P3/08

    CPC classification number: H01P1/047 ,  H05K1/0219 ,  H05K3/4046 ,  H05K3/42 ,  H05K2201/0792 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10757

    Abstract: A high frequency coax via structure is configured with a stripped semi-rigid cable (no shield), and an inductive compensation loop to mitigate transition discontinuity between that via structure's center conductor and the pad to which the center conductor is connected. The performance of top-to-bottom microwave transitions at high frequencies (e.g., 1 to 12 GHz) for such boards is enhanced. A non-metallized via hole embodiment that is configured with surrounding ground vias provides a greater degree of compensation for connection pads associated with greater capacitance (such as those coupled to a component).

    Abstract translation: 高频同轴电缆通孔结构配置有剥离的半刚性电缆（无屏蔽）和电感补偿环路，以减轻该通孔结构的中心导体与中心导体所连接的焊盘之间的过渡不连续性。 在这种板的高频（例如，1至12GHz）上的顶部到底部的微波转换的性能得到提高。 配置有周围接地通孔的非金属化通孔实施例为与较大电容（例如耦合到部件的连接焊盘）相关联的连接焊盘提供更大程度的补偿。

    Quasi-coax transmission lines
    105.
    发明申请
    Quasi-coax transmission lines 审中-公开
    准同轴传输线

    公开(公告)号：US20050156693A1

    公开(公告)日：2005-07-21

    申请号：US10762143

    申请日：2004-01-20

    Applicant: Lewis Dove ,  John Casey

    Inventor： Lewis Dove ,  John Casey

    IPC: H01L23/12 ,  H01P3/00 ,  H01P3/06 ,  H01P3/08 ,  H05K1/02

    CPC classification number: H01P3/085 ,  H05K1/0221 ,  H05K2201/09809 ,  H05K2201/09981

    Abstract: A plurality of conductors are deposited on a layer of dielectric that is positioned above a first ground shield. A mound of dielectric is then deposited over each conductor. Thereafter, a second ground shield is deposited over the mounds of dielectric. Quasi-coax transmission lines are thereby formed. The conductors deposited “under” the mounds of dielectric may be deposited at a greater density than conductors encapsulated “within” mounds of dielectric. Additional shielding of the conductors may be provided, for example, by coupling the first and second ground shields by means of conductive vias in the layer of dielectric.

    Abstract translation: 多个导体沉积在位于第一接地屏蔽层上方的电介质层上。 然后在每个导体上沉积一堆电介质。 此后，第二接地屏蔽层沉积在电介质的堆上。 由此形成准同轴电缆传输线。 沉积在电介质堆下方的导体可以以比电介质“内部”的导体更大的密度沉积。 可以提供导体的附加屏蔽，例如通过借助于电介质层中的导电通孔来耦合第一和第二接地屏蔽。

    Semiconductor multilayer wiring substrate of coaxial wiring structure and method of fabricating the same
    106.
    发明申请
    Semiconductor multilayer wiring substrate of coaxial wiring structure and method of fabricating the same 审中-公开
    同轴布线结构的半导体多层布线基板及其制造方法

    公开(公告)号：US20050140019A1

    公开(公告)日：2005-06-30

    申请号：US11015792

    申请日：2004-12-17

    Applicant: Shoji Watanabe

    Inventor： Shoji Watanabe

    IPC: H01L23/12 ,  H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/84 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/04 ,  H05K3/46

    CPC classification number: H05K1/0221 ,  H01L21/4857 ,  H05K3/005 ,  H05K3/045 ,  H05K3/4644 ,  H05K3/465 ,  H05K2201/09036 ,  H05K2201/09809 ,  H05K2203/0108 ,  H05K2203/0733 ,  H05K2203/1189

    Abstract: A multilayer wiring substrate for a semiconductor having a rectangular coaxial wiring structure and a method of fabrication thereof are disclosed, in which a wiring substrate of high density, and free of crosstalk, can be fabricated by press work using a die. A semiconductor wiring substrate comprises an insulating base substrate (2), a first metal layer (3) formed on the base substrate, a plurality of signal patterns (30) formed on the first metal layer through a dielectric layer (5), a second metal layer (36) formed on the signal patterns through a dielectric layer (31), and metal vias (29, 37) for partitioning the adjacent signal patterns (30) through a dielectric layer. The die is used to form the signal patterns and the vias.

    Abstract translation: 公开了一种具有矩形同轴布线结构的半导体的多层布线基板及其制造方法，其中可以通过使用模具的冲压加工来制造高密度且无串扰的布线基板。 半导体布线基板包括绝缘基底（2），形成在基底基板上的第一金属层（3），通过电介质层（5）形成在第一金属层上的多个信号图案（30），第二金属层 通过电介质层（31）形成在信号图案上的金属层（36）和用于通过电介质层分隔相邻信号图案（30）的金属通孔（29,37）。 模具用于形成信号图案和通孔。

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