公开(公告)号：US20070207644A1

公开(公告)日：2007-09-06

申请号：US11706851

申请日：2007-02-15

Applicant: Robert Pollmann ,  Harald Weber ,  Walter Wimmer

Inventor： Robert Pollmann ,  Harald Weber ,  Walter Wimmer

IPC: H01R13/44

CPC classification number: H05K3/103 ,  B29C45/14639 ,  B29K2995/0005 ,  H05K3/107 ,  H05K7/06 ,  H05K2201/10287 ,  H05K2201/10598

Abstract: For a conductor structure component with plastics material injection-molded therearound, a fixing member for electric conductors is inserted, which fixing member is formed by a prefabricated carrier body comprising receptacles for the retention of individual wires as said electric conductors.

Abstract translation: 对于具有注塑成型的塑料材料的导体结构部件，插入用于电导体的固定构件，该固定构件由预制的载体主体形成，该载体主体包括用于保持作为所述电导体的各个导线的插座。

公开(公告)号：US20070202617A1

公开(公告)日：2007-08-30

申请号：US11743636

申请日：2007-05-02

Applicant: David Hembree

Inventor： David Hembree

IPC: H01L21/66 ,  G01R31/26

CPC classification number: H01L25/0657 ,  B23K20/004 ,  B23K20/005 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48455 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/78301 ,  H01L2224/8121 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/9202 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/53213 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a contact on the wire on the back side, forming a bonded contact on the wire on the circuit side, and then severing the wire from the bonded contact. The through wire interconnect includes the wire in the via, the contact on the back side and the bonded contact on the circuit side. The contact on the back side, and the bonded contact on the circuit side, permit multiple components to be stacked with electrical connections between adjacent components. A system for performing the method includes the substrate with the via, and a wire bonder having a bonding capillary configured to thread the wire through the via, and form the contact and the bonded contact. The semiconductor component can be used to form chip scale components, wafer scale components, stacked components, or interconnect components for electrically engaging or testing other semiconductor components.

Abstract translation: 用于通过导线互连制造半导体部件的方法包括提供具有电路侧，背面和通孔的基板的步骤。 该方法还包括以下步骤：将导线穿过通孔，在背面的导线上形成接触，在电路侧的导线上形成接合接触，然后将线从接合接触件断开。 通线互连包括通孔中的导线，背侧的触点和电路侧的接合触点。 背面的触点和电路侧的接合触点允许多个部件与相邻部件之间的电连接层叠。 用于执行该方法的系统包括具有通孔的基板和具有接合毛细管的引线接合器，所述接合毛细管被配置为使线穿过通孔，并形成接触和接合接触。 半导体部件可用于形成用于电接合或测试其它半导体部件的芯片级部件，晶片级部件，堆叠部件或互连部件。

公开(公告)号：US20070190819A1

公开(公告)日：2007-08-16

申请号：US11566862

申请日：2006-12-05

Applicant: Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

Inventor： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC: H05K1/00

CPC classification number: H05K3/4015 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/838 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/341 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49135 ,  Y10T29/49142 ,  Y10T29/49149 ,  Y10T29/49153 ,  H01L2224/13099 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

Abstract translation: 根据本发明的印刷电路板是印刷电路板（4），包括由金属线制成的元件安装销（1），以与半导体芯片（10）连接。 半导体芯片（10）是表面安装型半导体芯片，其在其安装表面上具有用于倒装芯片安装系统的电极焊盘。 元件安装销（1）通过引线接合技术形成。 该印刷电路板（4）能够减少由半导体芯片（10）和印刷电路板（4）的热膨胀系数之间的差异引起的误连接或断开。

公开(公告)号：US20070120219A1

公开(公告)日：2007-05-31

申请号：US11563311

申请日：2006-11-27

Applicant: Eiichi ITO ,  Koji TSUDA ,  Tadashi MINAKUCHI ,  Mitsuhiro MATSUMOTO

Inventor： Eiichi ITO ,  Koji TSUDA ,  Tadashi MINAKUCHI ,  Mitsuhiro MATSUMOTO

IPC: H01L29/00

CPC classification number: H05K3/103 ,  H05K1/0287 ,  H05K2201/0715 ,  H05K2201/09263 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2201/10598

Abstract: There is provided a method of manufacturing a conductive layer of in a signal transmission substrate. The method includes sewing conductive thread in sheet-like material having an insulating property so as to form one of a plurality of low resistance regions using the conductive thread in a high resistance region formed by the sheet-like material, moving the conductive thread from an end point of a previously sewed low resistance region to a start point of a low resistance region to be sewed subsequently, repeating the sewing and moving steps to form the plurality of low resistance regions in the high resistance region, and forming a plurality of holes in the conductive layer by press working so that an electrical component attached to at least one of the plurality of holes is able to transmit a signal between neighboring ones of the plurality of low resistance regions.

Abstract translation: 提供了一种在信号传输基板中制造导电层的方法。 该方法包括将具有绝缘性的片状材料中的导电线缝合，以便在由片状材料形成的高电阻区域中使用导电线形成多个低电阻区域中的一个，将导电线从 先前缝合的低电阻区域的终点到随后要缝制的低电阻区域的起始点，重复缝合和移动步骤以在高电阻区域中形成多个低电阻区域，并且形成多个孔 所述导电层通过冲压加工使得附接到所述多个孔中的至少一个孔的电气部件能够在所述多个低电阻区域中的相邻电阻区域之间传输信号。

公开(公告)号：US20070114638A1

公开(公告)日：2007-05-24

申请号：US11309215

申请日：2006-07-13

Applicant: Ling-Ling Shen

Inventor： Ling-Ling Shen

IPC: H01L23/495

CPC classification number: H05K1/0243 ,  H01L2924/0002 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/10075 ,  H05K2201/10287 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10969 ,  H01L2924/00

Abstract: A printed circuit board with a quartz crystal oscillator includes a mounting area for receiving the quartz crystal oscillator, two first vias, and two second vias. A copper foil is arranged on the mounting area. Pins of the quartz crystal oscillator are inserted into the first vias. The second vias are connected to a ground layer of the PCB and communicate with the copper foil, for transmitting noise of the quartz crystal oscillator to the ground layer of the PCB.

Abstract translation: 具有石英晶体振荡器的印刷电路板包括用于接收石英晶体振荡器的安装区域，两个第一通孔和两个第二通孔。 铜箔布置在安装区域上。 将石英晶体振荡器的引脚插入第一通孔中。 第二通孔连接到PCB的接地层，并与铜箔连通，将石英晶体振荡器的噪声传递到PCB的接地层。

公开(公告)号：US07213741B2

公开(公告)日：2007-05-08

申请号：US10963504

申请日：2004-10-14

Applicant: Atsushi Oohashi

Inventor： Atsushi Oohashi

IPC: B23K31/02

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K26/22 ,  B23K2101/36 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45147 ,  H01L2224/49175 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19107 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/4015 ,  H05K2201/10287 ,  H05K2201/1034 ,  H05K2201/10757 ,  H01L2224/48 ,  H01L2924/00

Abstract: After respective one ends of lead wires are fixed to a printed circuit board, the lead wires are bent, the printed circuit board is brought into a case and the other ends of the lead wires are bonded to terminals of the case. Since the lead wires are processed before the substrate is brought into the case, this eliminates the necessity to perform formation of the bent portions of the lead wires and fixing of the lead wires to the substrate in a narrow space of the case and allows simplification of bonding operation. Thus provided is a lead wire bonding method for bonding lead wires with bent portions to the substrate, which simplifies a bonding operation.

Abstract translation: 在导线的相应一端固定到印刷电路板上之后，导线弯曲，将印刷电路板带入壳体中，引线的另一端结合到壳体的端子。 由于在基板进入壳体之前处理引线，所以这消除了在引线的弯曲部分的形成和在壳体的狭窄空间内将引线固定到基板上的必要性，并且允许简化 粘接操作。 因此，提供了一种用于将引线与弯曲部分接合到基板的引线接合方法，这简化了接合操作。

公开(公告)号：US07179140B2

公开(公告)日：2007-02-20

申请号：US10861316

申请日：2004-06-04

Applicant: Stefan Jung ,  Christl Lauterbach

Inventor： Stefan Jung ,  Christl Lauterbach

IPC: H01R4/10

CPC classification number: D03D15/00 ,  D03D1/0088 ,  D03D15/02 ,  D10B2401/16 ,  H01R12/515 ,  H01R12/592 ,  H05K3/321 ,  H05K3/326 ,  H05K3/328 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/10287

Abstract: Contact-making device and method for connecting an electric conductor, in particular a wire-like and/or thread-like electric conductor which is arranged in a textile material, electrically to an electronic component. The device includes a substrate material, and at least one contact, which is formed on the substrate material, to connect the electric conductor electrically to the electronic component, the contact comprising a movable section and an immovable section. The movable section is formed such that, during the electrical connection operation, it is arranged substantially on a surface side opposite the immovable section.

Abstract translation: 用于将电导体，特别是布置在纺织材料中的线状和/或线状导电体电连接到电子部件的接触制造装置和方法。 该装置包括衬底材料和形成在衬底材料上的至少一个触点，以将电导体电连接到电子部件，该触点包括可动部分和不可移动部分。 可移动部分形成为使得在电连接操作期间，其基本上布置在与不可移动部分相对的表面侧上。

公开(公告)号：US07176131B2

公开(公告)日：2007-02-13

申请号：US10960994

申请日：2004-10-12

Applicant: Georg Meyer-Berg ,  Barbara Vasquez

Inventor： Georg Meyer-Berg ,  Barbara Vasquez

IPC: H01L21/44

CPC classification number: H01L21/4853 ,  H01L21/486 ,  H01L23/142 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06596 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/4046 ,  H05K2201/0323 ,  H05K2201/10287 ,  H05K2203/0235 ,  H01L2924/00

Abstract: An electronic component has a semiconductor chip and microscopically small flip-chip contacts belonging to a rewiring plate, on which macroscopically large elastic external contacts are arranged. The rewiring plate has a wiring support made of polycrystalline silicon, amorphous glass, or metal. Furthermore, the present invention relates to a method for the production of a suitable wiring support and of the electronic component.

Abstract translation: 电子部件具有属于重新布线板的半导体芯片和微小尺寸的倒装芯片触点，布置有宏观上大的弹性外部触点。 再布线板具有由多晶硅，非晶玻璃或金属制成的布线支撑。 此外，本发明涉及一种用于生产合适的布线支撑件和电子部件的方法。

公开(公告)号：US07172436B2

公开(公告)日：2007-02-06

申请号：US10800677

申请日：2004-03-16

Applicant: Koichi Uezono

Inventor： Koichi Uezono

IPC: H01R12/00

CPC classification number: B60R16/0238 ,  H05K1/0263 ,  H05K3/103 ,  H05K7/026 ,  H05K2201/0391 ,  H05K2201/09845 ,  H05K2201/09972 ,  H05K2201/10272 ,  H05K2201/10287

Abstract: A first board, on which electric wires are wired, includes a first part having a first thickness and a second part continued from the first part and having a second thickness smaller than the first thickness. A second board, on which bus bars are arranged, is disposed on the second part of the first board. The second board has a third thickness which is determined such that an additional thickness of the second thickness and the third thickness is not greater than the first thickness.

Abstract translation: 电线布线在其上的第一板包括具有第一厚度的第一部分和从第一部分延续的第二部分，并且具有小于第一厚度的第二厚度。 布置有母线的第二板被布置在第一板的第二部分上。 第二板具有第三厚度，其被确定为使得第二厚度和第三厚度的附加厚度不大于第一厚度。

公开(公告)号：US20070021787A1

公开(公告)日：2007-01-25

申请号：US11455028

申请日：2006-07-24

Applicant: Robert Greenberg ,  Alfred Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard Nolan ,  Dau Zhou

Inventor： Robert Greenberg ,  Alfred Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard Nolan ,  Dau Zhou

IPC: A61N1/00

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.