公开(公告)号：US20070178763A1

公开(公告)日：2007-08-02

申请号：US11515772

申请日：2006-09-06

Applicant: Bor-Ching Yang ,  Ping-Hui Chen ,  Jui-Chuan Huang

Inventor： Bor-Ching Yang ,  Ping-Hui Chen ,  Jui-Chuan Huang

IPC: H01R13/648

CPC classification number: H05K1/144 ,  H05K9/0024 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: An EMI-resistant circuit board assembly includes a plurality of circuit boards arranged in a stack and a metal shielding frame respectively sandwiched in between each two adjacent circuit boards. One of the circuit boards has at least one high-speed device producing high-frequency noises to the ambient, which result in EMI effect. The metal shielding frame is electrically connected to the ground potential of the circuit boards and shields the high-speed device on the circuit board to guide the high-frequency noises to the ground potential.

Abstract translation: EMI电阻电路板组件包括分别堆叠在堆叠中的多个电路板和分别夹在每个两个相邻电路板之间的金属屏蔽框架。 其中一个电路板至少有一个高速器件产生对环境的高频噪声，从而产生EMI效应。 金属屏蔽框架电连接到电路板的接地电位，并屏蔽电路板上的高速器件，以将高频噪声引导到地电位。

公开(公告)号：US20070111606A1

公开(公告)日：2007-05-17

申请号：US11564199

申请日：2006-11-28

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H01R24/00

CPC classification number: G11C5/04 ,  H01L23/34 ,  H01L23/36 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: Multiple fully buffered DIMM circuits or instantiations are presented in a single module. In a preferred embodiment, memory integrated circuits (preferably CSPs) and accompanying AMBs are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete FB-DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs or include greater numbers of ICs.

Abstract translation: 多个完全缓冲的DIMM电路或实例被呈现在单个模块中。 在优选实施例中，存储器集成电路（优选CSP）和伴随的AMB被布置在柔性电路的每一侧的两个场中的两个等级中。 柔性电路具有沿着一侧设置的扩展触点。 柔性电路围绕支撑衬底或板设置，以在构造的模块的每一侧上放置一个完整的FB-DIMM电路或实例化。 在替代但也是优选实施例中，最靠近基板的柔性电路侧的IC至少部分地设置在优选实施例中在基板中的窗口，凹部或切口区域中。 其他实施例可以仅填充柔性电路的一侧，或者可以仅移除足够的衬底材料以减少但不消除整个衬底对整体轮廓的贡献。 柔性电路可以表现出一个或两个或更多个导电层，并且可以具有分层结构的变化或具有分裂层。 其他实施例可能错开或偏移IC或包括更多数量的IC。

公开(公告)号：US20060220665A1

公开(公告)日：2006-10-05

申请号：US11445684

申请日：2006-06-01

Applicant: Salman Akram ,  Alan Wood ,  Warren Farnworth

Inventor： Salman Akram ,  Alan Wood ,  Warren Farnworth

IPC: G01R31/02

CPC classification number: H05K7/1061 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/07378 ,  G01R3/00 ,  H01L23/32 ,  H01L23/49827 ,  H01L2224/16111 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/112 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A fence is configured to receive and align a semiconductor device, such as a flip-chip type semiconductor device, with a substrate. The fence may include a plurality of adjacent, mutually adhered regions, which may comprise layers. One or more laterally recessed regions may be located at one or more corners of a receptacle formed by the fence to facilitate rough alignment of a semiconductor device with the substrate. The receptacle of the fence may include edges that are configured to progressively align a semiconductor device with the substrate.

Abstract translation: 栅栏被配置为接收和对齐诸如倒装芯片型半导体器件的半导体器件与衬底。 栅栏可以包括多个相邻的相互粘合的区域，其可以包括层。 一个或多个横向凹陷区域可以位于由栅栏形成的容器的一个或多个拐角处，以便半导体器件与衬底的粗略对准。 栅栏的插座可以包括被配置为使半导体器件与衬底逐渐对准的边缘。

公开(公告)号：US20060189214A1

公开(公告)日：2006-08-24

申请号：US11325717

申请日：2006-01-05

Applicant: Shinichiro Maruyama

Inventor： Shinichiro Maruyama

IPC: H01R24/00

CPC classification number: H01R43/0256 ,  H01R43/0263 ,  H01R43/205 ,  H05K3/301 ,  H05K2201/10189 ,  H05K2201/2018 ,  Y10S439/94 ,  Y10T29/53265

Abstract: Disclosed is an improved connector assembly whose four connectors can be fixed to and left on a substrate in square shape in the state of being independent from each other, thus preventing any bending or twisting of one of the connectors from adversely affecting the connection terminals of the other connectors. It comprises an assembly frame 20 comprising a square frame 21 with an engagement formed at each corner, and four connectors 30 arranged on one surface of the square frame 21. Specifically each connector 30 is laid on a selected straight side to form the square shape. It comprises a rod-like terminal support 31 having connection terminals 32 parallel-arranged and fixed to its substantial length. The rod-like terminal support 31 has a complementary engagement formed on each end to detachably accommodate the engagement of each corner of the square frame 21, thus providing an integral combination of the assembly frame 20 and the connectors 30, which can be separated from each other.

Abstract translation: 公开了一种改进的连接器组件，其四个连接器可以在彼此独立的状态下固定到基板上并保持在基板上，从而防止任何一个连接器的弯曲或扭曲对连接端子的连接端子产生不利影响 其他连接器。 它包括组装框架20，其包括在每个角部处形成有接合部的方形框架21和布置在正方形框架21的一个表面上的四个连接器30。 特别地，每个连接器30被放置在选定的直边上以形成正方形。 它包括一个杆状端子支架31，其具有平行布置和固定到其相当长度的连接端子32。 杆状端子支撑件31具有形成在每个端部上的互补接合部，以可拆卸地容纳方形框架21的每个角部的接合，从而提供组装框架20和连接器30的整体组合，其可以与每个角部分离 其他。

公开(公告)号：US20060125086A1

公开(公告)日：2006-06-15

申请号：US11008798

申请日：2004-12-09

Applicant: Roger Booth ,  Matthew Doyle ,  Don Gilliland ,  Brian Gregg ,  Lynn Landin ,  Thomas Liang ,  Ankur Patel ,  Dennis Wurth

Inventor： Roger Booth ,  Matthew Doyle ,  Don Gilliland ,  Brian Gregg ,  Lynn Landin ,  Thomas Liang ,  Ankur Patel ,  Dennis Wurth

IPC: H01L23/34

CPC classification number: H05K1/0231 ,  H01L23/3672 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/301 ,  H05K2201/10454 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fin. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to a heat sink surface of the modular decoupling capacitor. The interposer module is used for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers.

Abstract translation: 模块化散热器去耦电容器阵列包括多个模块，每个模块限定平行分布式去耦板，并且每个模块形成散热片。 每个模块包括多个间隔开的触点，用于与相关联的装置提供低电感连接。 功率分配插入器模块连接到模块化去耦电容器的散热器表面。 内插器模块用于实现功率输送，而不使用有价值的球栅阵列（BGA）连接和印刷电路板（PCB）层。

公开(公告)号：US20060119761A1

公开(公告)日：2006-06-08

申请号：US11289632

申请日：2005-11-30

Applicant: Tatsumi Okuda

Inventor： Tatsumi Okuda

IPC: G02F1/1333

CPC classification number: H05K1/147 ,  G02F1/13452 ,  H05K2201/10189 ,  H05K2201/2018 ,  H05K2201/2027

Abstract: A display is provided that can prevent uplift of a flexible printed circuit board due to flexure deformation of the flexible printed circuit board. The display includes: a display panel; a frame that houses the display panel; a backlight source that is disposed on the backside of the display panel; and a first flexible printed circuit board for backlight that is electrically connected to the backlight source, and extends from the inside of the frame to the outside of the frame. The frame has an uplift preventing member that prevents uplift of the first flexible printed circuit board.

Abstract translation: 提供了可以防止柔性印刷电路板由于柔性印刷电路板的挠曲变形而引起的柔性印刷电路板的隆起的显示器。 显示器包括：显示面板; 一个容纳显示面板的框架; 背光源，设置在显示面板的背面; 以及电连接到背光源的背光源的第一柔性印刷电路板，并且从框架的内部延伸到框架的外部。 框架具有防止第一柔性印刷电路板隆起的隆起防止构件。

公开(公告)号：US20060119760A1

公开(公告)日：2006-06-08

申请号：US11285751

申请日：2005-11-23

Applicant: Tatsumi Okuda

Inventor： Tatsumi Okuda

IPC: G02F1/1333

CPC classification number: H05K1/147 ,  G02F1/13452 ,  H05K2201/2018 ,  H05K2201/2027

Abstract: A display includes: a display panel; a flexible printed circuit board that is attached to the display panel at a first height; and a frame that has the display panel disposed therein. The frame includes a guide portion that pulls the flexible printed circuit board to the outside of the frame, with the height of the flexible printed circuit board being varied from the first height to a second height by bending the flexible printed circuit board.

Abstract translation: 显示器包括：显示面板; 柔性印刷电路板，其以第一高度附接到所述显示面板; 以及其中设置有显示面板的框架。 框架包括引导部分，其将柔性印刷电路板拉到框架的外部，柔性印刷电路板的高度通过弯曲柔性印刷电路板而从第一高度变化到第二高度。

公开(公告)号：US07053483B2

公开(公告)日：2006-05-30

申请号：US11021169

申请日：2004-12-21

Applicant: Robert F. Wallace

Inventor： Robert F. Wallace

IPC: H01L23/34

CPC classification number: G11C5/06 ,  G11C5/04 ,  G11C16/04 ,  G11C29/1201 ,  G11C29/48 ,  H01L21/565 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/5388 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0655 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09127 ,  H05K2201/10689 ,  H05K2201/2018

Abstract: A small package is provided for a flash EEPROM memory. The small package uses terminals which are part of a bottom conductive layer of a circuit board. In this manner, the final package can be quite thin. The circuit board can be connected to the integrated circuits and passive devices and can be encapsulated in plastic or glued to a plastic cover. In this manner, a thin and relatively inexpensive package can be formed. Additionally, the circuit board can have testing connections which can be removed before forming the final package.

公开(公告)号：US07044748B2

公开(公告)日：2006-05-16

申请号：US10672084

申请日：2003-09-26

Applicant: Iosif R. Korsunsky ,  Wei-Chen Lee

Inventor： Iosif R. Korsunsky ,  Wei-Chen Lee

IPC: H01R9/09

CPC classification number: H05K1/14 ,  H01R12/52 ,  H01R12/716 ,  H01R12/721 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/2018

Abstract: An electrical device 1 for interconnecting two printed circuit boards 2, 3 (PCBs) at a large distance includes a first connector 4 and a second connector 5 for being respectively mounted on the two PCBs, and an extender 6 located between and electrically connected with the first and second connectors. The extender includes a frame 7 for being fixed to one PCB, and two circuit boards 8, 9 attached to the frame and connecting with the first and second connectors at opposite ends thereof.

Abstract translation: 用于将两个印刷电路板2,3（PCB）互相连接的电气设备1包括分别安装在两个PCB上的第一连接器4和第二连接器5以及位于两个PCB之间并与之电连接的扩展器6 第一和第二连接器。 扩展器包括用于固定到一个PCB的框架7和附接到框架并且在其相对端处与第一和第二连接器连接的两个电路板8,9。

公开(公告)号：US20060098396A1

公开(公告)日：2006-05-11

申请号：US11256088

申请日：2005-10-24

Applicant: Cheng-Yen Shih

Inventor： Cheng-Yen Shih

IPC: H05K5/00

CPC classification number: H05K1/183 ,  H04B1/38 ,  H05K1/0237 ,  H05K1/117 ,  H05K1/141 ,  H05K3/284 ,  H05K2201/2018

Abstract: A communication module. The communication module comprises at least one supporting structure, at least one first electronic component, and at least one connecting pad. The supporting structure comprises a first surface and a hollow portion. The first electronic component is disposed in the hollow portion. The connecting pad is disposed on the first surface and electrically connected to the first electronic component.

Abstract translation: 通讯模块 通信模块包括至少一个支撑结构，至少一个第一电子部件和至少一个连接焊盘。 支撑结构包括第一表面和中空部分。 第一电子部件设置在中空部。 连接焊盘设置在第一表面上并电连接到第一电子部件。