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公开(公告)号：US20180156706A1
公开(公告)日：2018-06-07
申请号：US15830036
申请日：2017-12-04
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Christian Bretthauer
IPC: G01N15/06
CPC classification number: G01N15/06 , G01N15/02 , G01N29/032 , G01N2015/0046 , G01N2291/02408 , G01N2291/045 , G01N2291/048 , G01N2291/101 , G01N2291/102
Abstract: An apparatus for analysing the particulate matter content of an aerosol includes an aerosol chamber configured to receive an aerosol, the particulate matter content of which should be analysed, at least one ultrasonic generator configured to produce ultrasonic waves in the aerosol received in the aerosol chamber, an ultrasonic detector configured to detect ultrasonic waves produced by the at least one ultrasonic generator in the aerosol, and an evaluator having a data exchange communication link with the ultrasonic detector and configured to ascertain the matter content on the basis of signals output by the ultrasonic detector. The ultrasonic generator and the ultrasonic detector are positioned relative to one another such that a path length to be traversed by ultrasonic waves between the ultrasonic generator and the ultrasonic detector is less than 1 cm.
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公开(公告)号：US20180109206A1
公开(公告)日：2018-04-19
申请号：US15842148
申请日：2017-12-14
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe
CPC classification number: H02N99/00 , B81B3/0072 , B81B2201/0257 , B81B2203/0127 , G01N21/956 , H01J37/26 , H02N1/08 , H04R7/10 , H04R19/04 , H04R31/003 , Y10T428/24281
Abstract: A plate, a transducer, a method for making a transducer, and a method for operating a transducer are disclosed. An embodiment comprises a plate comprising a first material layer comprising a first stress, a second material layer arranged beneath the first material layer, the second material layer comprising a second stress, an opening arranged in the first material layer and the second material layer, and an extension extending into opening, wherein the extension comprises a portion of the first material layer and a portion of the second material layer, and wherein the extension is curved away from a top surface of the plate based on a difference in the first stress and the second stress.
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113.发明申请公开(公告)号：US20180103325A1
公开(公告)日：2018-04-12
申请号：US15839546
申请日：2017-12-12
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Stefan Barzen , Marc Fueldner
CPC classification number: H04R19/04 , H04R7/00 , H04R19/005 , H04R31/00 , H04R31/003 , H04R31/006 , Y10T29/49005
Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.
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公开(公告)号：US20180099867A1
公开(公告)日：2018-04-12
申请号：US15819767
申请日：2017-11-21
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe , Johann Strasser , Gerhard Metzger-Brueckl
CPC classification number: B81B3/0086 , B81B2201/0257 , B81B2203/0127 , H04R19/005 , H04R19/04 , H04R31/006 , H04R2201/003
Abstract: In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least partially arranged in the low pressure region or extends in the low pressure region. The conductive layer includes a segmentation providing an electrical isolation between a first portion of the conductive layer and a second portion of the conductive layer.
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115.发明授权公开(公告)号：US09856134B2
公开(公告)日：2018-01-02
申请号：US15054299
申请日：2016-02-26
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe
CPC classification number: B81B3/0021 , B81B7/0048 , B81B2201/0257 , B81B2203/0118 , B81B2203/0127 , B81B2203/04 , B81B2207/012 , B81C1/00325
Abstract: A microelectromechanical system and a method for manufacturing a microelectromechanical system including: a substrate; a microelectromechanical device including: a diaphragm configured as a transducer to convert between electrical energy and mechanical energy and an electrode coupled to the diaphragm; a support region mechanically coupling the microelectromechanical device to the substrate, wherein the support region is confined to a first continuous region spanning an arc of less than 90 degrees around a perimeter of the diaphragm; and a second continuous region free from mechanical support of the microelectromechanical device to the substrate, the second continuous region spanning the perimeter of the diaphragm from one end of the support region to the other end of the support region; wherein the support region cantilevers the microelectromechanical device and the second continuous region mechanically decouples the microelectromechanical device from the substrate.
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Patent Agency Ranking
公开(公告)号：US09828237B2
公开(公告)日：2017-11-28
申请号：US15066741
申请日：2016-03-10
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe , Johann Strasser , Gerhard Metzger-Brueckl
CPC classification number: B81B3/0086 , B81B2201/0257 , B81B2203/0127 , H04R19/005 , H04R19/04 , H04R31/006 , H04R2201/003
Abstract: In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least partially arranged in the low pressure region or extends in the low pressure region. The conductive layer includes a segmentation providing an electrical isolation between a first portion of the conductive layer and a second portion of the conductive layer.
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公开(公告)号：US20170325025A1
公开(公告)日：2017-11-09
申请号：US15145862
申请日：2016-05-04
Applicant: Infineon Technologies AG
Inventor： Manuel Dorfmeister , Michael Schneider , Manfred Kaltenbacher , Alfons Dehe , Ursula Hedenig , Thomas Grille , Ulrich Schmid
Abstract: Aspects of a microelectromechanical device, an array of microelectromechanical devices, a method of manufacturing a microelectromechanical device, and a method of operating a microelectromechanical device, are discussed herein. The microelectromechanical device may include: a substrate; a diaphragm mechanically coupled to the substrate, the diaphragm comprising a stressed region to buckle the diaphragm into one of two geometrically stable positions; an actuator mechanically coupled to the diaphragm, the actuator comprising a piezoelectric layer over the diaphragm; a controller configured to provide an electrical control signal in response to a digital sound input; wherein the actuator is configured to receive the electrical control signal to exert a mechanical piezoelectric force on the diaphragm via the piezoelectric layer to move the diaphragm to create a sound wave.
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公开(公告)号：US09658179B2
公开(公告)日：2017-05-23
申请号：US14749102
申请日：2015-06-24
Applicant: Infineon Technologies AG
Inventor： Vijaye Kumar Rajaraman , Yonsuang Arnanthigo , Alfons Dehe , Stefan Kolb
CPC classification number: B81B7/02 , B81B3/0018 , B81B2201/0214 , B81B2201/0257 , B81B2201/0278 , B81C1/00166 , B81C1/00182 , B81C1/00206 , G01N27/223 , H04R19/005 , H04R19/04 , H04R31/003 , H04R2201/003
Abstract: According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a substrate with a first cavity that passes through the substrate from a backside of the substrate. The MEMS transducer also includes a perforated first electrode plate overlying the first cavity on a topside of the substrate, a second electrode plate overlying the first cavity on the topside of the substrate and spaced apart from the perforated first electrode plate by a spacing region, and a gas sensitive material in the spacing region between the perforated first electrode plate and the second electrode plate. The gas sensitive material has an electrical property that is dependent on a concentration of a target gas.
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公开(公告)号：US20170073213A1
公开(公告)日：2017-03-16
申请号：US15345179
申请日：2016-11-07
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe
CPC classification number: B81B3/0005 , B81B3/001 , B81B2201/0257 , B81B2203/0136 , B81C1/0015 , B81C1/00968 , B81C2201/112
Abstract: A MEMS device and a method to manufacture a MEMS device are disclosed. An embodiment includes forming trenches in a first main surface of a substrate, forming conductive fingers by forming a conductive material in the trenches and forming an opening from a second main surface of the substrate thereby exposing the conductive fingers, the second main surface opposite the first main surface.
Abstract translation: 公开了MEMS器件和制造MEMS器件的方法。 一个实施例包括在衬底的第一主表面中形成沟槽，通过在沟槽中形成导电材料形成导电指状物并从衬底的第二主表面形成开口，从而暴露导电指状物，第二主表面与第一主表面相反 主表面。
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公开(公告)号：US09565488B2
公开(公告)日：2017-02-07
申请号：US14716940
申请日：2015-05-20
Applicant: Infineon Technologies AG
Inventor： Wolfgang Friza , Alfons Dehe
Abstract: In various embodiments, a micro-electro-mechanical system device is provided. The micro-electro-mechanical system device may include a carrier, a particle filter structure coupled to the carrier, the particle filter structure comprising a grid, wherein the grid comprises a plurality of grid elements, each grid element comprising at least one through hole, and a micro-electro-mechanical system structure disposed on a side of the particle filter structure opposite the carrier. A height of the plurality of grid elements is greater than a width of the corresponding grid elements.
Abstract translation: 在各种实施例中，提供了微机电系统装置。 微电子机械系统装置可以包括载体，耦合到载体的颗粒过滤器结构，包括网格的颗粒过滤器结构，其中网格包括多个网格元件，每个网格元件包括至少一个通孔， 以及设置在与载体相对的粒子滤波器结构的一侧的微电子机械系统结构。 多个网格元素的高度大于对应网格元素的宽度。
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