Abstract:
An electrostatic bimorph actuator includes a cantilevered flexible bimorph arm that is secured and insulated at one end to a planar substrate. In an electrostatically activated state the bimorph arm is generally parallel to the planar substrate. In a relaxed state, residual stress in the bimorph arm causes its free end to extend out-of-plane from the planar substrate. The actuator includes a substrate electrode that is secured to and insulated from the substrate and positioned under and in alignment with the bimorph arm. An electrical potential difference applied between the bimorph arm and the substrate electrode imparts electrostatic attraction between the bimorph arm and the substrate electrode to activate the actuator. As an exemplary application in which such actuators could be used, a microelectrical mechanical optical display system is described.
Abstract:
A method for fabricating an interference display unit is disclosed. A first wall and a sacrificial layer are formed in order on a substrate and an opening is formed in the first wall and the sacrificial layer. A first photoresist layer is spin-coated on the sacrificial layer and fills the openings. A post having a first arm is formed through patterning the first photoresist layer. At least a second photoresist is formed by spin-coating. A second arm is formed on the first arm through patterning the second photoresist layer. A second wall is formed on the sacrificial layer and posts. The first and the second arms' stress is released through a thermal process. The position of the arm is shifted and the distance between the first wall and the second wall is therefore defined. Finally, the sacrificial layer is removed.
Abstract:
An adjustable nanopore is fabricated by placing the surfaces of two planar substrates in contact, wherein each substrate contains a hole having sharp corners and edges. A corner is brought into proximity with an edge to define a triangular aperture of variable area. Ionic current in a liquid solution and through the aperture is monitored as the area of the aperture is adjusted by moving one planar substrate with respect to the other along two directional axes and a rotational axis. Piezoelectric positioners can provide subnanometer repeatability in the adjustment process. The invention is useful for characterizing, cleaving, and capturing molecules, molecular complexes, and supramolecular complexes which pass through the nanopore, and provides an improvement over previous devices in which the hole size of nanopores fabricated by etching and/or redeposition is fixed after fabrication.
Abstract:
The present invention provides method of making mechanisms in which the relative locations of elements are maintained during manufacturing. The methods according to the present invention can be used to make a variety of devices, including tunable optical devices. The methods include displaceably attaching an island (support) to a frame with a non-rigid material.
Abstract:
The present invention provides a compliant mechanism that can be used to make a variety of devices, such as tunable optical devices that are more reliable, more cost effective and/or exhibit better performance than prior art devices.
Abstract:
Three-dimensional structures of arbitrary shape are fabricated on the surface of a substrate through a series of processing steps wherein a monolithic structure is fabricated in successive layers. A first layer of photoresist material is spun onto a substrate surface and is exposed in a desired pattern corresponding to the shape of a final structure, at a corresponding cross-sectional level in the structure. The layer is not developed after exposure; instead, a second layer of photoresist material is deposited and is also exposed in a desired pattern. Subsequent layers are spun onto the top surface of prior layers and exposed, and upon completion of the succession of layers each defining corresponding levels of the desired structure, the layers are all developed at the same time leaving the three-dimensional structure.
Abstract:
A micro-electromechanical system assembly is designed to integrate a laser. More particularly, laser is a vertical cavity surface-emitting laser. The MEMS assembly includes a micro-electromechanical substrate having an upper surface and a lower surface, the upper surface defined as having a first area and a second area. A first substrate bonding pad is positioned on the upper surface at a location within the first area, and a second substrate bonding pad is positioned on the upper surface at a location within the second area. Deposited upon the first and second substrate bonding areas are respective first and second solder material. A laser to be integrated in the MEMS assembly has a first laser bonding pad located on a first side, and a second laser bonding pad located on a second side. The laser is placed between the first substrate bonding pad and second substrate bonding pad such that they align with the respective first and second laser bonding pads. Upon a reflow of the solder material, a precise alignment of the laser is obtained while the reflow process occurs, and at the same time providing a mechanical and electrical connection between the bonding pads. In a further embodiment, the MEMS substrate is configured with a trench portion into which is placed the laser having the first and second laser bonding pads. Placement in the trench, is at least one of a 45° and 54.74° angle. Upon reflow of solder material on the substrate, the laser is finely positioned and held mechanically stable. In a further embodiment, the trench previously described includes a spring mechanism which carries a substrate bonding pad. The spring mechanism causing the laser within the trench to be maintained in a preferred position during and after the solder reflow process. Still yet another embodiment employs bimetallic cantilevers for positioning the laser and electrical interconnect.
Abstract:
A microstructure is provided including a base layer underlying a first and second structural plates. Operation of the microstructure is capable of overcoming stiction. Methods of operation include providing an edge of the first structural plate in contact with a contact point. A second structural plate is deflected in a way that overcomes stiction between the first structural plate and the contact point. Such deflection can include providing a prying force to lift the first structural plate or a hammering force to disturb any stiction related forces at the contact point.
Abstract:
The present invention provides multi-layer microfluidic systems, by providing additional substrate layers, e.g., third, fourth, fifth and more substrate layers, mated with the typically described first and second layers. Microfabricated elements, e.g., grooves, wells and the like, are manufactured into the surfaces between the various substrate layers. These microfabricated elements define the various microfluidic aspects or structures of the overall device, e.g., channels, chambers and the like. In preferred aspects, a separate microscale channel network is provided between each of the substrate layers.
Abstract:
This invention provides a very sensitive optical attenuator, which can be used to couple and attenuate optical signals between optical fibers with a wide range of attenuation level. Such an optical attenuator includes a flexible conductive membrane to be moved by an external force, such as electrostatic force, to achieve deformation of the conductive membrane. The conductive membrane can be formed, for example, by a vacuum deposited silicon nitride film. A thin metallic, conductive layer is then deposited on the flexible membrane to form a reflective mirror to receive and reflect incident optical signals. The semiconductor structure includes one or more spacing posts, with which the first structural member is to be joined and bonded. Electrodes are placed on the semiconductor structure in close proximity to the flexible membrane. At various areas of the semiconductor structure, additional spacing posts are added to cause deformation of the conductive membrane when a voltage is applied between the membrane and the electrodes on the semiconductor structure.