Injection molding techniques for forming a microfluidic structure having at least one flash free aperture
    111.
    发明申请
    Injection molding techniques for forming a microfluidic structure having at least one flash free aperture 审中-公开
    用于形成具有至少一个无闪光孔的微流体结构的注塑技术

    公开(公告)号:US20040178537A1

    公开(公告)日:2004-09-16

    申请号:US10739721

    申请日:2003-12-18

    Abstract: Injection molding techniques to form a microfluidic structure or substrate having at least one flash-free aperture. A method comprises injecting a polymeric material into a cavity of a mold. The mold includes at least one pin extending a length into the cavity wherein the length is greater than a depth of the cavity such that the pin is compressed when the mold is closed. Material injected into the cavity is shut off from the space occupied by the pin and consequently, undesirable flash is avoided. The mold is opened and the substrate is removed from the mold. The pin may be integral with the mold, discrete, or be comprised of individual components which can be combined together when the mold is closed to form a solid body. Preferably, the length of the pin is at least about 60 microns greater than the depth of the cavity.

    Abstract translation: 注射成型技术以形成具有至少一个无闪光孔的微流体结构或基底。 一种方法包括将聚合物材料注入模具的空腔中。 模具包括至少一个将长度延伸到空腔中的销,其中长度大于空腔的深度,使得当模具关闭时销被压缩。 注入空腔的材料与销钉占据的空间切断,因此避免了不期望的闪光。 打开模具,将基材从模具中取出。 销可以与模具成一体,离散的,或由单独的部件组成,当模具关闭以形成固体时,该部件可以组合在一起。 优选地,销的长度比空腔的深度大至少大约60微米。

    Method for manufacturing microstructures having multiple microelements with through-holes
    112.
    发明申请
    Method for manufacturing microstructures having multiple microelements with through-holes 有权
    具有多个具有通孔的微量元素的微结构的制造方法

    公开(公告)号:US20040164454A1

    公开(公告)日:2004-08-26

    申请号:US10373251

    申请日:2003-02-24

    Abstract: A method is provided for manufacturing microstructures of the type which contain a substrate and an array of protruding microelements with through-holes, which are used in penetrating layers of skin. The microelements are embossed or pressed into an initial substrate structure, which in some embodiments is formed from extruded polymeric material, and in some cases from two layers of polymer that are co-extruded. The through-holes are formed from filled through-cylinders of a second material that is removed after the embossing or pressing step; in other instances, the through-holes are left hollow during the embossing or pressing step.

    Abstract translation: 提供了一种用于制造包含基底的微结构的方法和具有通孔的突出微元件阵列,其用于穿透皮肤层。 微元件被压花或压制成初始的基底结构,其在一些实施方案中由挤出的聚合物材料形成,并且在一些情况下由共挤出的两层聚合物形成。 通孔由在压花或压制步骤之后被去除的第二材料的填充的通孔形成; 在其他情况下,在压花或压制步骤期间,通孔留空。

    Method of component manufacture
    115.
    发明授权
    Method of component manufacture 有权
    零件制造方法

    公开(公告)号:US06372542B1

    公开(公告)日:2002-04-16

    申请号:US09622398

    申请日:2000-10-19

    Abstract: The present invention relates to a method of producing an electric, electronic, electromechanical and/or mechanical component (12), where the component substrate is given a three-dimensional structure (3″) or configuration, and where said substrate is adapted for further treatment or processing to form the component (12). The substrate is formed by shaping said substrate against a die or mold, such as by molding, pressing, extruding or embossing said substrate, wherewith the precision necessary with respect to said component in the three-dimensional structure is achieved by means of a micromechanical working process when producing the die or mold.

    Abstract translation: 本发明涉及一种制造电气,电子,机电和/或机械部件(12)的方法,其中部件基板被给予三维结构(3“)或构造,并且其中所述基板适于 进一步处理或加工以形成组分(12)。 通过将所述基板抵靠模具或模具成形,例如通过模制,压制,挤压或压印所述基板而形成基板,其中相对于所述三维结构中的所述部件所需的精度通过微机械加工 生产模具或模具时的过程。

    Designer particles of micron and submicron dimension
    117.
    发明申请
    Designer particles of micron and submicron dimension 审中-公开
    设计颗粒的微米和亚微米尺寸

    公开(公告)号:US20020022124A1

    公开(公告)日:2002-02-21

    申请号:US09946115

    申请日:2001-09-04

    Inventor: Rodney S. Ruoff

    Abstract: Micron-sized particles are produced in quantity by one of various methods, including generally the steps of preparing a substrate surface through a lithographic process, the surface being characterized by defining a plurality of elements, depositing a layer of particle material on the substrate surface including the elements, processing the substrate surface to isolate the material deposited on the elements, and separating the particles from the elements. The size and shape of the elements predetermine the size and shape of the particles. The elements may comprise, inter alia, pillars of photoresist or spaces on the substrate surrounded and defined by photoresist.

    Abstract translation: 通过各种方法之一量产生微米尺寸的颗粒,包括通常通过平版印刷工艺制备衬底表面的步骤,该表面的特征在于限定多个元件,在衬底表面上沉积颗粒材料层,包括 元件,处理衬底表面以分离沉积在元件上的材料,并将颗粒与元件分离。 元素的大小和形状预先决定了粒子的大小和形状。 这些元件尤其可以包括光致抗蚀剂的支柱或被光致抗蚀剂包围和限定的衬底上的空间。

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