Pressure sensitive adhesive composition for touch panel
    113.
    发明授权
    Pressure sensitive adhesive composition for touch panel 有权
    触摸屏压敏胶组合物

    公开(公告)号:US09556364B2

    公开(公告)日:2017-01-31

    申请号:US13880611

    申请日:2011-10-20

    Abstract: Provided are a pressure-sensitive adhesive composition for a touch panel, a conductive film, a touch panel and a pressure-sensitive adhesive film. The exemplary pressure-sensitive adhesive composition for a touch panel, the conductive film or the pressure-sensitive adhesive film has excellent durability and optical properties such as transparency. In addition, such physical properties are stably maintained under severe conditions. Particularly, a pressure-sensitive adhesive layer is attached to a conductor thin film, and thus resistance change of the conductor thin film is effectively inhibited even when the conductor thin film is exposed to the severe conditions. Therefore, the pressure-sensitive adhesive composition may be effectively used to manufacture a touch panel.

    Abstract translation: 提供一种用于触摸面板,导电膜,触摸面板和压敏粘合剂膜的压敏粘合剂组合物。 用于触摸面板的示例性压敏粘合剂组合物,导电膜或压敏粘合剂膜具有优异的耐久性和诸如透明度的光学性质。 此外,这种物理性能在恶劣条件下稳定地保持。 特别是,在导体薄膜上附着有粘合剂层,因此即使在导体薄膜暴露于恶劣条件下也能够有效地抑制导体薄膜的电阻变化。 因此,可以有效地使用压敏粘合剂组合物来制造触摸面板。

    CONDUCTIVE ADHESIVE, ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICES USING BOTH
    118.
    发明申请
    CONDUCTIVE ADHESIVE, ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICES USING BOTH 有权
    导电胶,异相导电胶片和电子设备

    公开(公告)号:US20160060490A1

    公开(公告)日:2016-03-03

    申请号:US14781746

    申请日:2014-03-27

    Abstract: [Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 massppm or less, preferably 50 massppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin. The epoxy (meth)acrylate resin is preferably prepared by subjecting a starting compound (substrate) having a carbon-carbon double bond to epoxidation of the double bond with an oxidizing agent consisting of hydrogen peroxide, and then subjecting the obtained epoxy compound to addition reaction with (meth)acrylic acid.

    Abstract translation: [问题]提供:含有环氧(甲基)丙烯酸酯树脂的导电性粘合剂,其可以形成不易被卤素劣化的结合区域; 各向异性导电膜; 和使用两者的电子设备。 [解决方案]导电性粘合剂和各向异性导电膜,其各自含有导电性填料和粘合剂树脂,其中:所述粘合剂树脂包含环氧(甲基)丙烯酸酯树脂,其是(甲基)丙烯酸与 总氯原子浓度和总溴原子浓度之和为300质量ppm以下,优选为50质量ppm以下的环氧化合物; 并且导电填料分散在包含这种环氧(甲基)丙烯酸酯树脂的粘合剂树脂中。 环氧(甲基)丙烯酸酯树脂优选通过使具有碳 - 碳双键的原料化合物(底物)与由过氧化氢组成的氧化剂进行环氧化反应制备,然后将所得环氧化合物进行加成反应 与(甲基)丙烯酸。

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