Abstract:
An anisotropic conductive film has a first connection layer and a second connection layer formed on a surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. Conductive particles for anisotropic conductive connection are arranged on a surface of the first connection layer on a side of the second connection layer so that the embedding ratio of the conductive particles in the first connection layer is 80% or more, or 1% or more and 20% or less.
Abstract:
Provided are a pressure-sensitive adhesive composition for a touch panel, a conductive film, a touch panel and a pressure-sensitive adhesive film. The exemplary pressure-sensitive adhesive composition for a touch panel, the conductive film or the pressure-sensitive adhesive film has excellent durability and optical properties such as transparency. In addition, such physical properties are stably maintained under severe conditions. Particularly, a pressure-sensitive adhesive layer is attached to a conductor thin film, and thus resistance change of the conductor thin film is effectively inhibited even when the conductor thin film is exposed to the severe conditions. Therefore, the pressure-sensitive adhesive composition may be effectively used to manufacture a touch panel.
Abstract:
Provided are a pressure-sensitive adhesive composition for a touch panel, a conductive film, a touch panel and a pressure-sensitive adhesive film. The exemplary pressure-sensitive adhesive composition for a touch panel, the conductive film or the pressure-sensitive adhesive film has excellent durability and optical properties such as transparency. In addition, such physical properties are stably maintained under severe conditions. Particularly, a pressure-sensitive adhesive layer is attached to a conductor thin film, and thus resistance change of the conductor thin film is effectively inhibited even when the conductor thin film is exposed to the severe conditions. Therefore, the pressure-sensitive adhesive composition may be effectively used to manufacture a touch panel.
Abstract:
An electrically conductive, single-sided tape includes a conductive adhesive layer and a non-conductive polymeric layer positioned adjacent the conductive adhesive layer. The conductive adhesive layer includes a conductive, porous substrate having a plurality of passageways and an adhesive material positioned within at least a portion of the passageways. Optionally, the adhesive material may include a plurality of conductive particles dispersed within the adhesive material.
Abstract:
Electrically conductive particles filled in the openings are securely transferred and attached to the binder resin layer. The invention further includes a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.
Abstract:
Provided is an adhesive composition for a heat dissipating adhesive tape, the adhesive composition comprising a (meth)acrylic acid ester based photocurable resin, a thermal conductive filler, and a benzotriazole-based compound.
Abstract:
A high-refractive adhesive film includes: a thermosetting resin matrix; and high refractive particles dispersed in the thermosetting resin matrix. The refraction index of the high-refractive particles is higher than that of the thermosetting resin matrix.
Abstract:
[Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 massppm or less, preferably 50 massppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin. The epoxy (meth)acrylate resin is preferably prepared by subjecting a starting compound (substrate) having a carbon-carbon double bond to epoxidation of the double bond with an oxidizing agent consisting of hydrogen peroxide, and then subjecting the obtained epoxy compound to addition reaction with (meth)acrylic acid.
Abstract:
A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate.
Abstract:
Provided are a conductive laminate, a method of manufacturing the same, and an electronic device including the same. The conductive laminate may prevent bubbles from being generated from a pressure-sensitive adhesive layer during thermal treatment for crystallizing a conductive layer.