公开(公告)号：US08442667B2

公开(公告)日：2013-05-14

申请号：US12032733

申请日：2008-02-18

Applicant: Patrick D. Pannese

Inventor： Patrick D. Pannese

IPC: G06F19/00 ,  G06F17/00 ,  G06E1/00 ,  G06N5/00 ,  G05B13/02

CPC classification number: G05B99/00 ,  G05B15/02 ,  G05B19/41865 ,  G05B19/41885 ,  G05B23/0267 ,  G05B2219/30 ,  G05B2219/31 ,  G05B2219/31467 ,  G05B2219/31472 ,  G05B2219/32128 ,  G05B2219/32267 ,  G05B2219/32329 ,  G05B2219/32335 ,  G05B2219/32342 ,  G05B2219/32351 ,  G05B2219/35494 ,  G05B2219/40411 ,  G05B2219/40412 ,  G05B2219/40413 ,  G05B2219/40419 ,  G05B2219/40424 ,  G05B2219/45031 ,  G06T7/0004 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67742 ,  H01L21/67745 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/26 ,  Y02P90/86

Abstract: Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

Abstract translation: 用于控制异构半导体制造环境中的处理的软件可以包括以晶圆为中心的数据库，使用神经网络的实时调度器和显示系统的模拟操作的图形用户界面。 这些特征可以单独使用或组合使用以提供用于半导体制造过程的实时控制和监视的改进的可用性和计算效率。 更一般来说，这些技术可以有用地用于各种实时控制系统中，特别是需要复杂调度决策的系统或由许多独立供应商的硬件构成的异构系统。

公开(公告)号：US20130078057A1

公开(公告)日：2013-03-28

申请号：US13625704

申请日：2012-09-24

Applicant: BROOKS AUTOMATION, INC.

Inventor： Christopher Hofmeister ,  Martin R. Elliot ,  Alexander Krupyshev ,  Joseph Hallisey ,  Joseph A. Kraus ,  William Fosnight ,  Craig J. Carbone ,  Jeffrey C. Blahnik ,  Ho Yin Owen Fong

IPC: H01L21/67

CPC classification number: H01L21/67098 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67201

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

Abstract translation: 公开了一种半导体加工工具，所述工具具有框架，所述框架形成具有开口的至少一个室，并且具有围绕所述开口的周边的密封表面;门构造成与所述密封表面相互作用以密封所述开口，所述门具有侧面 垂直于所述门密封表面并垂直于衬底的传输平面的至少一个驱动器，以及位于所述框架上的至少一个侧面的至少一个驱动器，所述驱动器基本上垂直于所述门密封表面并且基本上垂直于所述传送 所述驱动器具有至少部分地位于所述密封表面前面的致动器，并且所述致动器联接到所述门的一侧以将所述门从密封位置移动。 至少一个驱动器位于衬底转移区的外部。

公开(公告)号：US08309374B2

公开(公告)日：2012-11-13

申请号：US12575088

申请日：2009-10-07

Applicant: Keith Brian Porthouse ,  Peter G. Borden ,  Tristan R. Holtam ,  Lisong Zhou ,  Ian Scott Latchford ,  Derek Aqui ,  Vinay K. Shah

Inventor： Keith Brian Porthouse ,  Peter G. Borden ,  Tristan R. Holtam ,  Lisong Zhou ,  Ian Scott Latchford ,  Derek Aqui ,  Vinay K. Shah

IPC: H01L21/00 ,  H01L21/677

CPC classification number: H01L21/67236 ,  H01L21/67069 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/67213 ,  H01L31/1876 ,  Y02E10/50 ,  Y02P70/521

Abstract: The present invention generally provides a batch substrate processing system, or cluster tool, for in-situ processing of a film stack used to form regions of a solar cell device. In one configuration, the film stack formed on each of the substrates in the batch contains one or more silicon-containing layers and one or more metal layers that are deposited and further processed within the various chambers contained in the substrate processing system. In one embodiment, a batch of solar cell substrates is simultaneously transferred in a vacuum or inert environment to prevent contamination from affecting the solar cell formation process.

Abstract translation: 本发明通常提供用于原位处理用于形成太阳能电池装置区域的薄膜叠层的批量基板处理系统或集群工具。 在一种构造中，在批次中形成在每个基板上的薄膜叠层包含一个或多个含硅层和一个或多个金属层，其在包含在基板处理系统中的各个室内被沉积和进一步处理。 在一个实施例中，一批太阳能电池基板在真空或惰性环境中同时转移，以防止污染影响太阳能电池的形成过程。

公开(公告)号：US08293066B2

公开(公告)日：2012-10-23

申请号：US12325993

申请日：2008-12-01

Applicant: Terry Bluck ,  Kevin P. Fairbairn ,  Michael S. Barnes ,  Christopher T. Lane

Inventor： Terry Bluck ,  Kevin P. Fairbairn ,  Michael S. Barnes ,  Christopher T. Lane

IPC: C23F1/00 ,  H01L21/306 ,  H01L21/677 ,  C23C16/00 ,  C23C14/00

CPC classification number: H01L21/67745 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67201

Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.

Abstract translation: 描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。 关键要素是沿着处理室的侧面使用传送室，用于通过装载锁定将基板输送到受控气氛中，然后沿着传送室作为到达处理室的方式，然后在受控气氛中进行处理 处理室。

公开(公告)号：US08257601B2

公开(公告)日：2012-09-04

申请号：US13073618

申请日：2011-03-28

Applicant: Seiichi Kaise ,  Noriyuki Iwabuchi ,  Shigeaki Kato ,  Hiroshi Nakamura ,  Takeshi Yokouchi ,  Mariko Shibata ,  Akira Obi

Inventor： Seiichi Kaise ,  Noriyuki Iwabuchi ,  Shigeaki Kato ,  Hiroshi Nakamura ,  Takeshi Yokouchi ,  Mariko Shibata ,  Akira Obi

IPC: C23F1/00

CPC classification number: H01L21/67748 ,  H01J37/32743 ,  H01L21/67201 ,  H01L21/6831

Abstract: A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.

Abstract translation: 基板处理方法用于具有基板处理装置和基板转印装置的基板处理系统。 基板处理方法包括将基板转印的基板转印步骤和对基板执行预定处理的基板处理步骤。 基板转印步骤和基板处理步骤包括多个操作，并且同时执行多个操作中的至少两个操作。 优选地，基板处理装置包括容纳室，放置在容纳室中以安装在基板上的安装台，以及用于将传热气体供应到安装在安装台上的基板之间的空间的传热气体供应管线 和安装台。

公开(公告)号：US20120195717A1

公开(公告)日：2012-08-02

申请号：US13334181

申请日：2011-12-22

Applicant: Alexander G. Krupyshev ,  John Underwood

Inventor： Alexander G. Krupyshev ,  John Underwood

IPC: H01L21/677

CPC classification number: H01L21/677 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201

Abstract: A workpiece handling module including a first housing member and a second housing member pivotally movable relative to the first member forming a housing having an access side and a second side opposite the access side and side walls, a first portion of the side walls is carried by the first member and a second portion of the side walls is carried by the second member, and at least one of the first and second housing members includes at least one sealable opening for allowing ingress and egress of workpieces to and from an interior chamber formed by the first and second housing members in a closed configuration, and the second portion of the side walls adjacent the access side and carried by the second member is greater than the first portion of the side walls adjacent the access side and carried by the first member.

Abstract translation: 一种工件处理模块，包括第一壳体构件和第二壳体构件，所述第二壳体构件可相对于第一构件枢转运动，所述第一构件形成具有入口侧的壳体和与入口侧和侧壁相对的第二侧，侧壁的第一部分由 所述第一构件和所述侧壁的第二部分由所述第二构件承载，并且所述第一和第二壳体构件中的至少一个包括至少一个可密封的开口，用于允许工件进入和离开由内部腔室形成的内部腔室 所述第一和第二壳体构件处于闭合构型，并且邻近所述进入侧并由所述第二构件承载的所述侧壁的第二部分大于邻近所述进入侧并由所述第一构件承载的所述侧壁的第一部分。

公开(公告)号：US20120156380A1

公开(公告)日：2012-06-21

申请号：US13401617

申请日：2012-02-21

Applicant: Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

Inventor： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC: B05D3/02 ,  B05D3/00

CPC classification number: H01L21/67178 ,  B05B14/43 ,  B05B14/44 ,  B05C13/00 ,  B05C13/02 ,  B05D3/0486 ,  G03F7/26 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225 ,  H01L23/34 ,  H01L2924/0002 ,  Y10S414/135 ,  H01L2924/00

Abstract: A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.

Abstract translation: 用具有分度器部分，处理部分和界面部分的基板处理装置处理基板的基板处理方法包括在设置在处理部分中的多个故事层并行地进行抗蚀剂膜形成处理，并且在 在治疗部分设置多个故事。

公开(公告)号：US20120145074A1

公开(公告)日：2012-06-14

申请号：US13401644

申请日：2012-02-21

Applicant: Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

Inventor： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC: B05C13/02

CPC classification number: H01L21/67178 ,  B05B14/43 ,  B05B14/44 ,  B05C13/00 ,  B05C13/02 ,  B05D3/0486 ,  G03F7/26 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225 ,  H01L23/34 ,  H01L2924/0002 ,  Y10S414/135 ,  H01L2924/00

Abstract: A substrate treating apparatus includes a treating block including a plurality of cells arranged one over another. Each cell has treating units for treating substrates and a single main transport mechanism for transporting the substrates to the treating units. Each cell also has a blowout unit for supplying a clean gas into a transporting space of the main transport mechanism and an exhaust unit for exhausting gas from the transporting space. The blowout unit and the exhaust unit are arranged one over the other in the transporting space to separate the transporting space of each cell from that of another cell.

Abstract translation: 一种基板处理装置，包括处理块，该处理块包括多个彼此排列的单元。 每个电池具有用于处理基板的处理单元和用于将基板输送到处理单元的单个主输送机构。 每个电池还具有用于向主输送机构的输送空间供给清洁气体的吹出单元和用于从输送空间排出气体的排气单元。 喷出单元和排气单元在传送空间中彼此重叠配置，以将每个单元的传送空间与另一个单元的传送空间分开。

公开(公告)号：US20120145073A1

公开(公告)日：2012-06-14

申请号：US13401625

申请日：2012-02-21

Applicant: Yoshiteru Fukutomi ,  Tsuyoshi MITSUHASHI ,  Hiroyuki OGURA ,  Kenya MORINISHI ,  Yasuo KAWAMATSU ,  Hiromichi NAGASHIMA

Inventor： Yoshiteru Fukutomi ,  Tsuyoshi MITSUHASHI ,  Hiroyuki OGURA ,  Kenya MORINISHI ,  Yasuo KAWAMATSU ,  Hiromichi NAGASHIMA

IPC: B05C11/00

CPC classification number: H01L21/67178 ,  B05B14/43 ,  B05B14/44 ,  B05C13/00 ,  B05C13/02 ,  B05D3/0486 ,  G03F7/26 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225 ,  H01L23/34 ,  H01L2924/0002 ,  Y10S414/135 ,  H01L2924/00

Abstract: A substrate treating apparatus includes a treating block including a plurality of cells arranged one over another. Each cell has treating units for treating substrates and a single main transport mechanism disposed in a transporting space for transporting the substrates to the treating units. The treating units include solution treating units and heat-treating units. The solution treating units are arranged at one side of the transporting space, the heat-treating units are arranged at the other side of the transporting space, and the main transport mechanism and the treating units are in substantially the same layout in plan view for the respective cells. The solution treating units are in substantially the same layout in side view for the respective cells, the heat-treating units are in substantially the same layout in side view for the respective cells, and treatments of the substrates carried out in the respective cells are the same.

Abstract translation: 一种基板处理装置，包括处理块，该处理块包括多个彼此排列的单元。 每个单元具有用于处理基板的处理单元和设置在用于将基板输送到处理单元的输送空间中的单个主输送机构。 处理单元包括溶液处理单元和热处理单元。 溶液处理单元布置在传送空间的一侧，热处理单元布置在传送空间的另一侧，主传送机构和处理单元在平面图中基本相同的布局 各自的细胞。 溶液处理单元在各个单元的侧视图中基本相同的布局，热处理单元在各个单元的侧视图中基本相同的布局，并且在各单元中执行的基板的处理是 相同。

公开(公告)号：US08197636B2

公开(公告)日：2012-06-12

申请号：US12106881

申请日：2008-04-21

Applicant: Ashish Shah ,  Dale R. DuBois ,  Ganesh Balasubramanian ,  Mark A. Fodor ,  Eui Kyoon Kim ,  Chiu Chan ,  Karthik Janakiraman ,  Thomas Nowak ,  Joseph C. Werner ,  Visweswaren Sivaramakrishnan ,  Mohamad Ayoub ,  Amir Al-Bayati ,  Jianhua Zhou

Inventor： Ashish Shah ,  Dale R. DuBois ,  Ganesh Balasubramanian ,  Mark A. Fodor ,  Eui Kyoon Kim ,  Chiu Chan ,  Karthik Janakiraman ,  Thomas Nowak ,  Joseph C. Werner ,  Visweswaren Sivaramakrishnan ,  Mohamad Ayoub ,  Amir Al-Bayati ,  Jianhua Zhou

IPC: C23F1/00 ,  C23C16/00 ,  H01L21/306

CPC classification number: H01L21/6719 ,  H01J37/32366 ,  H01J2237/3321 ,  H01L21/67201 ,  H01L21/67207

Abstract: Embodiments described herein relate to a substrate processing system that integrates substrate edge processing capabilities. Illustrated examples of the processing system include, without limitations, a factory interface, a loadlock chamber, a transfer chamber, and one or more twin process chambers having two or more processing regions that are isolatable from each other and share a common gas supply and a common exhaust pump. The processing regions in each twin process chamber include separate gas distribution assemblies and RF power sources to provide plasma at selective regions on a substrate surface in each processing region. Each twin process chamber is thereby configured to allow multiple, isolated processes to be performed concurrently on at least two substrates in the processing regions.

Abstract translation: 本文所述的实施例涉及集成衬底边缘处理能力的衬底处理系统。 处理系统的说明性示例包括但不限于工厂接口，负载锁定室，传送室和具有两个或更多个处理区域的一个或多个双处理室，其可彼此隔离并且共享公共气体供应和 普通排气泵。 每个双处理室中的处理区域包括单独的气体分配组件和RF功率源，以在每个处理区域的衬底表面上的选择性区域提供等离子体。 因此，每个双处理室被配置为允许在处理区域中的至少两个基板上同时执行多个隔离过程。