公开(公告)号：US20020190038A1

公开(公告)日：2002-12-19

申请号：US10100505

申请日：2002-03-18

Applicant: Laser Machining, Inc.

Inventor： William E. Lawson

IPC: B23K026/00

CPC classification number: H05K3/0032 ,  B23K26/361 ,  B23K2103/42 ,  B23K2103/50 ,  H05K2201/0112

Abstract: A method of ablating a polymeric substrate by laser means, wherein the laser means emits a laser having a selected wavelength dependant upon the polymeric substrate, and wherein at least 70% of the incident power from the laser means absorbs within 0.001 inches of the polymeric substrate.

Abstract translation: 一种通过激光装置消融聚合物基底的方法，其中激光装置发射具有选定波长的激光，取决于聚合物基底，并且其中来自激光装置的至少70％的入射光吸收在聚合物基底的0.001英寸内 。

公开(公告)号：US20020175396A1

公开(公告)日：2002-11-28

申请号：US10099193

申请日：2002-03-13

Inventor： Hiroshi Ogura ,  Yoshikazu Yoshida

IPC: H01L021/44 ,  H01L023/495 ,  H01L023/053

CPC classification number: H05K3/0032 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/16152 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0112 ,  H05K2201/0209 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A dielectric substrate for laser working contains a substance having a size of a half to 10 times of a laser light wavelength and different in refractive index from a material of the dielectric substrate. This substance enhances the absorption of a laser beam. Due to this, the energy loss in laser beam is transformed into the heat of fusion to form a penetration hole, thereby forming a well-formed penetration hole. The substance different in refractive index from the dielectric substrate material uses bubbles when the dielectric substrate is a quartz glass substrate, and a glass bead or fiber when it is a resin substrate.

Abstract translation: 用于激光加工的电介质基板包含尺寸为激光波长的一半至10倍的物质，并且与介质基板的材料的折射率不同的物质。 该物质增强了激光束的吸收。 由此，将激光束的能量损失变换为熔融热，形成贯通孔，形成良好的贯通孔。 当电介质基板是石英玻璃基板时，折射率与电介质基板材料不同的物质使用气泡，当玻璃珠或纤维是树脂基板时，使用气泡。

公开(公告)号：US5919868A

公开(公告)日：1999-07-06

申请号：US898285

申请日：1997-07-22

Applicant: Francis Charles Burns ,  William Weathers Fleming ,  Victor Yee-Way Lee

Inventor： Francis Charles Burns ,  William Weathers Fleming ,  Victor Yee-Way Lee

IPC: C07C315/04 ,  C07C317/36 ,  C08F20/34 ,  C08F20/38 ,  C08F220/06 ,  C08F220/10 ,  C08F220/34 ,  C08F220/38 ,  C09D133/04 ,  C09D133/06 ,  C09D133/14 ,  G03F1/00 ,  G03F7/039 ,  G03F7/20 ,  H01L21/027 ,  H01L23/498 ,  H05K3/00 ,  H05K3/18 ,  C08F8/30 ,  C08F8/38 ,  C08F120/10

CPC classification number: G03F7/202 ,  C07C315/04 ,  G03F7/039 ,  G03F7/2053 ,  H01L23/49894 ,  H05K3/0082 ,  H05K3/184 ,  H01L2924/0002 ,  H05K2201/0112 ,  H05K3/0032 ,  Y10S428/901 ,  Y10S430/106 ,  Y10S430/111 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/31678

Abstract: The present invention provides an ablatively photodecomposable polymer having a photoabsorber bound to the polymer (the "ablatively photodecomposable polymer") which does not phase separate, nor does it crystallize. The ablatively photodecomposable polymer provides even ablation, high resolution and in preferred embodiments, can withstand potassium permanganate etchant and ferric chloride etchant. The ablatively photodecomposable polymer is strippable, although it can remain on the substrate if desired. The ablatively photodecomposable polymer comprises a polymer to which a photoabsorber is bound, either covalently or ionically. The present invention is also directed to a process for forming a metal pattern on a substrate employing the ablatively photodecomposable polymer.

公开(公告)号：US5917704A

公开(公告)日：1999-06-29

申请号：US944700

申请日：1997-10-06

Applicant: John Trublowski ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II ,  Bernard Allen Meyer

Inventor： John Trublowski ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II ,  Bernard Allen Meyer

IPC: H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H05K3/34 ,  H05K7/20

CPC classification number: H01L23/4334 ,  H01L23/3121 ,  H05K3/341 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0206 ,  H05K2201/0112 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/107 ,  H05K3/3452 ,  H05K3/3494 ,  Y02P70/613

Abstract: There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20. The component 10 has a top surface 30, a bottom surface 32 generally parallel to the top surface, and at least one perimeter outer surface 34 generally orthogonal to and between the top and bottom surfaces. The component 10 comprises: a circuit portion 12; at least one termination 14 connected to the circuit portion 12 and extending outward therefrom; a heat spreader 16 portion situated generally beneath and in thermal contact with the circuit portion 12; and a body portion 18 enclosing at least a top surface of the circuit portion 12 and a part of each termination 14 proximate the circuit portion 12. The heat spreader 16 defines at least part of the bottom surface 32 of the electronic component 10 and at least part of the at least one perimeter outer surface 34 of the electronic component 10.

Abstract translation: 这里公开了一种具有整体散热器16的电子部件10，其特别设计用于辅助将散热器激光焊接到衬底20上的焊盘22上。部件10具有顶表面30，大体平行的底表面32 至少一个周边外表面34，大体上垂直于顶表面和底表面之间。 部件10包括：电路部分12; 连接到电路部分12并从其向外延伸的至少一个终端14; 位于通常在电路部分12下方并与电路部分12热接触的散热器16部分; 以及封闭电路部分12的至少顶表面的主体部分18和靠近电路部分12的每个端接件14的一部分。散热器16限定电子部件10的至少一部分底表面32，并且至少 电子部件10的至少一个周边外表面34的一部分。

公开(公告)号：US5910390A

公开(公告)日：1999-06-08

申请号：US813945

申请日：1997-03-03

Applicant: Hideyuki Hatanaka ,  Keita Miyasato

Inventor： Hideyuki Hatanaka ,  Keita Miyasato

IPC: G03F7/004 ,  G03F7/027 ,  G03F7/20 ,  G03F7/30 ,  H05K3/00 ,  H05K3/10 ,  H05K3/28 ,  G03F7/00

CPC classification number: H05K3/28 ,  G03F7/2051 ,  H05K3/0082 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/09881 ,  H05K2203/0551

Abstract: A method for forming a resin pattern which includes selectively polymerizing a photopolymerizable resin utilizing a light radiated from a photosensitive substance to form a desired resin pattern. A photosensitive substance layer is formed in a desired pattern on a substrate (or in a substrate when it is light permeable). The photosensitive substance absorbs an irradiation light and radiates a light of a longer wavelength than that of the irradiation light. A photopolymerizable resin layer formed on the substrate is not activated by the irradiation light but is activated by the light radiated from the photosensitive substance. The photopolymerizable resin layer is irradiated with an irradiation light capable of exciting the photosensitive substance and the photo-polymerizable resin is polymerized in the pattern of the photosensitive substance layer with the light radiated from the photosensitive substance.

Abstract translation: 一种用于形成树脂图案的方法，其包括使用从感光物质辐射的光选择性聚合光聚合树脂以形成所需的树脂图案。 感光性物质层以所需图案形成在基板上（或在透光性基板上）。 感光物质吸收照射光并照射比照射光的波长更长的光。 形成在基板上的可光聚合树脂层不被照射光激活，而是被从感光物质辐射的光激活。 用能够激发感光性物质的照射光照射光聚合性树脂层，并且光敏物质层的图案与从光敏物质辐射的光聚合。

公开(公告)号：US5910255A

公开(公告)日：1999-06-08

申请号：US748105

申请日：1996-11-08

Applicant: David B. Noddin

Inventor： David B. Noddin

IPC: H01L21/48 ,  H05K3/00 ,  H05K3/46 ,  B44C1/22

CPC classification number: H01L21/486 ,  H05K3/0035 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K2201/0112 ,  H05K2203/0554 ,  H05K2203/108 ,  H05K2203/1383 ,  H05K3/4652 ,  Y10T428/24917

Abstract: A method for forming a blind-via in a laminated substrate by laser drilling a blind-via from a top surface of the substrate toward a bottom surface of the substrate using a first laser and a first trepanning motion of a laser focal spot of the first laser. Then, the via is laser drilled from the top surface toward the bottom surface using a second laser and a second trepanning motion of a laser focal spot of the second laser.

Abstract translation: 一种通过使用第一激光从第一激光器和第一激光器的激光焦斑的第一激光器激光钻孔基板朝向基板的底表面的盲通孔而在层叠基板中形成盲通孔的方法， 激光。 然后，使用第二激光器的第二激光器和第二激光器的激光焦点的第二次扫描运动，从顶表面朝向底表面激光钻孔。

公开(公告)号：US5829125A

公开(公告)日：1998-11-03

申请号：US698163

申请日：1996-08-07

Applicant: Masayuki Fujimoto ,  Matsuo Nakazawa ,  Hiroshi Takahashi ,  Kazutaka Suzuki ,  Koichiro Isuzuku

Inventor： Masayuki Fujimoto ,  Matsuo Nakazawa ,  Hiroshi Takahashi ,  Kazutaka Suzuki ,  Koichiro Isuzuku

IPC: B23K1/005 ,  H01L21/60 ,  H01L23/13 ,  H01L23/485 ,  H01L25/18 ,  H05K3/34

CPC classification number: H01L23/13 ,  B23K1/0056 ,  H01L24/05 ,  H01L24/81 ,  H01L25/18 ,  H05K3/3494 ,  H01L2224/0401 ,  H01L2224/05011 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05566 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/05609 ,  H01L2224/05613 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/08057 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14155 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75262 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/81385 ,  H01L2224/81405 ,  H01L2224/81409 ,  H01L2224/81413 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/8184 ,  H01L2224/81868 ,  H01L2224/81874 ,  H01L2224/83224 ,  H01L24/13 ,  H01L24/75 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/351 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2203/107 ,  H05K3/3431 ,  Y10T29/49144

Abstract: The present invention relates to a method of manufacturing a circuit module through the use of a wireless bonding technique. In this invention, in order to achieve component assembly without experiencing thermal and mechanical stresses, in the circuit module manufacturing method in which an external electrode of a component and a conductor of a substrate are connected with each other according to the wireless bonding technique, the substrate has a laser beam transmissible property, and after the component is placed on an assembly surface of the substrate, a laser beam is applied from a surface of the substrate opposite to the assembly surface thereof to a connecting spot. The laser beam passing through the substrate heats the connecting spot so that the connection between the external electrode of the component and the conductor of the substrate is made by phase transition or diffusion.

Abstract translation: 本发明涉及通过使用无线接合技术制造电路模块的方法。 在本发明中，为了实现不经受热和机械应力的部件组装，在根据无线接合技术将部件的外部电极和基板的导体彼此连接的电路模块制造方法中， 基板具有激光束透射性质，并且在将部件放置在基板的组装表面上之后，将激光束从与其组装表面相对的基板的表面施加到连接点。 通过基板的激光束加热连接点，使得部件的外部电极与基板的导体之间的连接通过相变或扩散来制造。

公开(公告)号：US5705570A

公开(公告)日：1998-01-06

申请号：US476760

申请日：1995-06-07

Applicant: Francis Charles Burns ,  William Weathers Fleming ,  Victor Yee-Way Lee ,  Randy William Snyder

Inventor： Francis Charles Burns ,  William Weathers Fleming ,  Victor Yee-Way Lee ,  Randy William Snyder

IPC: C07C315/04 ,  C07C317/36 ,  C08F20/34 ,  C08F20/38 ,  C08F220/06 ,  C08F220/10 ,  C08F220/34 ,  C08F220/38 ,  C09D133/04 ,  C09D133/06 ,  C09D133/14 ,  G03F1/00 ,  G03F7/039 ,  G03F7/20 ,  H01L21/027 ,  H01L23/498 ,  H05K3/00 ,  H05K3/18 ,  C08F220/02 ,  C08F226/00

CPC classification number: G03F7/202 ,  C07C315/04 ,  G03F7/039 ,  G03F7/2053 ,  H01L23/49894 ,  H05K3/0082 ,  H05K3/184 ,  H01L2924/0002 ,  H05K2201/0112 ,  H05K3/0032 ,  Y10S428/901 ,  Y10S430/106 ,  Y10S430/111 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/31678

Abstract: The present invention provides an ablatively photodecomposable polymer having a photoabsorber bound to the polymer (the "ablatively photodecomposable polymer") which does not phase separate, nor does it crystallize. The ablatively photodecomposable polymer provides even ablation, high resolution and in preferred embodiments, can withstand potassium permanganate etchant and ferric chloride etchant. The ablatively photodecomposable polymer is strippable, although it can remain on the substrate if desired. The ablatively photodecomposable polymer comprises a polymer to which a photoabsorber is bound, either covalently or ionically. The present invention is also directed to a process for forming a metal pattern on a substrate employing the ablatively photodecomposable polymer.

公开(公告)号：US5672760A

公开(公告)日：1997-09-30

申请号：US629649

申请日：1996-04-09

Applicant: Francis Charles Burns ,  William Weathers Fleming ,  Victor Yee-Way Lee ,  Randy William Snyder

Inventor： Francis Charles Burns ,  William Weathers Fleming ,  Victor Yee-Way Lee ,  Randy William Snyder

IPC: C07C315/04 ,  C07C317/36 ,  C08F20/34 ,  C08F20/38 ,  C08F220/06 ,  C08F220/10 ,  C08F220/34 ,  C08F220/38 ,  C09D133/04 ,  C09D133/06 ,  C09D133/14 ,  G03F1/00 ,  G03F7/039 ,  G03F7/20 ,  H01L21/027 ,  H01L23/498 ,  H05K3/00 ,  H05K3/18 ,  C07C317/32

CPC classification number: G03F7/202 ,  C07C315/04 ,  G03F7/039 ,  G03F7/2053 ,  H01L23/49894 ,  H05K3/0082 ,  H05K3/184 ,  H01L2924/0002 ,  H05K2201/0112 ,  H05K3/0032 ,  Y10S428/901 ,  Y10S430/106 ,  Y10S430/111 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/31678

Abstract: The present invention provides an ablatively photodecomposable polymer having a photoabsorber bound to the polymer (the "ablatively photodecomposable polymer") which does not phase separate, nor does it crystallize. The ablatively photodecomposable polymer provides even ablation, high resolution and in preferred embodiments, can withstand potassium permanganate etchant and ferric chloride etchant. The ablatively photodecomposable polymer is strippable, although it can remain on the substrate if desired. The ablatively photodecomposable polymer comprises a polymer to which a photoabsorber is bound, either covalently or ionically. The present invention is also directed to a process for forming a metal pattern on a substrate employing the ablatively photodecomposable polymer.

Abstract translation: 本发明提供了一种具有与聚合物结合的光吸收剂的可消光的可光分解聚合物（“可消融的光可分解聚合物”），其不相分离，也不结晶。 可消融的可光解聚合物提供均匀的消融，高分辨率，并且在优选的实施方案中，可以耐受高锰酸钾蚀刻剂和氯化铁蚀刻剂。 可消融的可光解聚合物是可剥离的，但如果需要，其可以保留在基材上。 可消融的可光分解的聚合物包含与光吸收剂结合的共价或离子的聚合物。 本发明还涉及使用可消光的可光解聚合物在基材上形成金属图案的方法。

公开(公告)号：US5274210A

公开(公告)日：1993-12-28

申请号：US25197

申请日：1993-03-02

Applicant: Gary M. Freedman ,  Maurice P. Brodeur ,  Peter J. Elmgren

Inventor： Gary M. Freedman ,  Maurice P. Brodeur ,  Peter J. Elmgren

IPC: B23K1/005 ,  B23K26/18 ,  H05K3/34 ,  B23K26/00

CPC classification number: B23K26/18 ,  B23K1/0056 ,  H05K3/3421 ,  B23K2201/40 ,  H05K2201/0112 ,  H05K2201/09781 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2203/107 ,  H05K3/3494 ,  Y02P70/613

Abstract: This disclosure relates to laser bonding electrical components having conductive elements which are naturally reflective of the laser beam wavelength. Component leads or pads which are made of copper or have a gold coating, for example, will reflect the wavelength of an Nd:YAG laser, making it difficult to form physical and electrical bonds using the laser bonding technique. In preferred embodiments, the conductive elements are coated with a non-flux, non-metallic, coating material which is less reflective of the laser energy than the conductive elements, making it possible to efficiently use a laser to accomplish bonding.

Abstract translation: 本公开涉及具有天然反射激光束波长的导电元件的激光键合电气部件。 例如，由铜制成或具有金涂层的部件引线或焊盘将反映Nd：YAG激光器的波长，使得难以使用激光焊接技术形成物理和电连接。 在优选实施例中，导电元件涂覆有非导通的非金属涂层材料，其比导电元件更少地反映激光能量，使得可以有效地使用激光来实现粘合。