公开(公告)号：US20150237737A1

公开(公告)日：2015-08-20

申请号：US14342288

申请日：2013-11-11

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Hideta Arai ,  Atsushi Miki ,  Kohsuke Arai ,  Kaichiro Nakamuro

IPC: H05K3/02 ,  H05K1/02 ,  H05K3/36 ,  H05K1/14 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/022 ,  C25D1/04 ,  C25D7/0614 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/14 ,  H05K3/361 ,  H05K3/384 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/05 ,  H05K2201/058 ,  Y10T29/49126 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following ΔB (PI) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a CCD camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil.

Abstract translation: 一种表面处理的铜箔，其良好地结合到树脂上，并且当通过树脂观察时可以获得良好的可见性，并且提供使用其的层压体。 在层压到铜箔上之前，将层压在具有50以上且65以下的Dgr。B（PI）的聚酰亚胺的表面处理铜箔上形成覆铜层压板，其包含具有色差的表面 ＆Dgr; E * ab为50以上，基于JIS Z 8730通过聚酰亚胺，并且从铜箔边缘延伸到不具有铜箔的部分的亮度曲线中的顶部平均Bt和底部平均Bb之间的差异Dgr ; B（＆Dgr; B = Bt-Bb）为40以上，其中，从通过从表面层压的聚酰亚胺的铜箔的拍摄图像的亮度的测量结果的观察点与亮度曲线获得亮度曲线 用CCD照相机，沿着观察到的铜箔的延伸方向的垂直方向对各观察点进行处理。

公开(公告)号：US20150228568A1

公开(公告)日：2015-08-13

申请号：US14693995

申请日：2015-04-23

Applicant: NANTONG FUJITSU MICROELECTRONICS CO., LTD.

Inventor： LEI SHI ,  YUJUAN TAO

IPC: H01L23/498 ,  H05K1/11 ,  H05K1/18 ,  H01L23/31 ,  H05K1/03

CPC classification number: H01L23/49822 ,  H01L21/50 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/23 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/85005 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A fan-out high-density packaging method includes providing a packaging substrate, forming a stripping film on the packaging substrate, and forming a first protection layer on the stripping film and pre-designed photolithography pattern openings on the first protection layer. The method also includes forming a metal redistribution layer on the surface of the first protection layer and in the photolithography pattern openings, forming a second protection layer on the first protection layer and partially exposing the metal redistribution layer, and forming at least one package layer on the second protection layer. Each of at least one package layer includes a straight mounting layer, a sealant layer, and a wiring layer formed in sequence, and the package layer connects the metal redistribution layer through the wiring layer. Further, the method includes forming at least one top-level package layer on top of the at least one package layer, removing the packaging substrate and the stripping film to expose the metal redistribution layer in the first protection layer, and planting metal solder balls on the exposed metal redistribution layer.

Abstract translation: 扇出式高密度封装方法包括提供封装衬底，在封装衬底上形成剥离膜，以及在剥离膜上形成第一保护层，并在第一保护层上形成预先设计的光刻图案孔。 该方法还包括在第一保护层的表面上和在光刻图案开口中形成金属再分配层，在第一保护层上形成第二保护层，并部分地暴露金属再分布层，并且形成至少一个封装层 第二保护层。 至少一个封装层中的每一个包括依次形成的直的安装层，密封剂层和布线层，并且封装层通过布线层连接金属再分配层。 此外，该方法包括在至少一个封装层的顶部上形成至少一个顶层封装层，去除封装衬底和剥离膜以暴露第一保护层中的金属再分配层，并将金属焊球放置在 暴露的金属再分配层。

公开(公告)号：US20150197073A1

公开(公告)日：2015-07-16

申请号：US14409946

申请日：2013-06-21

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： G Sidney Cox ,  Christopher Dennis Simone ,  Carl Robert Haeger

IPC: B32B15/08 ,  B32B15/20 ,  B32B27/28 ,  B32B37/10

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/281 ,  B32B37/04 ,  B32B37/10 ,  B32B2037/0092 ,  B32B2264/102 ,  B32B2307/204 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/4026 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/12 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/00 ,  B32B2457/08 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1067 ,  H05K1/0346 ,  H05K3/022 ,  H05K3/281 ,  H05K2201/0154 ,  H05K2201/0323 ,  Y10T428/266 ,  Y10T428/31681

Abstract: The present disclosure is directed to a polyimide metal clad laminate. The metal clad laminate has a metal foil and a polyimide layer. The polyimide layer having a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, and 100 mole % 2,2′-bis(trifluoromethyl)benzidine. The polyimide metal clad laminate does not have an adhesive layer between the metal foil and the polyimide layer.

Abstract translation: 本公开涉及聚酰亚胺金属包覆层压板。 金属箔层压板具有金属箔和聚酰亚胺层。 聚酰亚胺层具有衍生自100摩尔％3,3'，4,4'-联苯四羧酸二酐和100摩尔％2,2'-双（三氟甲基）联苯胺的聚酰亚胺。 聚酰亚胺金属包覆层压板在金属箔和聚酰亚胺层之间不具有粘合剂层。

公开(公告)号：US20150181706A1

公开(公告)日：2015-06-25

申请号：US14643230

申请日：2015-03-10

Applicant: Texas Instruments Incorporated

Inventor： Thomas Dyer BONIFIELD ,  Byron WILLIAMS ,  Shrinivasan JAGANATHAN ,  David LARKIN ,  Dhaval Atul SARAIYA

IPC: H05K1/03 ,  H05K1/16 ,  H05K1/11 ,  H05K1/09

CPC classification number: H01L23/5223 ,  H01L23/49811 ,  H01L23/5227 ,  H01L23/528 ,  H01L23/53228 ,  H01L23/5329 ,  H01L23/538 ,  H01L23/62 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/02166 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/14335 ,  H05K1/0256 ,  H05K1/0257 ,  H05K1/0262 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/112 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0088 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0175 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/0949 ,  H05K2201/09672 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors.

公开(公告)号：US20150119534A1

公开(公告)日：2015-04-30

申请号：US14583009

申请日：2014-12-24

Applicant: Hisayasu KANESHIRO ,  Toshihisa Itoh ,  Kiyokazu Akahori

Inventor： Hisayasu KANESHIRO ,  Toshihisa Itoh ,  Kiyokazu Akahori

IPC: B29C41/28 ,  C08J5/18

CPC classification number: C08J5/18 ,  B29C41/003 ,  B29C41/24 ,  B29C41/28 ,  B29C41/46 ,  B29D7/01 ,  B29K2079/08 ,  B29K2105/0005 ,  B29K2105/0014 ,  B29L2007/008 ,  C08J2379/08 ,  C09D179/08 ,  H05K2201/0154 ,  Y10T428/31721

Abstract: A process includes the steps of: casting or coating a polyamic acid organic solvent solution on a support and drying the polyamic acid organic solvent solution thereon, so as to form a partially cured and/or partially dried polyamic acid film; dipping the polyamic acid film in tertiary amine or a solution of tertiary amine, or coating tertiary amine or a solution of tertiary amine on the polyamic acid film; and drying the film while imidizing the polyamic acid. In another process, a chemical converting agent and a catalyst are mixed in an organic solvent solution of polyamic acid. After casting and heating the mixture on a support, a partially cured and/or partially dried polyamic acid film is detached from the support. The film contains, with respect to the remaining volatile component, not less than 50 parts of catalyst, not more than 30 parts of solvent, and not more than 20 parts of chemical converting agent and/or a chemical converting agent derived component. The remaining amic acid is imidized and the film is dried.

公开(公告)号：US09006584B2

公开(公告)日：2015-04-14

申请号：US13960406

申请日：2013-08-06

Applicant: Texas Instruments Incorporated

Inventor： Thomas Dyer Bonifield ,  Byron Williams ,  Shrinivasan Jaganathan ,  David Larkin ,  Dhaval Atul Saraiya

IPC: H05K1/16 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00

CPC classification number: H01L23/5223 ,  H01L23/49811 ,  H01L23/5227 ,  H01L23/528 ,  H01L23/53228 ,  H01L23/5329 ,  H01L23/538 ,  H01L23/62 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/02166 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/14335 ,  H05K1/0256 ,  H05K1/0257 ,  H05K1/0262 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/112 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0088 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0175 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/0949 ,  H05K2201/09672 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors.

Abstract translation: 电子隔离装置形成在单片基板上并且包括多个被动隔离部件。 隔离元件形成三个金属层。 通过无机PMD层将第一金属层与整体式衬底分离。 第二金属层与第一金属层分开一层二氧化硅。 第三金属层与第二金属层相隔至少20微米的聚酰亚胺或PBO。 隔离组件包括用于连接到其他设备的第三金属层上的焊盘。 在第三金属层上形成介电层，露出粘合垫。 隔离器件不含晶体管。

公开(公告)号：US20150053465A1

公开(公告)日：2015-02-26

申请号：US14517672

申请日：2014-10-17

Applicant: Honeywell International Inc.

Inventor： Daniel Youngner ,  Son Thai Lu ,  Helen Chanhvongsak ,  Lisa Lust ,  Douglas Carlson

IPC: H05K3/46 ,  H05K3/30 ,  H05K3/06 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4644 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/115 ,  H05K1/167 ,  H05K3/0058 ,  H05K3/06 ,  H05K3/061 ,  H05K3/24 ,  H05K3/30 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/4682 ,  H05K2201/0104 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2201/0394 ,  H05K2203/016 ,  H05K2203/0165 ,  H05K2203/0271

Abstract: An approach for making thin flexible circuits. A layer of dielectric may have one or two surfaces coated with metal. The dielectric and the metal may each have a sub-mil thickness. The dielectric may be held in a fixture for fabrication like that of integrated circuits. The metal may be patterned and have components attached. More layers of dielectric and patterned metal may be added to the flexible circuit. Also bond pads and connecting vias may be fabricated in the flexible circuit. The flexible circuit may be cut into a plurality of smaller flexible circuits.

公开(公告)号：US20150041190A1

公开(公告)日：2015-02-12

申请号：US13960406

申请日：2013-08-06

Applicant: Texas Instruments Incorporated

Inventor： Thomas Dyer BONIFIELD ,  Byron WILLIAMS ,  Shrinivasan JAGANATHAN ,  David LARKIN ,  Dhaval Atul SARAIYA

IPC: H05K1/03 ,  H05K1/16 ,  H05K3/00 ,  H05K1/09

CPC classification number: H01L23/5223 ,  H01L23/49811 ,  H01L23/5227 ,  H01L23/528 ,  H01L23/53228 ,  H01L23/5329 ,  H01L23/538 ,  H01L23/62 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/02166 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/14335 ,  H05K1/0256 ,  H05K1/0257 ,  H05K1/0262 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/112 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0088 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0175 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/0949 ,  H05K2201/09672 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors.

Abstract translation: 电子隔离装置形成在单片基板上并且包括多个被动隔离部件。 隔离元件形成三个金属层。 通过无机PMD层将第一金属层与整体式衬底分离。 第二金属层与第一金属层分开一层二氧化硅。 第三金属层与第二金属层相隔至少20微米的聚酰亚胺或PBO。 隔离组件包括用于连接到其他设备的第三金属层上的焊盘。 在第三金属层上形成介电层，露出粘合垫。 隔离器件不含晶体管。

公开(公告)号：US20150038039A1

公开(公告)日：2015-02-05

申请号：US13956884

申请日：2013-08-01

Applicant: ITEQ CORPORATION

Inventor： Chao-Hui KUO ,  Ming-Hung HUANG ,  Po-Hsun LEE ,  Shun-Cheng WANG

IPC: C09D151/00 ,  H05K1/03 ,  B05D3/02

CPC classification number: H05K1/0353 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2307/206 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2203/1168 ,  Y10T428/249921 ,  Y10T442/2992

Abstract: The invention provides a method for manufacturing an organic-inorganic hybrid material film. The method mainly comprises hybridization of polymaleic anhydride-polyimide and silica by sol-gel route and by using a silane coupling agent to produce a structure of polymaleic anhydride-polyimide having silane, then casting and curing to form a material film. Also, the invention provides a polymaleic anhydride-polyimide-silica organic-inorganic hybrid material film.

Abstract translation: 本发明提供一种制造有机 - 无机混合材料膜的方法。 该方法主要包括通过溶胶 - 凝胶法混合聚马来酸酐 - 聚酰亚胺和二氧化硅，并通过使用硅烷偶联剂制备具有硅烷的聚马来酸酐 - 聚酰亚胺的结构，然后浇铸和固化形成材料膜。 此外，本发明提供聚马来酸酐 - 聚酰亚胺 - 二氧化硅有机 - 无机混合材料膜。

公开(公告)号：US20150027627A1

公开(公告)日：2015-01-29

申请号：US14513421

申请日：2014-10-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Dek Gin YANG

IPC: H05K3/00 ,  H05K3/02

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/118 ,  H05K3/0026 ,  H05K3/0058 ,  H05K3/02 ,  H05K3/027 ,  H05K3/285 ,  H05K3/4644 ,  H05K3/4691 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T156/1082

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Abstract translation: 一种刚性柔性印刷电路板的制造方法，其特征在于，包括：在一个或两个表面上提供具有第一金属层的第一柔性膜; 通过图案化所述第一金属层形成电路图案; 在所述第一柔性膜的一个或两个表面上形成第二柔性膜，所述第二柔性膜在一个表面上具有第二金属层; 通过在刚性区域R中图案化第二金属层来形成电路图案; 在柔性区域F中的第二金属层上提供抗氧化保护层; 在所述第二柔性膜上层叠至少一个电路层; 并移除柔性区域F中的电路层。