公开(公告)号：US07827680B2

公开(公告)日：2010-11-09

申请号：US10751428

申请日：2004-01-06

Applicant: Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

Inventor： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

IPC: H05K3/20

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10-12 seconds.

Abstract translation: 描述了对导电基板进行电镀的电镀工艺。 该工艺包括通过在阴极和阳极之间重复施加电压并使阴极和阳极之间的电压中断，在阳极和阴极之间以恒定电压将衬底表面作为阴极和电镀金属作为阳极间歇地电镀到预定的镀层厚度 交替应用。 描述了电压时间/中断时间比为0.1至1.0，电压时间不长于10秒，并且中断时间不小于1×10-12秒。

公开(公告)号：US20100255742A1

公开(公告)日：2010-10-07

申请号：US12501858

申请日：2009-07-13

Applicant: Geum Hee YUN ,  Jun Rok OH ,  Sang Jun YOON

Inventor： Geum Hee YUN ,  Jun Rok OH ,  Sang Jun YOON

IPC: B32B27/04 ,  B32B15/00 ,  B32B27/00 ,  B32B27/20 ,  B32B15/09 ,  B32B15/08

CPC classification number: H05K1/036 ,  B32B5/024 ,  B32B15/08 ,  B32B15/12 ,  B32B15/14 ,  B32B27/08 ,  B32B27/10 ,  B32B27/12 ,  B32B27/20 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/322 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/107 ,  B32B2264/108 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/536 ,  B32B2307/54 ,  B32B2307/714 ,  B32B2307/718 ,  B32B2307/72 ,  B32B2307/7265 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2590/00 ,  B32B2605/00 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0323 ,  Y10T428/31544 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T442/2475 ,  H01L2924/00014

Abstract: Disclosed is a heat radiation substrate, which includes a hybrid layer made of a thermoplastic resin, in particular, a liquid crystal polymer, and thus is lightweight and small thanks to the inherent properties of plastic and also is able to be mass produced, thus reducing the material and process costs.

Abstract translation: 公开了一种散热基板，其包括由热塑性树脂制成的混合层，特别是液晶聚合物，因此由于塑料的固有性质而重量轻，并且能够大量生产，从而减少 材料和工艺成本。

公开(公告)号：US20100243107A1

公开(公告)日：2010-09-30

申请号：US12796905

申请日：2010-06-09

Applicant: Richard K. Schmid ,  Jacobus C. Doesburg

Inventor： Richard K. Schmid ,  Jacobus C. Doesburg

IPC: B23K35/24

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: A solder composition for forming a solder joint. The composition includes a powder material including a solid metal matrix material and a filler material. The solid metal matrix material includes one or more of tin-silver-copper (Sn—Ag—Cu), tin-copper (Sn—Cu), tin-copper-nickel (Sn—Cu—Ni), tin-silver (Sn—Ag), tin-silver-bismuth (Sn—Ag—Bi), tin-bismuth-indium (Sn—Bi—In), tin-gold (Au—Sn), tin-zinc (Sn—Zn), tin-zinc-bismuth (Sn—Zn—Bi), tin-bismuth-silver (Sn—Bi—Ag), tin (Sn), tin-indium (Sn—In), indium (In), indium-silver (In—Ag), and tin-lead (Sn—Pb). The filler material includes one or more of copper (Cu), gold (Au), nickel (Ni), nickel-gold (Ni—Au), carbon, silver (Ag), aluminum (Al), molybdenum (Mo), nickel (Ni) or nickel-gold (Ni—Au) coated carbon, the platinum group metals (PGM's), and their alloys

Abstract translation: 用于形成焊点的焊料组合物。 组合物包括包含固体金属基质材料和填充材料的粉末材料。 固体金属基体材料包括锡 - 银 - 铜（Sn-Ag-Cu），锡 - 铜（Sn-Cu），锡 - 铜 - 镍（Sn-Cu-Ni），锡 - 银（Sn （Sn-Bi-In），锡 - 金（Au-Sn），锡 - 锌（Sn-Zn），锡 - 铋 - 锡（Sn-Ag-Bi） （Sn-Zn-Bi），锡 - 铋 - 银（Sn-Bi-Ag），锡（Sn），锡 - 铟（Sn-In），铟（In），铟 - 银 ）和锡铅（Sn-Pb）。 填充材料包括铜（Cu），金（Au），镍（Ni），镍 - 金（Ni-Au），碳，银（Ag），铝（Al），钼（Mo） （Ni）或镍 - 金（Ni-Au）涂覆的碳，铂族金属（PGM's）及其合金

公开(公告)号：US07700476B2

公开(公告)日：2010-04-20

申请号：US11602914

申请日：2006-11-20

Applicant: Daewoong Suh ,  Stephen E. Lehman, Jr. ,  Mukul Renavikar

Inventor： Daewoong Suh ,  Stephen E. Lehman, Jr. ,  Mukul Renavikar

IPC: H01L21/44

CPC classification number: H05K3/3484 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/11 ,  H01L2224/11822 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/81011 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H05K3/244 ,  H05K3/3436 ,  H05K2201/0215 ,  H05K2201/0341 ,  H05K2203/0435 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract translation: 描述了一种微电子组件及其制造方法。 在一个示例中，微电子组件包括具有一个或多个区域以接收一个或多个焊球的表面的微电子器件，所述一个或多个区域具有包括Ni的表面光洁度。 将包含Cu的焊料材料（例如焊剂或糊料）施加到Ni表面光洁度上，并且一个或多个焊球通过在一个或多个焊球之间形成焊料接头的回流工艺耦合到微电子器件，焊料 包含Cu的材料，并且所述一个或多个区域具有包括Ni的表面光洁度。

公开(公告)号：US07691189B2

公开(公告)日：2010-04-06

申请号：US11736495

申请日：2007-04-17

Applicant: Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

Inventor： Honchin En ,  Tohru Nakai ,  Takeo Oki ,  Naohiro Hirose ,  Kouta Noda

IPC: C23C18/40 ,  B05D1/18

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.

Abstract translation: 本发明涉及一种制造多层印刷电路板的方法，该印刷电路板能够同时通孔填充和形成导体电路和具有良好结晶度的通孔，并且可以在基板和高密度布线上构造均匀的沉积 并且可以实现高可靠性的导体连接而不退火。

公开(公告)号：US20100044079A1

公开(公告)日：2010-02-25

申请号：US12608315

申请日：2009-10-29

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H05K1/00 ,  C25D5/02 ,  C25F3/02 ,  B05D5/12

CPC classification number: C25D5/022 ,  C25D5/54 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/07 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/0557 ,  H05K2203/1168 ,  H05K2203/1492

Abstract: Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

公开(公告)号：US20100009179A1

公开(公告)日：2010-01-14

申请号：US12558049

申请日：2009-09-11

Applicant: Takahiro MATSUMOTO ,  Toshiaki Yamada ,  Hirotaka Tsuruya

Inventor： Takahiro MATSUMOTO ,  Toshiaki Yamada ,  Hirotaka Tsuruya

IPC: B32B33/00 ,  B32B5/22 ,  B32B27/04

CPC classification number: H05K1/162 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/40 ,  C04B35/628 ,  C04B35/62821 ,  C04B2235/3293 ,  C09C1/00 ,  H01B1/08 ,  H01B3/006 ,  H01B3/02 ,  H01B3/10 ,  H01G4/206 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/268 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: There are disclosed insulated ultrafine powder comprising electroconductive ultrafine powder which is in the form of sphere, spheroid or acicular each having a minor axis in the range of 1 to 100 nm and an insulating film applied thereto; a process for producing the same which is capable of covering the surfaces of the insulated ultrafine powder with the insulating film having a thickness in the range of 0.3 to 100 nm without causing any clearance or vacancy; and a resin composite material which uses the same. A high dielectric constant of the material is assured by adding a small amount of insulated ultrafine powder wherein an insulating film is applied to the electroconductive ultrafine powder, while maintaining the processability and moldability that are the characteristics inherent in a resin material.

Abstract translation: 公开了包含导电性超细粉末的绝缘超细粉末，其为球状，球状或针状，各具有1〜100nm的短轴和施加于其上的绝缘膜; 其制造方法能够利用厚度在0.3〜100nm范围内的绝缘膜覆盖绝缘超细粉末的表面，而不会产生任何间隙或空位; 和使用该树脂复合材料的树脂复合材料。 通过在保持作为树脂材料中固有的特性的加工性和成型性的同时，通过添加少量绝缘超细粉末来确保材料的高介电常数，其中绝缘膜被施加到导电超细粉末。

公开(公告)号：US07609504B2

公开(公告)日：2009-10-27

申请号：US11358087

申请日：2006-02-22

Applicant: Eun Tae Park ,  Jeong Joo Kim ,  Hee Young Lee ,  Eun Sub Lim ,  Jong Chul Lee ,  Yul Kyo Chung

Inventor： Eun Tae Park ,  Jeong Joo Kim ,  Hee Young Lee ,  Eun Sub Lim ,  Jong Chul Lee ,  Yul Kyo Chung

IPC: H01G4/06

CPC classification number: H05K1/162 ,  H01G4/206 ,  H05K2201/0209 ,  H05K2201/0215

Abstract: The invention relates to a high-dielectric constant metal/ceramic/polymer composite material and a method for producing an embedded capacitor.As ceramic particles having a relatively small size are bound to the surface of metal particles having a relatively large size by mixing, the occurrence of percolation can be prevented without coating the metal particles, and at the same time, the capacitance of an embedded capacitor can be increased. In addition, a process for coating the surface of the metal particles can be omitted, thus contributing to the simplification of the overall preparation procedure.

Abstract translation: 本发明涉及一种高介电常数金属/陶​​瓷/聚合物复合材料及其制造方法。 由于具有较小尺寸的陶瓷颗粒通过混合而结合到具有相对较大尺寸的金属颗粒的表面，可以防止渗透的发生而不涂覆金属颗粒，同时嵌入式电容器的电容可以 增加。 此外，可以省略涂覆金属颗粒的表面的方法，从而有助于简化整个制备过程。

公开(公告)号：US07602614B2

公开(公告)日：2009-10-13

申请号：US10562252

申请日：2004-06-04

Applicant: Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel ,  Stephan Stoeckl

Inventor： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel ,  Stephan Stoeckl

IPC: H05K7/00

CPC classification number: H05K1/184 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K3/105 ,  H05K3/46 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0919 ,  H05K2201/10446 ,  H05K2203/102 ,  H05K2203/108 ,  H05K2203/1131 ,  H05K2203/1136

Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

Abstract translation: 公开了电子模块及其制造方法。 在一个实施例中，电子模块具有布置在接线块上的多个部件。 布线块具有多个外侧，并且其体积线将外侧的接触焊盘互连。 接触垫电连接到部件的部件连接。

公开(公告)号：US07568610B2

公开(公告)日：2009-08-04

申请号：US11157921

申请日：2005-06-22

Applicant: Tadahiko Sakai ,  Tadashi Maeda

Inventor： Tadahiko Sakai ,  Tadashi Maeda

IPC: B23K31/02 ,  B23K31/00

CPC classification number: H05K3/3436 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1182 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2224/29499 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/758 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/035 ,  H05K2203/0338 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

Abstract: A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal powder (16) of good wettability to solder so as to cause metal powder (16) to penetrate oxide films (7a) and embed in the surfaces on the bottom parts of bumps (7), and bumps (7) in this state are positioned and mounted to electrodes (12a) on substrate (12). Substrate (12) is then heated to melt bumps (7) and allow the melted solder to flow and spread along the surfaces of metal powder (16) toward electrodes (12a). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.

Abstract translation: 一种将在其上形成有焊料凸块（7）的电子部件（6）焊接到基板（12）上的方法，其中凸块（7）被压在其上形成有由金属粉末的焊剂（10）形成薄膜的焊剂转移台 （16）对焊料具有良好的润湿性，以使金属粉末（16）穿透氧化膜（7a）并嵌入在凸块（7）的底部的表面上，并且在该状态下的凸块（7）被定位，并且 安装在基板（12）上的电极（12a）上。 然后将基板（12）加热熔融凸块（7），并允许熔化的焊料沿着金属粉末（16）的表面向电极（12a）流动并扩散。 因此，该方法可以提供高质量的焊接部分，而没有任何焊接缺陷和绝缘性能的劣化。