公开(公告)号：US4992144A

公开(公告)日：1991-02-12

申请号：US413309

申请日：1989-09-27

Applicant: Daniel P. Walsh ,  Philip D. Knudsen

Inventor： Daniel P. Walsh ,  Philip D. Knudsen

IPC: C23C18/22 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38

CPC classification number: H05K3/381 ,  C23C18/22 ,  H05K3/181 ,  H05K3/38 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022

Abstract: Both surfaces of a polyimide sheet are coated with a layer of electroless nickel or cobalt and can also be coated with a thin electroless copper layer on the Ni. or Co. This tenaciously bonded coating is subsequently treated in such a way so as to increase its permeability or porosity without substantially altering its resistive properties. The induced porosity allows water and other volatiles trapped in the dielectric polyimide sheet to be removed while the preserved electrical continuity of the metal layer is sufficient to support electrolytic copper plating which serves the dual purpose of providing a copper thickness useful for the subsequent production of electronic circuitry and preventing the readsorption of water into the dielectric core by permanently sealing or coating the porous metal layer.

Abstract translation: 聚酰亚胺薄片的两个表面涂覆有一层无电镍或钴，并且还可以在Ni上涂覆薄的无电镀铜层。 或Co.这种顽固粘合的涂层随后以这样的方式进行处理，以增加其渗透性或孔隙率，而基本上不改变其电阻性质。 诱导的孔隙率允许除去电介质聚酰亚胺片中捕获的水和其它挥发物，同时金属层的保持的电连续性足以支持电解铜电镀，其用于提供用于随后生产电子的铜厚度的双重目的 电路并且通过永久地密封或涂覆多孔金属层来防止水再次吸收到介质芯中。

公开(公告)号：US4285991A

公开(公告)日：1981-08-25

申请号：US150174

申请日：1980-05-15

Applicant: Klaus Gedrat ,  Hans-Jurgen Ehrich ,  Hartmut Mahlkow ,  Joachim Wolff

Inventor： Klaus Gedrat ,  Hans-Jurgen Ehrich ,  Hartmut Mahlkow ,  Joachim Wolff

IPC: H05K3/46 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/42 ,  B05D5/12 ,  C23F1/02

CPC classification number: H05K3/244 ,  H05K3/062 ,  H05K3/422 ,  H05K3/427 ,  H05K2201/0341 ,  H05K2201/0344 ,  H05K2201/09736 ,  H05K2203/0571 ,  H05K2203/1407 ,  H05K3/243 ,  H05K3/28 ,  Y10T29/49165

Abstract: A method for producing printed circuits. An epoxy resin reinforced with glass fiber is used as basis material, coated with copper, drilled and activated. In one embodiment, the circuit diagram is applied after covering the non-desired regions with a resistance, by screen or photo printing. A nickel, cobalt, or nickel-cobalt layer is deposited onto the circuit, the circuit is covered with a solder prevention lacquer, then the eyes and bore holes are covered with copper. Alternatively, after pre-treatment and activation, all areas except the soldering eyes and bore holes are covered with resist, a nickel, cobalt or nickel-cobalt layer is applied, the circuit diagram is printed using a resist, and the eyes and bore hole are treated as above.

Abstract translation: 一种印刷电路的制造方法。 用玻璃纤维增​​强的环氧树脂用作基材，涂铜，钻孔和活化。 在一个实施例中，电路图在通过屏幕或照片打印覆盖不需要的区域之后被施加。 镍，钴或镍钴层沉积在电路上，电路用防焊漆覆盖，眼睛和钻孔被铜覆盖。 或者，在预处理和激活之后，除了焊接眼和钻孔之外的所有区域都被抗蚀剂覆盖，施加镍，钴或镍钴层，电路图使用抗蚀剂印刷，眼睛和钻孔 被视为如上。

公开(公告)号：US3984598A

公开(公告)日：1976-10-05

申请号：US440915

申请日：1974-02-08

Applicant: Richard G. Sarazin ,  Alan D. Wilks

Inventor： Richard G. Sarazin ,  Alan D. Wilks

IPC: B32B15/08 ,  B44C1/14 ,  C25D1/04 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38 ,  C25D5/56 ,  C25D5/00

CPC classification number: C25D1/04 ,  B32B15/08 ,  B44C1/14 ,  H05K3/025 ,  H05K2201/0162 ,  H05K2201/0344 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0726 ,  H05K3/181 ,  H05K3/389 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/265 ,  Y10T428/31529 ,  Y10T428/31678

Abstract: Metal-clad laminates in which the metal coating of the laminate is only from about 1 micron to about 20 microns in thickness are prepared by depositing a copper coating on a substrate which has been treated with a release agent, treating the upper side of the metal layer to improve the adhesive properties of the metal, thereafter bonding the metal coating to a laminate and removing the substrate to thus prepare the desired metal-clad laminate.

Abstract translation: 通过在已经用脱模剂处理的基底上沉积铜涂层来制备层压体的金属涂层的厚度仅为约1微米至约20微米的金属覆层层压板，处理金属的上侧 层，以改善金属的粘合性能，然后将金属涂层粘合到层压体上并除去基材，从而制备所需的覆金属层压板。

公开(公告)号：US3753816A

公开(公告)日：1973-08-21

申请号：US3753816D

申请日：1971-11-18

Applicant: RCA CORP

Inventor： FELDSTEIN N ,  LAW H

IPC: C23C18/18 ,  G03F1/72 ,  H05K1/03 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/22 ,  C23F1/02 ,  C23F17/00

CPC classification number: G03F1/72 ,  C23C18/1605 ,  H05K1/0306 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/225 ,  H05K2201/0344 ,  H05K2203/0542 ,  H05K2203/072 ,  Y10T29/49156 ,  Y10T29/49746

Abstract: The method comprises depositing a thin layer of a first metal having a relatively high degree of solubility in a particular etchant over both plated areas (if a previously deposited pattern is being repaired) and unplated areas on a substrate, this first metal being catalytic to electroless deposition of a second metal to be subsequently deposited, electrolessly depositing on the first metal either an overall pattern of areas of a second metal which has a relatively low degree of solubility in the etchant or a pattern limited to parts of a previously deposited pattern that were missing or incompletely formed, and then treating the plated areas with the etchant, where desired, so that the first metal is removed where it is not covered by the second metal but the second metal is substantially unaffected.

Abstract translation: 该方法包括在两个镀覆区域（如果先前沉积的图案被修复）和在基底上未镀覆的区域上沉积具有相对较高溶解度的第一金属薄层，该第一金属在特定的蚀刻剂上催化以无电化 沉积待随后沉积的第二金属，在第一金属上无电沉积第二金属的整体图案，其在蚀刻剂中具有相对较低溶解度的第二金属的区域或限于先前沉积图案的部分的图案， 丢失或不完全形成，然后在需要时用蚀刻剂处理镀覆区域，使得第一金属在不被第二金属覆盖但第二金属基本上不受影响的情况下被去除。

公开(公告)号：US3377259A

公开(公告)日：1968-04-09

申请号：US43966965

申请日：1965-03-15

Applicant: GEN DYNAMICS CORP

Inventor： EUGENE PHILLIPS

IPC: C25D5/56 ,  H01B1/00 ,  H01P11/00 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38

CPC classification number: H05K3/384 ,  C25D5/56 ,  H01B1/00 ,  H01P11/00 ,  H05K1/032 ,  H05K3/181 ,  H05K2201/0158 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10S205/927 ,  Y10S428/934 ,  Y10S428/935 ,  Y10S428/936 ,  Y10S428/941 ,  Y10T428/12486 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12778 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/12986 ,  Y10T428/31692

公开(公告)号：US2699425A

公开(公告)日：1955-01-11

申请号：US29728552

申请日：1952-07-05

Applicant: MOTOROLA INC

Inventor： TEMPLE NIETER

IPC: H05K3/10 ,  H05K3/18 ,  H05K3/28 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K3/3489 ,  H05K3/108 ,  H05K3/181 ,  H05K3/282 ,  H05K3/426 ,  H05K2201/0344 ,  H05K2203/075 ,  Y10T29/49155

公开(公告)号：US2699424A

公开(公告)日：1955-01-11

申请号：US12016549

申请日：1949-10-07

Applicant: MOTOROLA INC

Inventor： TEMPLE NIETER

IPC: H05K3/10 ,  H05K3/18 ,  H05K3/42

CPC classification number: H05K3/108 ,  H05K3/188 ,  H05K3/426 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/1142

公开(公告)号：US20240206062A1

公开(公告)日：2024-06-20

申请号：US18565613

申请日：2022-06-27

Applicant: Lotte Energy Materials Corporation

Inventor： Chang Yol YANG ,  Won Jin BEOM ,  Hyung Cheol KIM ,  Kideok SONG

IPC: H05K1/09 ,  H05K3/06

CPC classification number: H05K1/09 ,  H05K3/062 ,  H05K2201/0338 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2203/0323 ,  H05K2203/0353 ,  H05K2203/0384

Abstract: Disclosed are an ultra-thin copper foil with a carrier foil and a method for manufacturing an embedded substrate by using the same, the ultra-thin copper foil with a carrier foil including: a carrier foil; a non-etching release layer on the carrier foil; a first ultra-thin copper foil layer on the non-etching release layer; an etch stop layer on the first ultra-thin copper foil layer; and a second ultra-thin copper foil layer on the etch stop layer.

公开(公告)号：US20240114630A1

公开(公告)日：2024-04-04

申请号：US18479767

申请日：2023-10-02

Applicant: Meta Platforms Technologies, LLC

Inventor： Cameron Elliot Glasscock ,  Zhenzhen Shen ,  Felippe Jose Pavinatto ,  Omar Awartani ,  Allison Tuuri ,  Lichuan Chen ,  Aleksey Reiderman ,  Marcos Antonio Santana Andrade, JR.

IPC: H05K3/32 ,  H05K1/02 ,  H05K3/18

CPC classification number: H05K3/326 ,  H05K1/0272 ,  H05K1/028 ,  H05K1/0289 ,  H05K3/181 ,  H05K2201/0344

Abstract: The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.

公开(公告)号：US20170303401A1

公开(公告)日：2017-10-19

申请号：US15609047

申请日：2017-05-31

Applicant: HSIO Technologies, LLC

Inventor： James J. Rathburn

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  H05K1/16

CPC classification number: H05K1/181 ,  B33Y80/00 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/0221 ,  H05K1/0256 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/118 ,  H05K1/16 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/246 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4664 ,  H05K3/4694 ,  H05K2201/0344 ,  H05K2201/0367 ,  H05K2201/09109 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y10T29/49155

Abstract: A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive material to form first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A plating resist is applied. A conductive material is electro-plated to the first conductive structure to substantially fill the first recesses, and the plating resist is removed.