公开(公告)号：US20100326714A1

公开(公告)日：2010-12-30

申请号：US12817562

申请日：2010-06-17

Applicant: Kenji FUKUZONO

Inventor： Kenji FUKUZONO

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/0271 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/562 ,  H01L2224/73204 ,  H01L2924/01019 ,  H05K1/181 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10416 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/063 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49139

Abstract: A printed circuit board include: a printed circuit board main body having a mounting area on a first surface of the printed circuit board main body and a recess being provided at a recess area on a second surface that is a back side of the first surface of the printed circuit board main body, the electronic component being mounted on the mounting area, the recess area being provided to correspond to the mounting area; and a thermal expansion control element being placed in the recess and having a smaller thermal expansion coefficient than the printed circuit board main body.

Abstract translation: 印刷电路板包括：印刷电路板主体，其具有位于印刷电路板主体的第一表面上的安装区域;以及凹部，设置在作为第一表面的第一表面的第二表面的第二表面的凹部 所述印刷电路板主体，所述电子部件安装在所述安装区域上，所述凹部区域设置成对应于所述安装区域; 并且热膨胀控制元件放置在凹部中并且具有比印刷电路板主体更小的热膨胀系数。

公开(公告)号：US20100269334A1

公开(公告)日：2010-10-28

申请号：US12830774

申请日：2010-07-06

Applicant: Michael J. Domitrovits ,  Edward J. Donnelly ,  Raymond F. Frizzell, JR.

Inventor： Michael J. Domitrovits ,  Edward J. Donnelly ,  Raymond F. Frizzell, JR.

IPC: H05K3/34

CPC classification number: H05K1/0271 ,  H01R12/716 ,  H01R12/721 ,  H05K3/341 ,  H05K3/3421 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.

Abstract translation: 公开了电子部件，电子部件和电子载体基板的组件以及将电子部件连接到载体基板的方法。 载体衬底具有第一热膨胀系数（CTE），并且电子部件具有第二CTE。 组件还包括在载体基板上的用于将电子部件连接到载体基板的导电材料，并且电气部件通过加热连接到载体基板，然后冷却该导电材料。 电子部件包括膨胀接头，以在导电材料的加热和冷却期间允许电子部件相对于载体基板膨胀和收缩。

公开(公告)号：US20100260988A1

公开(公告)日：2010-10-14

申请号：US11990179

申请日：2006-06-02

Applicant: Jürgen Schulz-Harder

Inventor： Jürgen Schulz-Harder

IPC: C04B37/02 ,  B32B18/00 ,  B32B15/04 ,  B32B7/02 ,  C04B35/622 ,  C04B37/00

CPC classification number: H05K1/0306 ,  C04B37/021 ,  C04B37/025 ,  C04B37/026 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/062 ,  C04B2237/064 ,  C04B2237/124 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/58 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K3/38 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/068 ,  Y10T428/2495 ,  Y10T428/26 ,  Y10T428/265 ,  Y10T428/266 ,  C04B41/4535 ,  C04B41/5037 ,  C04B41/5024 ,  C04B41/522 ,  C04B41/4501 ,  C04B41/5127 ,  C04B35/584 ,  H01L2924/00

Abstract: In the case of a metal-ceramic substrate with a multilayered ceramic material in sheet form, and with at least one metallization that is provided on one surface side of the ceramic material and is joined to be ceramic material by direct bonding or active soldering, the ceramic material has at least one inner layer or base layer of a silicon nitride ceramic. The surface side of the ceramic material that is provided with the at least one metallization is formed by an intermediate layer of an oxidic ceramic applied to the base layer.

Abstract translation: 在具有片状多层陶瓷材料的金属陶瓷基板的情况下，并且在陶瓷材料的一个表面侧具有至少一个金属化，并且通过直接接合或主动焊接而与陶瓷材料接合， 陶瓷材料具有至少一个氮化硅陶瓷的内层或基层。 设置有至少一个金属化的陶瓷材料的表面侧由施加到基底层的氧化陶瓷的中间层形成。

公开(公告)号：US20100258938A1

公开(公告)日：2010-10-14

申请号：US12742926

申请日：2007-12-05

Applicant: Teppei Ito ,  Hitoshi Kawaguchi ,  Hiroyuki Tanaka

Inventor： Teppei Ito ,  Hitoshi Kawaguchi ,  Hiroyuki Tanaka

IPC: H01L23/498 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0224 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2201/09236 ,  H05K2201/09681 ,  H05K2201/09709 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A substrate (3) has a build-up layer in which insulating layers containing a resin and conductor interconnect layers (312) are alternately laminated and the conductor interconnect layers (312) are mutually connected through the conductor layer formed in a via-hole of the insulating layer. A conductor interconnect layer (312D) arranged on the outermost surface side of a substrate among the conductor interconnect layers (312) has a plurality of signal lines (312D1) formed in a signal line arrangement area (A) and extended in a predetermined direction. When αsig-x represents a coefficient of thermal expansion in a direction substantially parallel to the signal lines (312D1) in the signal line arrangement area (A) having the signal lines (312D1) as determined by a laser speckle method and αsig-y represents a coefficient of thermal expansion in a direction substantially orthogonal to the signal lines as determined by a laser speckle method, a dependence rate in the signal line direction of a coefficient of thermal expansion represented by the following equation is 25 or less. Dependence rate in the signal line direction of the coefficient of thermal expansion=(|αsig-y−αsig-x|/αsig-x)×100.

Abstract translation: 基板（3）具有积层层，其中包含树脂和导体互连层（312）的绝缘层交替层叠，并且导体互连层（312）通过形成在通孔中的导体层相互连接 绝缘层。 布置在导体互连层（312）中的基板的最外表面侧的导体互连层（312D）具有形成在信号线布置区域（A）中并沿预定方向延伸的多条信号线（312D1）。 当αsig-x表示与通过激光散斑法确定的具有信号线（312D1）的信号线配置区域（A）中的信号线（312D1）基本平行的方向的热膨胀系数，αsig-y表示 通过激光散斑法确定的与信号线基本正交的方向的热膨胀系数，由下式表示的热膨胀系数的信号线方向的相关率为25以下。 热膨胀系数的信号线方向的依赖率=（|αsig-y-αsig-x | /αsig-x）×100。

公开(公告)号：US20100197478A1

公开(公告)日：2010-08-05

申请号：US12669839

申请日：2008-07-18

Applicant: Toshiyuki Suzuki ,  Yasuharu Miyauchi ,  Isao Kanada

Inventor： Toshiyuki Suzuki ,  Yasuharu Miyauchi ,  Isao Kanada

IPC: C04B35/04

CPC classification number: H05K1/0306 ,  C04B35/20 ,  C04B35/6262 ,  C04B35/62655 ,  C04B2235/3203 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3409 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2235/77 ,  C04B2235/96 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2201/068 ,  H01L2924/00

Abstract: A ceramic substrate is provided as one having a large coefficient of thermal expansion α, having properties suitable for use as a high-frequency substrate, being capable of being fired at a low temperature, and having an excellent substrate strength. The ceramic substrate has a main composition containing Mg2SiO4 and a low-temperature-fired component, has the coefficient of thermal expansion α of not less than 9.0 ppm/° C., and contains up to 25 vol. % (excluding zero) ZnAl2O4 or up to 7 vol. % (excluding zero) Al2O3.A dielectric-porcelain composition is provided as one being capable of being fired at a temperature lower than a melting point of an Ag-based metal and being capable of demonstrating a sufficient bending strength even through firing at a low firing temperature. The dielectric-porcelain composition contains Mg2SiO4 as a major component and contains a zinc oxide, a boron oxide, an alkaline earth metal oxide, a copper compound, and a lithium compound as minor components.

Abstract translation: 提供陶瓷基板作为具有大的热膨胀系数α的材料，具有适合用作高频基板的性能，能够在低温下烧制并且具有优异的基板强度。 陶瓷基板具有含有Mg 2 SiO 4和低温烧成分的主要成分，其热膨胀系数α为9.0ppm /℃以上，含有25体积％以下。 ％（不包括零）ZnAl2O4或高达7体积％ ％（不包括零）Al2O3。 提供了一种电介质瓷组合物，其能够在低于Ag系金属的熔点的温度下被烧制，并且即使在低烧成温度下也能够显示出足够的弯曲强度。 介电瓷组合物含有Mg2SiO4作为主要成分，并含有氧化锌，氧化硼，碱土金属氧化物，铜化合物和作为次要成分的锂化合物。

公开(公告)号：US20100187006A1

公开(公告)日：2010-07-29

申请号：US12694702

申请日：2010-01-27

Applicant: Lex Kosowsky ,  Bhret Graydon ,  Djabbar Moustafaev ,  Shurui Shang ,  Robert Fleming

Inventor： Lex Kosowsky ,  Bhret Graydon ,  Djabbar Moustafaev ,  Shurui Shang ,  Robert Fleming

IPC: H05K9/00 ,  G06F17/50 ,  B05D5/12

CPC classification number: H05K1/0259 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/068 ,  H05K2201/0738 ,  H05K2201/09136 ,  Y10T428/24917 ,  Y10T428/24942

Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.

Abstract translation: 各种方面提供将VSDM结合到基底中以产生受ESD保护的基底。 在一些情况下，以导致ESD保护的衬底满足用于各种后续处理或应用的一个或多个规格（例如，厚度，平面度等）的方式结合VSDM。 各种方面提供了设计包含VSDM的衬底（例如，PCB），以及调整衬底的一个或多个方面以设计平衡的，受ESD保护的衬底。 某些实施方案包括将具有VSDM层的基底模制成第一形状。

公开(公告)号：US07692307B2

公开(公告)日：2010-04-06

申请号：US11636250

申请日：2006-12-08

Applicant: Sudarshan Rangaraj ,  Shankar Ganapathysubramanian ,  Richard Harries ,  Mitul Modi ,  Sankara J. Subramanian

Inventor： Sudarshan Rangaraj ,  Shankar Ganapathysubramanian ,  Richard Harries ,  Mitul Modi ,  Sankara J. Subramanian

IPC: H01L23/48

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/068 ,  Y10T29/49158 ,  H01L2924/00

Abstract: A compliant structure for an electronic device comprises a substrate (110) composed of a first material (111) and a compliant zone (120) within the substrate. A plurality of solder joints (280) are located between, and form a connection between, the substrate and the electronic device (290). The compliant zone reduces the degree of deformation experienced by the solder joints due to thermal mismatch loading between the substrate and the die during attachment of the die to the substrate (chip attach). This reduction in solder joint deformation reduces the likelihood that the solder joints will crack.

Abstract translation: 用于电子设备的柔性结构包括由衬底内的第一材料（111）和柔性区（120）组成的衬底（110）。 多个焊接接头（280）位于衬底和电子器件（290）之间，并形成衬底和电子器件（290）之间的连接。 柔性区域在将管芯附着到衬底（芯片连接）期间由于衬底和裸片之间的热失配加载而减小焊点所经历的变形程度。 焊点变形的这种减少降低了焊点会破裂的可能性。

公开(公告)号：US07691961B2

公开(公告)日：2010-04-06

申请号：US11513353

申请日：2006-08-31

Applicant: Kan Fujihara ,  Kazuhiro Ono ,  Takaaki Matsuwaki

Inventor： Kan Fujihara ,  Kazuhiro Ono ,  Takaaki Matsuwaki

IPC: C08G73/10

CPC classification number: B32B15/08 ,  B29C55/143 ,  B29D7/01 ,  B29K2079/08 ,  B32B27/281 ,  B32B27/34 ,  B32B2038/0088 ,  B32B2307/514 ,  B32B2309/02 ,  C08J5/18 ,  C08J2379/08 ,  H05K1/0271 ,  H05K1/0346 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2203/1545 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A polyimide film in which the dimensional change is reduced when it has undergone a step of laminating a metal on the polyimide film or a step of etching the metal layer to form wiring, and the rate of dimensional change can be stabilized across the entire width is provided. The object can be solved by a polyimide film produced by a continuous process, wherein when a coefficient of linear expansion a in a direction of the molecular orientation axis and a coefficient of linear expansion b in a direction perpendicular to the molecular orientation axis are measured in the temperature range of 100° C. to 200° C., a and b satisfy a particular relationship across the entire width, or a polyimide film produced by a continuous process, wherein when a tear propagation resistance c in the direction of the molecular orientation axis and a tear propagation resistance d in the direction perpendicular to the molecular orientation axis are measured, c and d satisfy a particular relationship across the entire width.

Abstract translation: 在聚酰亚胺膜上进行金属层叠工序的步骤中，尺寸变化减小的聚酰亚胺膜或蚀刻金属层而形成配线的工序，能够使整个宽度的尺寸变化率稳定化 提供。 该目的可以通过由连续方法制造的聚酰亚胺膜来解决，其中当在分子取向轴的方向上的线性膨胀系数a和与分子取向轴垂直的方向上的线性膨胀系数b测量在 100℃至200℃的温度范围，a和b满足整个宽度的特定关系，或通过连续方法制备的聚酰亚胺膜，其中当分子取向方向上的抗撕裂传播阻力c 轴和在与分子取向轴垂直的方向上的撕裂传播阻力d，c和d在整个宽度上满足特定的关系。

公开(公告)号：US07682691B2

公开(公告)日：2010-03-23

申请号：US10503490

申请日：2003-02-04

Applicant: Kazunori Akaho ,  Koji Yonezawa ,  Motohiro Yagi ,  Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

Inventor： Kazunori Akaho ,  Koji Yonezawa ,  Motohiro Yagi ,  Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

IPC: B32B27/20 ,  B32B27/18 ,  C08K3/34

CPC classification number: C08K3/346 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/269

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. The resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of a layered silicate inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17×10−3 [° C.−1 ] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

Abstract translation: 提供树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷板，预浸料和粘合片，其具有改进的机械性能，尺寸稳定性，耐热性和阻燃性， 特别是高温物理性能。 含有100重量份热固性树脂和0.1-65重量份层状硅酸盐无机化合物的树脂组合物，该树脂组合物的平均线性膨胀系数（α2）高达17×10-3 [℃ -1]在比树脂组合物的玻璃化转变温度高10℃的温度范围内，高于树脂组合物的玻璃化转变温度50℃。

公开(公告)号：US20100051323A1

公开(公告)日：2010-03-04

申请号：US12487920

申请日：2009-06-19

Applicant: Kishio Yokouchi

Inventor： Kishio Yokouchi

IPC: H05K1/09 ,  H05K1/00

CPC classification number: H05K1/09 ,  B82Y10/00 ,  H05K3/4602 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/068

Abstract: A printed wiring board with an insulating layer formed of an insulating material and a conductive wiring layer formed on a front surface of the insulating layer. The conductive wiring layer has a conductor and a filler. The filler is embedded in the conductor. The filler has a coefficient of thermal expansion smaller than the conductor.

Abstract translation: 一种印刷电路板，其具有由绝缘材料形成的绝缘层和形成在所述绝缘层的前表面上的导电布线层。 导电布线层具有导体和填料。 填料嵌入导体中。 填料的热膨胀系数小于导体。